175X195 Search Results

175X195 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
heat sink to220 Abstract: TH17023 Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220	PDF
MO-048 Contextual Info:  Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048	PDF
Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195	PDF
MO-048 Abstract: MULTIWATT die TH17023 Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die	PDF
MO-048 Abstract: MULTIWATT die CMC 15 EPOXY RESIN Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die CMC 15 EPOXY RESIN	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063W/cm 120x130 175x195	PDF
Contextual Info: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	063W/cm 120x130 175x195	PDF