XFTPRH64B Search Results

102M

Contextual Info: 1. M echanical D im ensions: 2. c Sch em atic: 1.5±0.2 5.0 Max 1 3-° r rv J i o ro od 1 > n o P ad Layout Notes: 1. Solderability: Leads shall meet MIL—STD—202, Method 208D for solderability. 3. E lectrical Specification : OCL: 10OOuH ± 2 0 % 1KHz

Contextual Info: 1. M echanical Dim ensions: C 5.0 Max 2. Schem atic: 1.5±0.2 3.0 1 RES o o io oo Pad Layout Notes: 1. Solderability: Leads shall meet MIL—STD—202, Method 208D for solderability. 3. Electrical Specification: OCL: 2. 3. 4. 5. 10uH ± 1 0 % @ 1KHz 1.0V Rated Current: 1.35 Adc based on 10% drop in OCL

Contextual Info: 2. S ch em atic: 1. M echanical D im ensions: 5 .0 C Max 1 3-° r 1 io0 o KÌ 00 1 S 4 P ad Layout Notes: 1. Solderability: Leads shall meet MIL—STD-202, 3. E lec tric al S p ecificatio n : OCL: 4 . 7 u H ± 2 0 % 1 K H z Method 208D fo r solderability.

Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: c 1 .5 ± 0 .2 5 .0 Max 1 3-° r rv J i o ro od 1 > n o Pad Layout Notes: 1. Solderability: Leads shall meet MIL— STD— 202, Method 208D fo r solderability. 3. E lectrical Specification : OCL: 220uH ± 1 0% 1KH z

10D3

Contextual Info: 2. 1. M e c h a n ic a l D im e n s i o n s : c 1 .5 ± 0 .2 5.0 Max 1 1 r S ch e m atic: -i 3-° r o o ro dû Pad Layout Notes: 1- Soldsrab illtyr Leads shall m B st MIL—S T D -2 0 2 G » 3. Electrical Specification: OCL: 3 .3 u H ±20% M e th o d 2. 5.

220N

Contextual Info: 1. M echanical Dim ensions: C i.O Max 1 2. Schem atic: 1.5±0.2 3.0 625 o o io co 4 Pad Layout Notes: 1. Solderability: Leads shall meet MIL—STD—202, Method 208D for solderability. 3. Electrical Specification: OCL: 2. 3. 4. 5. 22uH - 2 0 % + 2 5 % @ 1KHz 1.0V

10D3

Abstract: fi5c 3007
Contextual Info: 2. 1. M e c h a n ic a l D im e n s i o n s : c 5 .0 M ax 1 .5 ± 0 .2 1 r S ch e m atic: -i 3-° r 1 o ro o dû Pad Layout Notes: 1- Soldsrab illtyr Leads shall 3. Electrical Specification: OCL: 22uH ±Z0% M e th o d 2. @ 2.52MHz 0.1V DCR: Q: C u rre n t:

Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: C 5.0 Max 1 1.5±0.2 a ;R - i 3-° r i -y h v y o ro o oo 1 J - Pad Layout Notes: 1. Solderability: Leads shall meet MIL— STD— 202, Method 208D fo r solderability. 3. E lectrical Specification : OCL: 2. 3.

208H

Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: C 5 .0 Max 1 .5 ± 0 .2 1 r 1 3 .0 r 1 o ro o 00 1 Ì Pad Layout Notes: 1. Solderabillty: Leads shall meet MIL— STD— 202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28%