165X220 Search Results
165X220 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
DIP18Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 165x220 120x130 DIP18 | |
Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 165x220 120x130 |