1.6MM PITCH BGA Search Results

SF-BGA256J-B-01

Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Contextual Info: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

Contextual Info: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.

Contextual Info: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.

M1489

Abstract: M2423 socket 6.3mm BGA Package 14x14 m1489 a1 M1145 180C M1146 14x14 PCB 6.3mm Socket
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 10 9 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable

7075-T6 aluminum

Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position

bga676

Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable

Contextual Info: HIGH FREQUENCY SPRING PROBE TEST SOCKET FOR 0.5mm thru 0.8mm BGA FEATURES: • Solderless double-ended spring probes pressure mount to the test board and device solderball or pad. • Only .150” 3.81mm signal path. • Very low inductance and capacitance.

aluminium 7075

Abstract: high current pogo pin FR4 0.8mm thickness BGA400 0.5mm pitch BGA BGA-400 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6505
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable

SG-BGA-6061

Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

IC 7142

Abstract: SG-BGA-7142 0.65mm pitch BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

SG-BGA-6033

Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

PPC750FX

Abstract: 1mm pitch BGA socket thick bga die size 750FX SG-BGA-6051 0.125mm BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Socket supports IBM PowerPC 750FX as well as other BGA devices. Directly mounts to target PCB needs tooling holes with included hardware. High speed, reliable elastomer connection. Minimum real estate required.

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

SF-BGA60G-B-62

Abstract: 1mm pitch BGA FR4 substrate 1.6mm
Contextual Info: 1.6mm 0.8mm typ. Detail A 1mm 0.89mm [0.035"] 2.83mm [0.112"] 13mm 1mm typ. 1mm Top View 8mm [0.315"] Detail A 2 2.48mm [0.098"] 1 3 0.36mm ± 0.05mm [0.014" ± 0.002"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force with 0.254mm/0.203mm dia. pin

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen

BCN318

Abstract: 250v 1.0K capacitor 627T BB1020DT BB1020DT7 BB1110B BB1110TB BB2110DI BCN31Ladder 628 ladder
Contextual Info: bi441 short form 2007 dev.qxd 12 6/26/07 8:59 AM Page 12 Fixed Resistors BGA Networks BGA Network Model BB1110B/BB1110TB/BB2110DI BB1020DT Resistance Nominal, Ohms 20 to 100 475/121/425 Ball Size mm 0.64/0.76 0.64/0.76 Pitch (mm) 1.27, 1 1.27, 1 Absolute Tolerance (%)

4n35 optocoupler spice model

Abstract: L14F1 phototransistor datasheet MOC3043-M spice model H11F1 SPICE MODEL h11D1 spice MOC3010 spice L14F1 PHOTOTRANSISTOR slotted optocouplers DARLINGTON phototransistor l14f1 spice MOC3011
Contextual Info: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM

au38

Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a

TB389

Contextual Info: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing

qfn Substrate design guidelines

Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid

J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently