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    120X130 Search Results

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    Koyo Encoder Inc JR120X130X30

    NRB SOLID RACE INNER RING, 120MM ID, 130MM OD, HIGH CARBON CHROME STEEL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS JR120X130X30 Bulk 3 Weeks 1
    • 1 $237.89
    • 10 $225.99
    • 100 $202.20
    • 1000 $202.20
    • 10000 $202.20
    Get Quote

    SKF IR 120X130X30

    NRB-NEEDLE ROLLER BEARING
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS IR 120X130X30 Bulk 3 Weeks 1
    • 1 $364.72
    • 10 $364.72
    • 100 $364.72
    • 1000 $364.72
    • 10000 $364.72
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    INA Bearings IR120X130X30-XL (1946970)

    INNER RING 120MM X 130MM X 30MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS IR120X130X30-XL (1946970) Bulk 1
    • 1 $295.39
    • 10 $280.62
    • 100 $251.08
    • 1000 $251.08
    • 10000 $251.08
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    Dichtomatik MA39-120X130X11.5 (75189396)

    OIL SEAL, 120MM ID, 130MM OD, 12.5MM WIDTH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS MA39-120X130X11.5 (75189396) Bulk 3 Weeks 27
    • 1 -
    • 10 -
    • 100 $14.11
    • 1000 $14.11
    • 10000 $14.11
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    Oring Uszczelnienia Techniczne Z120X130X5/7P

    Wiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME Z120X130X5/7P 9 1
    • 1 $1.13
    • 10 $1.02
    • 100 $0.90
    • 1000 $0.90
    • 10000 $0.90
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    120X130 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    heat sink

    Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


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    063W/cm 152x160 120x130 heat sink PDF

    heat sink to220

    Abstract: TH17023
    Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder


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    O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220 PDF

    Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


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    063W/cm 149x135 120x130 112x130 100x100 PDF

    Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


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    063W/cm 149x135 120x130 112x130 100x100 PDF

    EPOXY RESIN

    Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C


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    063W/cm 152x160 120x130 EPOXY RESIN PDF

    a3020

    Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


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    063W/cm 152x160 120x130 a3020 PDF

    Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder


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    O-220, 063W/cm O-220 120x130 TH17023 175x195 PDF

    Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


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    063W/cm 152x160 120x130 PDF

    Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


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    063W/cm 120x130 175x195 PDF

    DIP18

    Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


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    063W/cm 165x220 120x130 DIP18 PDF

    NF800-CEP

    Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi
    Contextual Info: MITSUBISHI ELECTRIC Low Voltage Switchgears Moulded-Case Circuit Breakers Disconnectors WSS, PSS & Super Series 3 A – 1600 A Technical Catalogue 2004 AUDIN - 8, avenue de la malle - 51370 Saint Brice Courcelles - Tel : 03.26.04.20.21 - Fax : 03.26.04.28.20 - Web : http: www.audin.fr - Email : info@audin.fr


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    RU-344041 ZA-1600 133207-D D-40880 NF800-CEP NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi PDF

    Contextual Info: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: capriz.c@aavid.com


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    300x180x15 PDF

    Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original
    063W/cm 165x220 120x130 PDF

    Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


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    063W/cm 120x130 175x195 PDF