026M Search Results

CT1R

Abstract: 11EQS03L
Contextual Info: SCHOTTKY BARRIER DIODE 11EQS03L i a / sov FEA TU RES 2.7U06 .DIA MAX o Miniature Size o Extremely Low Forward Voltage Drop o Low Power Loss, High Efficiency o High Surge Capability 0 30 Volts thru 100 Volts Types Available 3.0U2) MAX 026mm and 52mm Inside Tape Spacing

RJ11 specification

Abstract: MDF splitter VDSL2 splitter RJ11 splitter Electrical signal Splitter RJ11 line splitter dc block splitter g.993.2 CLSI 6866
Contextual Info: VDSL2 over ISDN 135ohm CPE Splitter Brief introduction Corelogic can provide the broadest XDSL splitter solution for XDSL communication technology. CLSI-026M2 CLSI-026M2 is a highly integrated VDSL2 over ISDN 2B1Q splitter. It separates line signal from subscriber side into ISDN signal and VDSL signal for VDSL modem.

SG615PH

Abstract: SG-615PH C SG51P sg636ph SG51PH SG-615PH SG-615PTJ
Contextual Info: Applications guide REFERENCE DATA D u ty 4 5 % .5 5 % D u ty 40% .,6 0% • Duty of SG-51,531,615 and 636 series Model 1 MM i 2t.026M . M. OM l l 48.6m TTL ! CL=!l5pFmax. ! ! ! ! ! C -M O S SG-51 PTJ/SG-531PTJ/SG-615PTJ SG-51 PH/SG-531PH/SG-615PH TTL C -M O S

la 3350

Contextual Info: MIL-C-55302 / 58 M ale Body / Fem ale C o n tact: .1 0 0 " Centers — .050" offset U E R -M F Series Description : Straight through socket connector with mounting ears. .100" 2.54 centers .050" (t .27) offset 10-70 See page 9 Contacts: Hardware: Contact

H26M* hynix

Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
Contextual Info: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title

D-6840

Abstract: D6840 TXYS 91S50B IC-9017 c10006 d684
Contextual Info: □IXYS PRELIMINARY TECHNICAL INFORMATION Data Sheet No 91S50B July 1992 HIGH VOLTAGE "S" Series MOSIGBT IX S H 1 7 N 1 0 0 ,1 0 0 A Improved S C SO A Capability IX S M 1 7 N 1 0 0 ,1 0 0 A Part Number •

Contextual Info: TE Connectivity Products Industries Resources Home > Products > Relays > Product Feature Selector About TE Support Center My Account > Product Details FCB - 205 - 0226M Product Details Share Military/Aerospace Mid ? ? ? ? Product Highlights: ? FCB 5 - 10 Amp Relay Series

1026M

Abstract: M83536-10 026m M83536/JRE200111 M83536/15-01M
Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > Relays > Product Feature Selector Customer Support > Product Details FCA - 210 - 026M Product Details Military/Aerospace Mid - Range Relays Not EU RoHS or ELV Compliant Check Pricing &

M83536

Abstract: 0926M
Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > Relays > Product Feature Selector Customer Support > Product Details FCA - 210 - 0926M Product Details Military/Aerospace Mid - Range Relays Not EU RoHS or ELV Compliant Check Pricing &

Contextual Info: MIL-C-55302 / 62 UMR'MF Series Description: S traight through socket connector w ithout m ounting ears. .100" 2.54 centers .050" (1.27) offset Contacts: Hardware: Contact Termination: Polarization Configuration: Suggested Mounting: 10-70 See page 17 Male Body / Female Contact: .100" Centers — .050“ offset

Contextual Info: MIL-C-55302/ UMR-MF Series Description: Straight through socket connector w ithout m ounting ears. .100" 2.54 centers .050" (1.27) offset 10-70 Contacts: Hardware: See page 21 Contact Termination: See page 21 Polarization Configuration: See page 22 Suggested

LT023MC

Abstract: lt023 lt024 LT026 Photo diode TFK S 186 P LT026MD LTO15
Contextual Info: Common Data I x x x x x x x x x x x x x x x x x x x J Fig. 94-4 Coupling Efficiency Fig. 94-1 Optical Powar Output Dependence of Far-Field Pattern 1001 I I 01 0.1 02 [ I Radiation angle deg Fig. 30C 94-2 Polarization Ratio vs. Optical Powar Output (LT026 series, LT023 series)

KLM4G1FE3B-B001

Abstract: KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5
Contextual Info: Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e•MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed

cc3000

Abstract: 330-0085-R1 IEEE 802.11 interference TQM679002A schematic
Contextual Info: TiWi-SL MODULE DATASHEET Integrated 802.11 b/g WLAN Module FEATURES • DESCRIPTION IEEE 802.11 b/g compliant. • Typical WLAN Transmit Power: o +19.0 dBm, 11 Mbps, CCK b o +15 dBm, 54 Mbps, OFDM (g) • Typical WLAN Sensitivity: o - 85 dBm, 8% PER,11 Mbps

m39016

Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > Relays > Product Feature Selector Customer Support > Product Details 3SBC1653A2 Product Details Quick Links Military/Aerospace High Performance Relays Check Pricing & Availability

BB409

Abstract: 074M 026m 0-22M
Contextual Info: REV. A NOTE: - B A±0.1 • BB409- P itch=0.4- •0.17 ±0.05 ± 0 .0 3 xxx M - I— 05G—5U" GOLD OVER NICKEL 10G -10U ” GOLD OVER NICKEL PACKAGE TA—EMBOSSED TAPE TU-TUBE MALE NO. OF CONTACTS SERIES UUÜÜÜÜÜÜUli v - HOUSING ^ CONTACT 4. RATING:

toshiba emmc

Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
Contextual Info: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip

Contextual Info: ECO/PCI Compact Enclosures Economical Watertight Control Enclosures For Finishing Services, Product Support, or to Order Call 1-301-696-9800 Rose Enclosures • 7330 Executive Way • Frederick, MD 21704 • 301-696-9800 • www.Rose-Bopla.com • E-mail: RBinfo@pm-usa.com

SAMSUNG moviNAND

Abstract: MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash
Contextual Info: KMCEN0000M-S998000 4GB moviNAND_8Gb MLC Based SAMSUNG moviNANDTM KMCEN0000M (4GB MLC) Product Data Sheet Version 1.0 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

transistor c014

Abstract: 301L C-013L C-014 FX-301 FX-301L FX-401 07R1C1
Contextual Info: CONSUMER MICROCIRCUITS LTD Obsolete Product - For Information Only DATUM /DUAL DATUM FREQUENCY SENSITIVE SWITCHES GENERAL DESCRIPTION The FX-301 L and FX-401 are tw o m onolithic microcircuits which function as precision frequency sensitive switches. The FX-301 L is a single set-point switch intended fo r H I/L O switch­

Toshiba NAND BGA 224

Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Contextual Info: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

hynix emmc

Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
Contextual Info: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History

cn/A/U 237 BG

Abstract: MP 130B transformer MP 130B 1800
Contextual Info: Enclosures . . . . . . for Industry A Phoenix Mecano Company We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement. Rose+Bopla, the enclosure companies of Phoenix Mecano AG, an international corporation based in Switzerland, has developed a broad range of

S3F49SAX

Abstract: EXT_CSD MMCA 4.3 MultiMediaCard System Specification Version MMCA CMD38 Mmcplus commands package tsop1 nec 384M serial flash 256Mb fast erase spi sim card chips
Contextual Info: MultiMediaCardTM Revision 0.3 SAMSUNG MultiMediaCard Product Datasheet Version 0.3 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,