015101 Search Results

Contextual Info: SPRING-LOADED CONNECTORS & PAD CONNECTORS 811-S1-NNN-30-015101 Single Row 2.54 mm, Surface mount perpendicular SERIES 811 Low resistance modular connectors with spring-loaded contacts SLC , surface mount. Contacts with improved, shaped piston design. TECHNICAL SPECS.:

Contextual Info: Product Number: 814-22-020-30-015101 Description: Interconnect Header Spring-Loaded Header with Alignment Pins Double Row Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A Mill-Max Part Number 20

IRGCC40KE

Abstract: IRGPC40K
Contextual Info: Previous Datasheet Index Next Data Sheet PD-9.1427 TARGET IRGCC40KE IRGCC40KE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage

IRGCC40KE

Abstract: IRGPC40K
Contextual Info: PD-9.1427 TARGET IRGCC40KE IRGCC40KE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage

91428

Abstract: IRGCC40FE IRGPC40F IRGCC40F
Contextual Info: PD-9.1428 TARGET IRGCC40FE IRGCC40FE IGBT Die in Wafer Form C 600 V Size 4 Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage

6P2C

Contextual Info: H O S ID E N Through Type Mounting Style I UNIT : mm 4 Position H JC0175 With reinforcement terminals P P HO LE LAYOUT (B O T T O M V IE W ) S # / M o d e l No. Housing Color 4P-4C Gray HJC0175-01-012 Black HJC0175-01-022 Ivory HJ C 0 175-01-032 4 Position

IRGCC40UE

Abstract: IRGPC40U
Contextual Info: PD-9.1426 IRGCC40UE IRGCC40UE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage

IRGCC40

Abstract: IRGCC40UE IRGPC40U
Contextual Info: Previous Datasheet Index Next Data Sheet PD-9.1426 IRGCC40UE IRGCC40UE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage

T2066

Contextual Info: Tantalum Hermetically Sealed/Axial Through-Hole Capacitors T255 Series High Temperature Solder Overview The KEMET T255 High Temperature Solder Series of solid tantalum capacitors offers high capacitance-to-volume ratios and is available in standard MIL style A, B, C, and D

I960 mx

Abstract: 271194 marking A17 DIODE marking ED BDATA23 i960mx 27119
Contextual Info: In te l. MILITARY i960 MM/MX SUPERSCALAR MICROPROCESSOR Implements JIAWG 32-bit ISA Standard i960® MX Processor Only High-Performance 32-bit Superscalar Architecture — Up to Three Instructions per Clock Execution — Five Parallel Execution Units — Load/Store Architecture

Contextual Info: SIEMENS PNP Silicon AF Transistors • • • • • BCX 69 For general AF applications High collector current High current gain Low collector-emitter saturation voltage Complementary type: BCX 68 NPN Type Marking BCX 69 BCX 69-10 BCX 69-16 BCX 69-25 CF

Diaphragm Pressure Gauge

Abstract: oem sensor
Contextual Info: pressure and vacuum transducers MAGTRANS, INTERNAL DIAPHRAGM, OEM SENSOR • Brass wetted parts • Pressure ranges from -1… 0 bar to 0… 25 bar • 0-10V and 0-5V output • Low cost suitable for OEM applications Type 3301 PART NUMBERS 3301 Range Bar

max3930

Abstract: 3296W-202 0805CS-221XKBC 3296W GRM33 MAX3930EVKIT TAJB106K010 CAPACITORS 0201 2K variable resistor
Contextual Info: 19-2070; Rev 0; 6/01 MAX3930 Evaluation Kit The MAX3930 evaluation kit EV kit is an assembled demonstration board that provides electrical evaluation of the MAX3930 10.7Gbps laser driver. The output of the evaluation board is interfaced to an SMA connector that

Contextual Info: Tantalum Hermetically Sealed/Axial Through-Hole Capacitors T245 Series High Temperature Solder Overview Applications The KEMET standard MIL case hermetically sealed T245 Series Extended Capacitance Range is compact, ruggedly built and designed for miniaturized circuitry. The capacitors are especially

Contextual Info: SIEMENS BFP 181W NPN Silicon RF Transistor • For low noise, high-gain broadband amplifiers at collector currents from 0.5mA to 12mA • f j = 8GHz F = 1.45dB at 900MHz ESP: Electrostatic discharge sensitive device, observe handling precaution! Type Marking

Contextual Info: International pc-9.1428 IRGCC40FE IQRRectifi Gf_ TARGET IRGCC40FE IGBT Die in Wafer Form 600 V Size 4 Fast Speed 5" Wafer Electrical Characteristics Wafer Form P a ra m e te r D e s c rip tio n G u a ra n te e d (M in /M a x ) VCE (on) Cotlector-to-Em itter Saturation Voltage

Contextual Info: International IOR Rectifier PD-9.1427 IRGCC40KE TARGET IRGCC40KE IGBT Die in Wafer Form 600 V Size 4 Ultra-Fast Speed 5 " Wafer Electrical Characteristics Wafer Form Param eter Description G uaranteed (Min/Max) VcE (on) Collector-to-Emltter Saturation Voltage

Contextual Info: SIEMENS NPN Silicon High-Voltage Transistors BFN 24 BFN 26 • Suitable for video output stages in TV sets and switching power supplies • High breakdown voltage • Low collector-emitter saturation voltage • Complementary types: BFN 25, BFN 27 PNP Type

01510010

Abstract: SIU800 80E06 tektronix k4000 80C01 80C02 80C07B 80C08C 80C10 TDS8000B
Contextual Info: Digital Sampling Oscilloscope TDS8000B Features & Benefits DC to 70+ GHz Bandwidth*1 Exceptional Trigger Jitter and Horizontal Timebase Stability Modular Architecture Up to Eight Channels Acquisition High Resolution and Measurement Repeatability Comprehensive, Accurate,

Contextual Info: PD-9.1426 International IO R Rectifier IRGCC40UE IRGCC40UE IGBT Die in Wafer Form 600 V Size 4 Ultra-Fast Speed 5" Wafer Electrical Characteristics Wafer Form D e s c rip tio n G u a ra n te e d (M in /M a x ) VCE (on) C ollector-to-Em itter Saturation Voltage

T4FS

Abstract: RMJ BH 6b022 B1481-2 core i3 addressing modes RD085 55ag nbf1 Application note U68A mark ea02
Contextual Info: NATL SEMICOND UP/UC 31E D Bi b S G U S Ö 2 H PRELIMINARY Semiconductor 7 = 4 9 -/9 -1 4 , HPC16400/HPC36400/HPC46400 High-Performance Communications microcontroller General Description Features The HPC16400 Is à member of the HPO lamily ol High Performance microcontrollers. Each member o f the family

MIL-C-39006

Contextual Info: MIL-C-39006 Military Style Tantalum Capacitors i MIL-C-39006 Tantalum Capacitors VIBRATION, HIGH FREQUENCY DESIGN AND CONSTRUCTION Capacitors shall be tested in accordance with method 204 of MILEach fixed capacitor consists of a sintered tantalum anode isolated

Contextual Info: Male Style H 15 2 rows 1 x 7 + 1 x 8 Contact Design and Termination Length Number of Contacts 15 Right Angled PCB Solder 15 FASTON (6.3 x 0.8) Part Number Performance classes according to DIN 41612 I Loading Description fully loaded 10 8456 015 001 169 fully loaded + ground z + 32

HPC16400

Contextual Info: HPC16400/HPC36400/HPC46400 High-Performance Communications microcontroller G e n e r a l D e s c r ip t io n Features The HPC16400 is a member of the H P C t m family of High Performance microcontrollers. Each member of the family has the same identical core CPU with a unique memory and