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Oring Uszczelnienia Techniczne Z120X130X5/7P Wiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	Z120X130X5/7P		9		1	1 $1.05 10 $0.95 100 $0.84 1000 $0.84 10000 $0.84	Buy Now
Oring Uszczelnienia Techniczne ZZ120X130X7/10N Wiipers ZZ; NBR caoutchouc; Øout: 130mm; -30÷100°C; single; H1: 7mm
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ZZ120X130X7/10N		8		1	1 $2.62 10 $2.36 100 $2.10 1000 $2.10 10000 $2.10	Buy Now
Koyo Encoder Inc JR120X130X30 NRB SOLID RACE INNER RING, 120MM ID, 130MM OD, HIGH CARBON CHROME STEEL
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	JR120X130X30	Bulk		3 Weeks	1	1 $268.76 10 $268.76 100 $268.76 1000 $268.76 10000 $268.76	Get Quote
SKF IR 120X130X30 NRB-NEEDLE ROLLER BEARING
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	IR 120X130X30	Bulk		3 Weeks	1	1 $321.81 10 $321.81 100 $321.81 1000 $321.81 10000 $321.81	Get Quote
INA Bearings IR120X130X30-XL (1946970) INNER RING 120MM X 130MM X 30MM
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	IR120X130X30-XL (1946970)	Bulk			1	1 $298.51 10 $298.51 100 $298.51 1000 $298.51 10000 $298.51	Get Quote

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120X130 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
heat sink Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 heat sink	PDF
heat sink to220 Abstract: TH17023 Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	o-220 063w/cm 120x130 th17023 +2175x195 heat sink to220	PDF
Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	063w/cm 149x135 120x130 112x130 +1100x100	PDF
Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	063w/cm 149x135 120x130 112x130 +1100x100	PDF
EPOXY RESIN Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 epoxy resin	PDF
a3020 Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 a3020	PDF
Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	o-220 063w/cm 120x130 th17023 +1175x195	PDF
Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063w/cm 120x130 175x195	PDF
DIP18 Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 165x220 120x130 dip18	PDF
NF800-CEP Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi Contextual Info: MITSUBISHI ELECTRIC Low Voltage Switchgears Moulded-Case Circuit Breakers Disconnectors WSS, PSS & Super Series 3 A – 1600 A Technical Catalogue 2004 AUDIN - 8, avenue de la malle - 51370 Saint Brice Courcelles - Tel : 03.26.04.20.21 - Fax : 03.26.04.28.20 - Web : http: www.audin.fr - Email : info@audin.fr	Original	ru-344041 za-1600 133207-d d-40880 +4nf800-cep nf1250-ss dsn40 no-fuse circuit breaker mitsubishi	PDF
Contextual Info: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: capriz.c@aavid.com	Original	300x180x15	PDF
Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 165x220 120x130	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063w/cm 120x130 175x195	PDF