2D02 Search Results

4D03

Abstract: ROYALOHM 2D02 2D02WGJ royalohm chip resistor royalohm resistor
Contextual Info: ROYALOHM Thick Film Chip Resistor Arrays P erform ance Specification Temperature Coefficient 4D03.4C03, 16P8 <10Q : ±400PPM/°C >100 : ±200PPM/°C 2D02, 4D02, 2C02, 4C02, 10P8 : ±200PPM/°C Short Time Overload + 2.0% + 0.m M ax Insulation Resistance Min. 1,000 Mega Ohm

astron 2.54mm

Contextual Info: REV. — i 2 N o? E= ND. OF POSITION PER R0W x2 .5 4 + 0 .6 6 o o L4'-' 1 DESCRIPTION RELEASE DRAW MODIFY □ATE day D6. 2002 Nav, 11, 2D02 (NO. OF POSITION PER R0W)x. 10 0 + .0 2 6 F =(N 0. OF POSITION PER ROW-1 )x2 .5 4 0 0 00 0 0 0 0 0000 (NO. OF POSITION PER R Q W -l)x .1 0 0

Contextual Info: REV. — DESCRIPTION DATE RELEASE Apr. 15. 2D02 2 E = N D . OF POSITION PER ROW x2.0 0 ± 0 .4 0 (NO. OF POSITION PER R O W )x.079±.01 6 F = (N 0 . OF POSITION PER R O W -l)x 2 .0 0 (NO. OF POSITION PER ROW-1 )x .0 7 9 MATERIALS 1. HOUSING 2. TERMINAL SPECIFICATION

Contextual Info: 4 THIS DRAWING IS UN PUBLISH ED , COPYRIGHT 2002 2 3 RELEASED BY TYCO ELECTRONICS CORPORATION. F O R P U B L IC A T IO N 2D02 LOG ALL RIGHTS RESERVED. DIST / J R EV IS IO N S p LTR DESCRIPTION R D RELEASED A 15, I t 1 DATE F J0 0 - 0 3 6 8 - 0 2 DWN APVD

docking connector

Contextual Info: COPYRIGHT 2D02 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. OCT ,2 0 0 2 . LOC ALL RIGHTS RESERVED. R E V IS IO N S J LTR AS S7 DESCRIPTION REVISED DATE F JB 0—0081 —0 5 DWN A.K Y.Y 27 JA N 0 5 -1 APVD ; AS SHOWN D 8.5 6.12 5.61 5.01 4.51

ONE MEGA OHM RESISTOR

Contextual Info: THICK FILM CHIP RESISTOR ARRAYS • • • • • High density 2, 4, 8 resistors in one small case convex type Improvement of placement efficiency Packaging is suitable for automatic placement machines Superior solderability Scalloped • 2D02 (4Pin 2R)

Contextual Info: REV. — -E ± 0 .4 0 [.0 1 6 ]- DESCRIPTION i R E L EA SE DRAW MODIFY 2 DRAW MODIFY DATE Jan. 03. 2D02 Jun. 19, 2D03 Aug. 13, 2003 E = N 0 . OF POSITION PER R 0 W x2 .5 4 -K ).5 0 (NO. OF POSITION PER ROW)x. 1 0 0 -K 0 2 0 F=(N O . OF POSITION PER ROW-1 ) x 2 .5 4

Contextual Info: REV. — la b b 1 DESCRIPTION RELEASE ADD RN5 DATE Jan. D-3, ZD02 Jun. D3, 2D02 z -6.00 [.2 3 6 ] “ I MATERIALS 1. HOUSING : THERMOPLASTIC UL 9 4 V - 0 , BLACK. 2. TERMINAL : S.Q. 0 .5 0 m m COPPER ALLOY. SPECIFICATION *-|2.<X? [.0 7 9 ] 1. CURRENT RATING : 1 AMP. MAX.

4d03

Contextual Info: THICK FILM CHIP RESISTOR ARRAYS • • • • • High density, 2,4, 8 resistors in one small case convex type Improvement of placement efficiency Packaging is suitable for automatic placement machines Superior solderability. Scalloped • 2D02 (4Pin 2R)

Contextual Info: REV, DESCRIPTION RELEASE — DATE Oct. 31. 2D02 SHELL PLATING MODIFY Jan, 17. 2003 DRAW MODIFY Feb. 114 2003 DRAW MODIFY Apr. 11. 2003 1 i 9 4 DRAW MODIFY AUQ, 02, ZD03 MATERIALS 1. HOUSING ; HI,-TEMP. PLASTIC UL 9 4 V -0 . BLACK. 2. TERMINAL : COPPER ALLOY. GOLD PLATING.

tail light

Contextual Info: Page 1 of 1 24 Volt Programme 6423-02M Reference 6423-02M International category code ECE C5W Lamp application tail light, licens number light Voltage 24 Watt 5 Base SV8,5-8 Standard pack Blisters/lamps 20/40 Card size b x h [cm] 9,7x13,7

P21W

Abstract: ba15s 7511-02M
Contextual Info: Page 1 of 1 24 Volt Programme 7511-02M Reference 7511-02M International category code ECE P21W Lamp application Indicator and stop light, signal lamp Voltage 24 Watt 21 Base BA15s Standard pack Blisters/lamps 20/40 Card size b x h [cm] 9,7x13,7

Contextual Info: REV. — DESCRIPTION RELEASE DATE ilnn. 07. 2D02 i 2 E = ND. OF POSITION PER ROW x2.00±0.40 (NO. OF POSITION PER ROW)x.079±.016 F=(N 0. OF POSITION PER R O W -1 ) x 2.00 (NO. OF POSITION PER ROW-1 )x.079 MATERIALS 1. HOUSING 2. TERMINAL HI.-TEMP. PLASTIC (UL 9 4 V -0 ), BLACK.

Contextual Info: REV. DESCRIPTION DATE RELEASE Dec, IB, 2001 Jan. 2 5 , 2D02 — i P /N MODIFY 2 MATERIALS 1. 2. 3. 4. HOUSING : THERMOPLASTIC UL 9 4 V - 0 . TERMINAL : COPPER ALLOY. ( t= 0 ,3 0 m m ) SHELL : STEEL. GROUNDING BOARDLOCK : BRASS, TIN PLATING. SPECIFICATION

1 MEGA OHM RESISTOR

Abstract: WA1 marking 4d03 royal ohm chip resistor 1206
Contextual Info: THICK FILM CHIP RESISTOR x Small size and lightweight x Suitable for both flow and re-flow soldering x Reduction of assembly costs and matching with placement machines Ordering Procedure: Ex.: 1206, 1/4W-S, +/-5%, 1.2ȍ, T/R-5000 1 2 6 S 4 J Resistor Type:

KPL 3009

Abstract: diode 1N30 jtp 87 TL 8H3 PDI 45A pj 75 sx 34 ANI 1015 l8510 cv zxxx SSXX
Contextual Info: MIL-M-38510/45B 5 April 1984 SUPERSEDING QUALIFICATION REQUIREMENTS REMOVED MIL-M-38510/45A 24 M a y 1 9 8 2 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, TTL, LOW POWER, BISTABLE LATCHES, MONOLITHIC SILICON [Tn ACTIVE FOR NEW DESIGN AFTER DATE OF THIS REVISION.|

Contextual Info: RoHS THE INFORMATION CONTAINED HEREIN IS CONSIDERED ' P R O P R I E T A R Y ' TD BEL EUSE INC, AND S H A L L NOT BE CDPIEDj REPRODUCED OR DISCLOSED WITHOUT THE WRITTEN A P P R O V A L OF BEL FU SE INC. ELECTRICAL TURNS CHARACTERISTICS 2 0 0 2 /9 S E C RATICI

74LVT16273ADGG

Abstract: 74LVT16273ADL LVT16273A LVT16273
Contextual Info: Philips Semiconductors Low Voltage Products Preliminary specification 3.3V ABT 16-bit D-type flip-flop FEATURES _ 74LVT16273A • No bus current loading when output is tied to 5V bus • 16-bit D-type edge triggered flip-flops • Output capability: +64mA/-32mA '

Contextual Info: UniOhm Thick Film Chip Resistors RoHS Compliant RoHS Compliant UniOhm Thick Film Chip Resistors Feature Marking on the Resistors Body • Small size & light weight • Reduction of assembly costs and matching with placement machine • Suitable for both flow & re-flow soldering

UNIOHM 4D03

Contextual Info: UniOhm Chip Resistor Array - Convex Terminal RoHS Compliant Feature • • • • High density, more than 1 resistors in one small case Improvement of placement efficiency Tape/Reel packaging is suitable for automatic placement machine Superior solderability

Handbook IC24

Contextual Info: INTEGRATED CIRCUITS 74ALVT162823 18-bit bus-interface D-type flip-flop with reset and enable with 30Q termination resistors 3-State Product specification 1998 Aug 27 IC24 Data Handbook Philips Semiconductors PHILIPS Philips Semiconductors Product specification

Contextual Info: RC336DDP Modem Designer’s Guide 4. DSP RAM ACCESS The modem DSP contains a 16-bit wide random access memory RAM . The host processor can access (read or write) the RAM through a 12-bit memory address in registers 1D and 1C. 4.1 IN T E R F A C E M E M O R Y A C C E S S T O DSP RAM

74ABT16

Abstract: 74ABT16823A 74ABTH16823A
Contextual Info: Philips Semiconductors Product specification 18-bit bus-interface D-type flip-flop with reset and enable 3-State 74ABT16823A 74ABTH16823A FEATURES DESCRIPTION • Two sets of high speed parallel registers with positive The 74ABT16823A 18-bit bus interface register is designed to

74ABT16373B

Abstract: 74ABTH16373B
Contextual Info: Philips Semiconductors Product specification 16-bit transparent latch 3-State K v 1 74ABT16373B 74ABTH16373B When nOE is Low, the latched or transparent data appears at the outputs. When nOE is High, the outputs are in the High-impedance “OFF” state, which means they will neither drive nor load the bus.