120X130 Search Results
120X130 Price and Stock
Koyo Encoder Inc JR120X130X30NRB SOLID RACE INNER RING, 120MM ID, 130MM OD, HIGH CARBON CHROME STEEL |
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JR120X130X30 | Bulk | 3 Weeks | 1 |
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SKF IR 120X130X30NRB-NEEDLE ROLLER BEARING |
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IR 120X130X30 | Bulk | 3 Weeks | 1 |
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INA Bearings IR120X130X30-XL (1946970)INNER RING 120MM X 130MM X 30MM |
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IR120X130X30-XL (1946970) | Bulk | 1 |
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Dichtomatik MA39-120X130X11.5 (75189396)OIL SEAL, 120MM ID, 130MM OD, 12.5MM WIDTH |
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MA39-120X130X11.5 (75189396) | Bulk | 3 Weeks | 27 |
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Oring Uszczelnienia Techniczne Z120X130X5/7PWiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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Z120X130X5/7P | 9 | 1 |
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120X130 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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heat sinkContextual Info: Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
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063W/cm 152x160 120x130 heat sink | |
heat sink to220
Abstract: TH17023
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O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220 | |
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Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm |
Original |
063W/cm 149x135 120x130 112x130 100x100 | |
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Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm |
Original |
063W/cm 149x135 120x130 112x130 100x100 | |
EPOXY RESINContextual Info: Thermal Data POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C |
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063W/cm 152x160 120x130 EPOXY RESIN | |
a3020Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
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063W/cm 152x160 120x130 a3020 | |
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Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder |
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O-220, 063W/cm O-220 120x130 TH17023 175x195 | |
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Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 152x160 120x130 | |
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Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin |
Original |
063W/cm 120x130 175x195 | |
DIP18Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 165x220 120x130 DIP18 | |
NF800-CEP
Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi
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Original |
RU-344041 ZA-1600 133207-D D-40880 NF800-CEP NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi | |
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Contextual Info: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: capriz.c@aavid.com |
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300x180x15 | |
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Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 165x220 120x130 | |
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Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin |
Original |
063W/cm 120x130 175x195 |