3DFP Search Results

Contextual Info: MEMORY MODULE DDR3 SDRam 128Mx32-BGA 3D3D4G32YB2495 DDR3 Synchronous Dynamic Ram 4Gbit DDR3 SDRam organized as 128Mx32 Pin Assignment Top View BGA 136 (Pitch : 0.80 mm) Main applications: •     Embedded Systems Workstations Servers Super Computers

Contextual Info: Hi-Rel Latch-Up Current Limiter LCL High Input Voltage Range, 2A Output Current Radiation Hardened Design Features • Protection device to power sensitive load with automatic disconnection in case of over-current • Large input voltage range : 0.8V to 5.5V

Contextual Info: MEMORY MODULE DDR SDRam 64Mx16-SOP Double Data Rate SDRam MODULE 3D 1D1G16TS1267 1Gbit DDR SDRam organized as 64Mx16 Pin Assignment Top View SOP 66 (Pitch : 0.65 mm) Features • • • • • • • • • • • • • • • • One 1Gbit DDR SDRam

Contextual Info: MEMORY MODULE DDR2 SDRam 128Mx72-BGA 3D2D8G72UB3369 DDR2 Synchronous Dynamic Ram 8Gbit DDR2 SDRam organized as 128Mx72, based on 128Mx16 MODULE Pin Assignment Top View BGA 208 - (11x19 - Pitch 1.00mm) (TOP VIEW - VIEWED BY TRANSPARENCY) 11 10 9 8 7 6 5 4

Contextual Info: MEMORY MODULE NAND Flash 512Gb 3DFN512G08VB2453 NAND Flash Memory 512Gbit Synchronous NAND Flash Pin Assignment Top View BGA 100 Features - Open NAND Flash interface 2.1 compliant - Single Level Cell (SLC) technology - Organization (per basic component):

3D2D4G72UB3478

Contextual Info: MEMORY MODULE DDR2 SDRam 64Mx72-BGA DDR2 SDRAM MODULE 3D 2D4G72UB3478 4Gbit DDR2 SDRam organized as 64Mx72, based on 64Mx16 Pin Assignment BGA 191 - 12x20 - Pitch 1.27mm Features • Organized as 64Mx72  Core supply voltage 1.8V +/- 0.1V  I/O supply voltage 1.8V +/- 0.1V

3DPM0024-3-SS

Abstract: MARKING 3D regulator 5V
Contextual Info: Hi-Rel Point-Of-Load DC/DC Converter 5V Input, 1.22V to 4V Single Output Radiation Hardened Design Features • • • • • • • • • • • • • • • • • • 3DPM0024-3-XX Input Voltage: 5V ± 5% Output Voltage adjustable from 1.225V to 4V

Contextual Info: MEMORY MODULE MRAM 128Kx16-SOP 3DMR2M16VS2427 Magnetoresistive Ram MODULE 2 Mbit MRAM organized as 128Kx16 Pin Assignment Top View SOP 54 (Pitch : 0.80 mm) Features - Organized as 128Kx16. - Single +3.3V +/-0.3V power supply operation. - Symetrical high-speed read and write fast access

OTB-400-1

Contextual Info: MEMORY MODULE SDRam 64Mx48-SOP 3DSD2G64VB4488 Synchronous Dynamic Ram MODULE 2Gbit SDRAM organized as 32Mx64, based on 32Mx16 Pin Assignment Top View BGA 119 (8x15 - Pitch : 1.27mm) Features - Stack of four 512Mbit SDRam. - Organized as 32Mx64bit. - Single +3.3V power supply.

3DFN128G08VB2352

Contextual Info: MEMORY MODULE FLASH Nand 128Gb Flash Nand Memory MODULE 3DFN128G08VB2352 128Gbit Flash Nand with 8 bit-data access Pin Assignment Top View LGA 52 Features - Open NAND Flash interface 2.2 compliant - Multilevel Cell Technology (MLC) - Device width: x8 - Operating voltage range

Contextual Info: MEMORY MODULE MRAM 128Kx8-SOP 3DMR1M08VS1426 Magnetoresistive Ram MODULE 1 Mbit MRAM organized as 128Kx8 Pin Assignment Top View SOP 44 (Pitch : 0.80 mm) Features - Organized as 128Kx8. - Single +3.3V +/-0.3V power supply operation. - Symetrical high-speed read and write fast access

Contextual Info: MEMORY MODULE FLASH Nand 1Gx8-SOP Flash Memory MODULE 3DFN4G08VS1636 8Gbit Flash Nand organized as 1Gx8, based on 512Mx8 Pin Assignment Top View SOP 50 (Pitch : 0.50 mm) – Package D1 Features - Organization -Memory Cell Array (512M+16.384KM)bitx8. - Automatic Program and Erase

Contextual Info: MEMORY MODULE FLASH Nand 256Gb Flash Nand Memory MODULE 3DFN256G08VB2406 256Gbit Flash Nand with 8 bit-data access Pin Assignment Top View LGA 52 Features - Open NAND Flash interface 2.1 compliant - Single Level Cell (SLC) technology - Device width : x8

3d plus memory

Contextual Info: MEMORY MODULE NAND Flash 64Gb 3DFN64G08VB1454 NAND Flash Memory 64Gbit Synchronous NAND Flash Pin Assignment Top View BGA 100 Features - Open NAND Flash interface 2.2 compliant - Multi Level Cell (MLC) technology - Organization: Page size x8: 8640 bytes

SD1G32VS2490

Contextual Info: MEMORY MODULE SDRam 32Mx32-SOP Synchronous Dynamic Ram MODULE 3D SD1G32VS2490 1Gbit SDRam organized as 32Mx32, based on 32Mx16 Pin Assignment Top View SOP 70 - (Pitch : 0.635 mm) Features - Stack of two 512Mbit SDRam. - Organized as 32Mx32-bit. - Single +3.3V power supply.

3D Plus

Abstract: PQFP64 3D-PLUS F7853 3D Plus sram 3DS16-325 3D plus memory 16 f78532
Contextual Info: PRELIMINARY 16Mbit CMOS SRAM ELECTRONICS 3DS16-325 512K x 32 Bit High-Speed CMOS Static RAM-5.0V Operating FEATURES DESCRIPTION Fast Access Time : 15 or 20ns Single 5.0 ± 0.5V Power Supply Power Dissipation - Standby 80mA - Operating 540mA Max. TTL Compatible Inputs and Outputs

Contextual Info: MEMORY MODULE SDRam 32Mx72-BGA 3D SD2G72VB5489 -pjuspj a HEICO company Synchronous Dynamic Ram MODULE 2Gbit SDRam organized as 32Mx72, based on 32Mx16 Pin Assignment Top View BGA 134 - (9x15 - Pitch : 1.27 mm) (TOP VIEW- VIEWED BY TRANSPARENCY) 9 8 7 6 5

32Mx32

Abstract: 3DFP
Contextual Info: MEMORY MODULE SDRam 64Mx32-SOP a HE ICO company Synchronous Dynamic Ram MODULE 3D SD2G32VS4484 2Gbit SDRam organized as 64Mx32, based on 32Mx16 Pin Assignment Top View SOP 70 - (Pitch : 0.635 mm) Features - Stack of four 512Mbit SDRam. - Organized as 32Mx32-bit.

Contextual Info: LVDS Driver and Receiver MODULE 4 Lines-SOP Low-voltage differential signaling Driver and Receiver MODULE 3DLV3304VS1374 3V Quad Driver and Receiver, based on Quad Pin Assignment Top View SOP 34 (Pitch : 0.65 mm) Features • • • • • • • •

3DLV3108VS1372

Abstract: 20/3DLV3108VS1372
Contextual Info: LVDS Driver MODULE 8 Lines-SOP 3DLV3108VS1372 Low-voltage differential signaling Driver MODULE 3V Eight Line Drivers, based on Quad Pin Assignment Top View SOP 34 (Pitch : 0.65 mm) Features •            >400 Mbps (200 MHz) switching rates

Contextual Info: MEMORY MODULE SRAM 512Kx32-SOP Static Ram MODULE 3D SR16M32CS4261 16 Mbit SRAM organized as 512Kx32, based on 512Kx8 Pin Assignment Top View SOP 64 (Pitch : 0.80 mm) Features - Fast Access Time : 12, 15 or 20ns. - Organized as 512K x 32-bit based on 512K x 8-bit

Contextual Info: MEMORY MODULE SRAM 512Kx40-SOP Static Ram MODULE 3DSR20M40VS6507 20 Mbit SRAM organized as 512Kx40, based on 256Kx16 Pin Assignment Top View SOP 84 (Pitch : 0.508 mm) Features - Fast Access Time : 12ns. - Power Supply 3.3V - Radiation Characteristics: Total Dose: 100Krad(Si)

Contextual Info: Hi-Rel Point-Of-Load DC/DC Converter 5V Input, 1.22V to 4V Single Output Radiation Hardened Design Features •                  3DPM0024-3-XX Input Voltage: 5V ± 5% Output Voltage adjustable from 1.225V to 4V

MARKING 3D regulator

Contextual Info: Hi-Rel Latch-Up Current Limiter LCL High Input Voltage Range, 2A Output Current Radiation Hardened Design Features • Protection device to power sensitive load with automatic disconnection in case of over-current • High Input Voltage: 0.8V to 5.5V • Output Current up to 2A