1MM PITCH BGA 144 Search Results

1mm pitch BGA 144

Abstract: 12X12 SF-BGA144C-B-11 BGA144C
Contextual Info: C Package Code: BGA144C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 11.00mm [0.433"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 0.508 mm [0.020"]

Contextual Info: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*

55740-001LF

Abstract: 10060913-001 GS-20-016
Contextual Info: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the

Contextual Info: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the

55740-001LF

Abstract: FCI Connector TERMINAL FCI 0.65mm pitch BGA solder joint reliability 1mm pitch BGA GR-1217-CORE 10060912-001LF bga trays
Contextual Info: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The

8mm pitch BGA 256 pin 14x14

Abstract: CB45000 CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10
Contextual Info: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV

b55qs

Abstract: CB45000 ultra fine pitch BGA CB55Q CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics
Contextual Info: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV

0.25-um CMOS standard cell library inverter

Abstract: CMOS GATE ARRAY stmicroelectronics OLIVETTI
Contextual Info: CB55000 Series HCMOS7 Standard Cells FEATURES • ■ ■ ■ ■ ■ 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

BGA reflow guide

Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Contextual Info: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using

CG51364

Abstract: CG51284 CG51114 CG51754 CG51214 CG51484 CG51654 fujitsu asic quad design motive
Contextual Info: November 1995 Edition 1.5 DATA SHEET CG51/CE51 SERIES 3V, 0.50 MICRON HIGH PERFORMANCE/LOW POWER CMOS GATE ARRAYS DESCRIPTION The Fujitsu CG51/CE51 is a series of ultra high performance CMOS gate arrays. The CG51 is a high density Sea-of-Gates array for applications requiring high levels of integration or low

116-Pin

Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size

BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3

PBGA 256 reflow profile

Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Contextual Info: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

Contextual Info: KMMR16R84 6/8/C/G C1 KMMR18R84(6/8/C/G)C1 4/6/8/12/16d 4/6/8/12/16d RIMMTM RIMMTM Preliminary Module with 128Mb RDRAMs Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad

Contextual Info: KMMR16R84 6/8/C/G C KMMR18R84(6/8/C/G)C 4/6/8/12/16d 4/6/8/12/16d RIMMTM RIMMTM Preliminary Module with 128Mb RDRAMs Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad

74 hc 59581

Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
Contextual Info: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .

rg6 f connector

Abstract: 534 b34 diode a32 1015
Contextual Info: Preliminary KMMR16R84 6/8/C/G AC1 KMMR18R84(6/8/C/G)AC1 RIMMTM 4/6/8/12/16d Module with 128Mb RDRAMs TM 4/6/8/12/16d RIMM Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad

337 BGA footprint

Abstract: tray datasheet bga 10x10 84502 meg array 55740-001LF 74221 84512 84501 84501-201 bga 9x9 Shipping Trays tray datasheet bga 9x9
Contextual Info: COMMUNICATIONS, DATA, CONSUMER DIVISION Mezzanine High-Speed High-Density Connectors GIG-ARRAY and MEG-ARRAY® Electrical Performance Data FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI is a leading manufacturer of connectors.

IPC-2152

Abstract: sdrx2 IPC-2221A vsc8244hg TP153 11C6 74alvch32973kr RGMII trace mils SMD CAPACITOR L27 tp107
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3535 Rev. 0, 2/2008 A Strategy for Routing the MPC8544E in a Six-Layer PCB by Michael George NMG Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer

53389

Abstract: 16 pin (2x25), 2mm pitch header connectors base transceiver stations equipments JEDEC MO 224 10 pin 2x5, 2mm pitch header connectors MO-224 HDMI CONNECTOR 19 pin through hole 10 pin 2x5, 2.54mm pitch header connectors right angle 68 pin pcb SCSI connector display lcd 2x14
Contextual Info: COMMUNICATIONS, DATA, CONSUMER DIVISION CONNECTOR OVERVIEW FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI is a leading manufacturer of connectors. Our 13,500 employees are committed to providing customers with high-quality, innovative products for

BlueCore5

Abstract: BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232
Contextual Info: Features ƒ ƒ ƒ ƒ ƒ ƒ ƒ Single Chip Bluetooth v2.1 + EDR System Fully Qualified Bluetooth v2.1 + EDR system Integrated FM Radio Receiver with RDS Demodulator Stereo Audio Output Stage Full-speed Bluetooth Operation with Full Piconet Support Scatternet Support