112X130 Search Results
112X130 Price and Stock
CR Seals 112X130X12 CRS11 RSINGLE LIP OIL SEAL, I.D. 112 MM, O.D. 130 MM, THICKNESS 12 MM |
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112X130X12 CRS11 R | Bulk | 4 Weeks | 1 |
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SMC Corporation of America NCA1B150-0112-X130USCYLINDER, TIE ROD, NCA1 SERIES |
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NCA1B150-0112-X130US | Bulk | 5 Weeks | 1 |
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Dichtomatik 112X130X8TB (75002822)OIL SEAL, 112MM ID, 130MM OD, 8MM WIDTH |
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112X130X8TB (75002822) | Bulk | 3 Weeks | 1 |
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Dichtomatik 112X130X8TB-BX (75019901)OIL SEAL, 112MM ID, 130MM OD, 8MM WIDTH, BOXED |
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112X130X8TB-BX (75019901) | Bulk | 3 Weeks | 1 |
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112X130 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm |
Original |
063W/cm 149x135 120x130 112x130 100x100 | |
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Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 | |
|
Contextual Info: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm |
Original |
063W/cm 149x135 120x130 112x130 100x100 | |
|
Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 | |
|
Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 |