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    SG-BGA-6061 Search Results

    SG-BGA-6061 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    G832MC030606122HR
    		Amphenol Communications Solutions 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 11.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold White. PDF
    54242-106061000LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 6 Positions PDF
    54122-806061100LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch PDF
    54111-406061450LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch. PDF
    54122-106061100LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch PDF

    SG-BGA-6061 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6061
    		Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 13.5; IC Size Y (mm): 5.5; IC Array X: 16; IC Array Y: 6; Max Pincount: 96; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.35; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.5; Max Package Code: BGA96C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) Original PDF 52.05KB 3