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Oring Uszczelnienia Techniczne


Oring Uszczelnienia Techniczne ZZ120X130X7/10N Wiipers ZZ; NBR caoutchouc; Øout: 130mm; -30÷100°C; single; H1: 7mm
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ZZ120X130X7/10N		9		1	1 $2.82 10 $2.54 100 $2.26 1000 $2.26 10000 $2.26	Buy Now
Oring Uszczelnienia Techniczne Z120X130X5/7P Wiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	Z120X130X5/7P		9		1	1 $1.13 10 $1.02 100 $0.90 1000 $0.90 10000 $0.90	Buy Now

120X130 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
heat sink Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 heat sink	PDF
heat sink to220 Abstract: TH17023 Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220	PDF
Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	063W/cm 149x135 120x130 112x130 100x100	PDF
Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	063W/cm 149x135 120x130 112x130 100x100	PDF
EPOXY RESIN Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 EPOXY RESIN	PDF
a3020 Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 a3020	PDF
Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195	PDF
Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063W/cm 120x130 175x195	PDF
DIP18 Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 165x220 120x130 DIP18	PDF
NF800-CEP Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi Contextual Info: MITSUBISHI ELECTRIC Low Voltage Switchgears Moulded-Case Circuit Breakers Disconnectors WSS, PSS & Super Series 3 A – 1600 A Technical Catalogue 2004 AUDIN - 8, avenue de la malle - 51370 Saint Brice Courcelles - Tel : 03.26.04.20.21 - Fax : 03.26.04.28.20 - Web : http: www.audin.fr - Email : info@audin.fr	Original	RU-344041 ZA-1600 133207-D D-40880 NF800-CEP NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi	PDF
Contextual Info: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: capriz.c@aavid.com	Original	300x180x15	PDF
Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 165x220 120x130	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063W/cm 120x130 175x195	PDF