45X45 MM BGA Search Results

plastic ul94v0

Abstract: 45x45 bga 45x45 mm bga 6063
Contextual Info: Model Name : MBA45001-15W/2.6 BGA Heat Sink For 45x45 Chip set MBA45001-15W/2.6 Specification: 1.Material: Heat Sink : Aluminum 6063 Clip : Plastic UL94-V0 2.Heat Sink Dimension : 44.6*44.6*14.6 mm height (with base) Base : 2.6mm, Fin height : 12mm 3.Weight: 31.2 gm

45x45 bga

Abstract: 45x45 mm bga
Contextual Info: 480 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A F K L φM φP M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of

45x45 bga

Contextual Info: 672 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A K L φM φP F M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of

tray datasheet bga

Abstract: 4545
Contextual Info: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

socket 1155

Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294
Contextual Info: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:

11 AK 30 S-2

Abstract: 45x45 mm bga
Contextual Info: 580 PIN PLASTIC BGA 45x45 A B B A 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 C D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B Index area J H G S detail of A part A K L

BGA 11x11 junction to board thermal resistance

Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]

EA-190-H125-T710

Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
Contextual Info: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow

strapack s-669

Abstract: strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1
Contextual Info: 1999年 1 月 ver. 4 イントロダク ション Application Note 71 現在表面実装用のJリード・パッケージ、クワッド・フラット・パック （QFP）パッケージ、およびFineLine BGATMを含むボール・グリッド・ア

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

456-BGA

Abstract: 45x45 bga 8kx1 RAM LB 156 15G04K100 15G04K200 25G01K100 25G02K100
Contextual Info: Programmable Serial Interface High Speed Devices PRELIMINARY Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps–1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path

45x45 bga

Abstract: 15G04K100 15G04K200 25G01K100 25G02K100
Contextual Info: Programmable Serial Interface PRELIMINARY High Speed Devices Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps – 1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path

Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

HTD12

Abstract: 45x45 bga CBD62 cba8 373 ic HTD24 application of microprocessor in aircrafts 6-pin plastic A6 tray 45x45 CBD43
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT
PD98410 1.2G ATM SWITCH LSI DESCRIPTION The
PD98410 NEASCOT-X10TM is an LSI integrating ATM switch functions on a single chip. It has four UTOPIA level2 interfaces and can switch 24
24 circuits by using a multi-PHY connection. This LSI also realizes a switching

micro sd verilog MODEL

Abstract: "Single-Port RAM"
Contextual Info: Programmable Serial Interface Frequency Agile Devices PRELIMINARY Programmable Bandwidth Features • • • • • • • • • • • • • • • • • High-Speed (HS) or Frequency Agile (FA) Programmable Serial Interface (PSI) versions available

EPF20K

Abstract: ep20k200 PINOUT ep20k apex board EPF20K100
Contextual Info: APEX 20K Programmable Logic Device Family February 1999. ver. 1 Features. Data Sheet Industry's first programmable logic device PLD incorporating System-on-a-Programmable-Chip (SOPC) integration MultiCore™ architecture integrating look-up table (LUT) logic,