SN63 Search Results

SN63 PB37

Contextual Info: PART NUMBER SOLDER SUFFIX SOLDER 8 2 0 9 7 -L F 1 15 " Sn63% , Pb37% 82097 S n96% , Ag4% LF1 TAB LOCATES TERM. # 3 - 4 Sn63% , Pb37% 82097U 8 2 0 9 7 U -L F 1 DOT LOCATES TERM #1 S n96% , Ag4% LF1 SIDE SOLDER SUFFIX 1 .0 2 4 MAX. [ 2 6 .0 0 ] LOT CODE & .0 2 5 SQ. 4

Contextual Info: CUSTOM DESIGNED AIR CORES Specifications: Wire Gauges 8 to 30* Wire Types Bare Copper; Tinned Copper; Single or Heavy Insulation; High Temperature Coatings Seal-brite Standard ; Solder Coated (Optional) - (42% Tin, 48% Bismuth)-Std SN60 or SN63 on request.

Contextual Info: SOLD ER SUFFIX CU STO MER Sn63% , LF 1 TERM. TERM IN AL Pb37% Sn96% , Ag4% LE AD P b —FREE RoHS No No Yes Yes 6G .500 MAX. [1 2.70] NO.’s FOR REF. ONLY I _ " 5 am .699 MAX. _ , [17.75] ~ □El 8S i □El CN .530 MAX. [13.46] □El □El 1— CD <

Contextual Info: SOLDER SUFFIX CUSTOMER TERMINAL RoHS LEAD Pb -FREE Sn63%, Pb37% No No Sn96%, Ag4% Yes Yes LF1 NO .’ : .0 1 8 IVidcom RECESS LOCATES TERM. #1 FOR REF. ONLY 370 ± .0 1 0 , [9 . 4 0 ± . 2 5 ] “ “ .0 7 5 REF. J [1 . 9 1 ] more than you expect x .01 0 (1 2)

Contextual Info: SOLDER S U F F IX CUSTOMER Sn63%, T E R M IN A L Pb37% Sn96%, Ag4% LE1 LE A D P b — FREE RoHS No No Yes Yes PART MUST INSERT FULLY TO SURFACE A IN RECOMMENDED GRID 6F * DIMENSION MAY BE EXCEEDED WITH SOLDER ONLY P.C. PATTERN, COMPONENT SIDE ELE C T R IC A L SP E C IF IC A T IO N S @ 25°C u n le s s o th e r w is e n o te d :

Raychem Specification RT-1404

Abstract: RT-1404 raychem rt-1404 rt 1404 06090 ANSI ansi-j-std-006 Raychem splice J-STD-006 raychem specification
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROM1 per ANSI-J-STD-004.

ANSI-J-STD-006

Abstract: HEATSHRINKABLE solder SLEEVE
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004.

J-STD-004

Abstract: J-STD-006 06090 ansi-j-std-006 D7130 D1411
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION

Contextual Info: PART NUMBER SOLDER SU FFIX Sn63% , 51537R 51537R-LF1 6F SOLDER Sn96% , LF1 Pb37% Ag4% * .4 1 5 D IM E N SIO N MAY BE EXCEEDED MAX. W IT H .3 6 0 [1 0 . 5 4 ] SOLDER ONLY M AX.* [9.14] r i 2 .385 1-0 Uu in u MAX. [9.78] LO r DOT TERM. N O . ’s FOR R EF .

PD73-103K

Abstract: 823k PD104-472M PD54-473K 683K PD104-273K PD75-473K PD104 PD105 PD43-152M
Contextual Info: PD Series SMT Power Choke Core * Test Measurement Frequency Values < 10µH tested @ 7.96MHz; Values ≥10uH @ 0.100 MHz 1.0 KHz Mechanical Configuration Units designed for Surface Mounting Terminals Solder Coated with SN63 solder Core Construction High Resistivity Ferrite

750030403

Abstract: 30403R
Contextual Info: S O L D E R S U F F IX C U S T O M E R T E R M IN A L Sn63% , Pb37% Sn96% , A g4% LF1 RoHS L E A D P b — F R EE No No Yes Yes more than you expect DOT LOCATES TERM. IVidcom TERM. NO. s FOR REF. ONLY ELECTRICAL SPECIFICATIONS @ PARAMETER TEST n o ted :

CBJR70

Abstract: CBJR70A
Contextual Info: DASH NO RED INDICATES ORIGINAL -1 -2 MODEL NO CBJR70 CBJR70A LTR A CODE DIM A .24 .34 B DIM C DIM D DIM .050 .090 .0625 .058 .090 .070 “1 r 380 DIA TYP I I I . 10 0 - h I -.258RECOMMENDED MTG HOLE PATTERN / b\ PRE-TINNED. .0015 MAXIMUM THICKNESS WITH SN63 OR

CBBJR79TLA

Contextual Info: DASH NO LTR CODE MODEL NO -1 CBBJR79TL -2 CBBJR79TLA A DIM B DIM .24 .565 .050 .090 .0625 .34 .665 .058 .090 .070 A C DIM D DIM E DIA RECOMMENDED PANEL CUTOUT J .500-28UNEF-2A- .562 HEX NUT • I 1 .100 I f-.258RECOMMENDED MTG HOLE PATTERN /X 6. A 4. PRE-TINNED. .0015 MAXIMUM THICKNESS WITH SN63 OR

40609

Contextual Info: SOLDER SUFFIX CUSTOMER TERMINAL RoHS LE A D P b -FR E E Sn63%, Pb37% No No Sn98%, Cu2% Yes Yes LF2 W .248 MAX. [6 .3 0 ] .1 62 MAX. [4 .1 0 ] /A /W E - M ID C 0 M \ 40609 .350 MAX [8 .8 9 ] DOT LOCATES TERM. SOLDER SUFFIX LOT CODE & DATE CODE .098 [2 .4 9 ]

Contextual Info: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil

mn 1220

Contextual Info: Patent Pending 31.00mm [1.220"] Top View 1.00mm [0.039"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 1.00mm [0.039"] -42 1mm typ. -42F* 31.00mm [1.220"] Sn96.5Ag3.0Cu0.5 *RoHS Compliant 1.33mm [0.052"] 2.36mm [0.093"] Side View Detail A

SF-BGA1148A-B-42

Contextual Info: Patent Pending Top View 1.00mm [0.039"] Ordering Information: 35.00mm [1.378"] 1.00mm [0.039"] Solder Ball Alloy Part Number Suffix -42 Sn63Pb37 -42F* Sn96.5Ag3.0Cu0.5 *RoHS Compliant 35.00mm [1.378"] 1mm typ. 1.33mm [0.052"] 2.36mm [0.093"] Detail A Side View

SN63 PB37

Abstract: Sn63 FR4 substrate SO8F
Contextual Info: 0.039"±0.003" 0.030" 0.100" 0.65mm 0.240" 0.300" 2 0.054" 0.050" 0.015" 0.200" 0.134" 0.023" 0.274" 1 Bottom View Top View Side View 1 2 Substrate: 0.0315"±0.007" FR4/G10 or equivalent high temp material. Solder Balls: SN63 PB37. Description: Package Convertor

pal 007

Abstract: PAL 007 c FR4 substrate PAL 007 a SN63 SN63 PB37 FX-QFE100SC-S-F-01
Contextual Info: 0.041" ±0.003" 0.060" 0.050" 0.050" Pin 1 0.670" 0.010" 0.5 mm 0.700" Ø 0.025" Typ. 2 0.700" 1 0.670" Top View Bottom View Side View 1 Substrate: 0.0315"±0.007" FR4/G10 or equivalent high temp material. 2 Solder Balls: SN63 PB37. Description: Custom Adapter

Contextual Info: RoHS Sn63% , Pb37% No No Sn96% , Ag4% Yes Yes LF1 I CUSTOMER TERMINAL LÜ L d ct:i_ L _Q CL Q < _LdI SOLDER SUFFIX d> PRI & d> FWD AUX GK P.C. PATTERN, COMPONENT SIDE ELECTRICAL SPECIFICATIONS 25°C u n le s s oth erw ise n oted: D.C. RESISTANCE @20°C :

secon

Contextual Info: LÜ LU I ÍL . No _Q S n 9 6 % , A g 4% LF1 RoHS □_ Pb37% O Sn63% , < CUSTOMER TERMINAL LU _ I SOLDER SUFFIX No Yes Yes * a 1 u DIM ENSION MAY BE EXCEEDED WITH AV SOLDER ONLY .3 6 0 M A X .* [9 .1 4 ] 2 ! o u Q CO .3 8 5 MAX. [9 .7 8 ] n 1 1 i— CN in \

Contextual Info: Ld LU I II. _Q □_ RoHS No Yes <Q LF1 CUSTOMER TERMINAL Sn63%, Pb37% Sn96%, Ag4% LU _ I SOLDER SUFFIX No No DOT LOCATES TERM. #1 250 MAX. [6 .3 5 ] .370 ±.0 10 J 9 .4 0 ± .2 5 ] □z t 305 MAX. [7 .7 5 ] LOT CODE & DATE CODE [ . 10] • • .370 ±.0 10

SF-BGA176C-B-42

Contextual Info: Patent Pending 15.00mm [0.591"] Top View Ordering Information: Solder Ball Alloy Sn63Pb37 Sn96.5Ag3.0Cu0.5 1.00mm [0.039"] Part Number Suffix 1.00mm [0.039"] -42 -42F* *RoHS Compliant 1.00mm typ. 15.00mm [0.591"] Side View 1.33mm [0.052"] Detail A 3 2.36mm

6h6n

Contextual Info: LÜ d L ct:i_ L _Q CL Q < _LdI CUSTOM ER TERMINAL RoHS Sn63%, Pb37% No No S n 1 00% Yes Yes LF3 I SO LDER SUFFIX §x§r TAB LOCATES TERM. # 3 - 4 SIDE DOT LOCATES TERM #1 SOLDER SUFFIX 1.024 MAX [26.00] .025 SO. 4 [.64] PART MUST INSERT FULLY TO SURFACE A IN RECOMMENDED GRID