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    208h Datasheets

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    Part ECAD Model Manufacturer Description Download Buy
    69190-208HALF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 08 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10127402-08H1000LF Amphenol Communications Solutions PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 4HP Vertical Press Fit Visit Amphenol Communications Solutions
    68602-208HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in)Pitch. Visit Amphenol Communications Solutions
    68023-208HLF Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Right Angle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail. Visit Amphenol Communications Solutions
    69191-208HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    78207-208HLF Amphenol Communications Solutions PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Double row - 8 Positions 2.54mm - Right Angle. Visit Amphenol Communications Solutions
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    JRH Electronics 805-004-02C18-208HD

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    DigiKey 805-004-02C18-208HD 101 1
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    • 100 $2120.9392
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    JRH Electronics 805-004-02MT18-208HD

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    DigiKey 805-004-02MT18-208HD 101 1
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    • 10 $2322.933
    • 100 $2120.9392
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    JRH Electronics 805-002-16Z118-208HF

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    DigiKey 805-002-16Z118-208HF 96 1
    • 1 $2379.15
    • 10 $2188.818
    • 100 $1998.486
    • 1000 $1998.486
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    JRH Electronics 805-004-02NF18-208HE

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    DigiKey 805-004-02NF18-208HE 90 1
    • 1 $2236.52
    • 10 $2057.601
    • 100 $1878.679
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    JRH Electronics 805-001-16ZN18-208HF

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    DigiKey 805-001-16ZN18-208HF 89 1
    • 1 $2207.09
    • 10 $2030.525
    • 100 $1853.9578
    • 1000 $1853.9578
    • 10000 $1853.9578
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    208h Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    proteus

    Abstract: HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208
    Text: 144HTFP 160HQFP 160PQFP 176TQFP 176HTFP 208HQFP 208PQFP 240HQFP 240PQFP XC4013 XC4020 XC4028 , R4028XL-C-160H R4028XL-C- 208H R4028XL-C-240H R4028XL-C-299G R4028XL-C-304Q R4028XL-C-352B Commercial , XC4028XL-BG352C R4028XL-I-160H R4028XL-I- 208H R4028XL-I-240H R4028XL-I-299G R4028XL-I-304Q R4028XL-I , XC4028XL-HQ304I XC4028XL-BG352I R4036XL-C-160H R4036XL-C- 208H R4036XL-C-240H R4036XL-C-304Q R4036XL-C , XC4036XL-HQ304C XC4036XL-BG352C XC4036XL-BG432C R4036XL-I-160H R4036XL-I- 208H R4036XL-I-240H Industrial


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    PDF 4000E/EX 4000XL/XLA 1-800-95CHIPX proteus HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208

    proteus

    Abstract: XC4013E-PQ160C XC4013EPQ160 XC4013E-HQ208I "CHIP EXPRESS" pq208C xc4028exhq208c XC4013E-PQ208C XC4036EX-HQ240 XC4013E-PQ240
    Text: -240Q Commercial Commercial 208HQFP 240PQFP XC4020E-HQ208C XC4020E-PQ240C R4020E-I- 208H R4020E-I , Matrix Proteus Part Number R4013E-C-160Q R4013E-C- 208H R4013E-C-208Q R4013E-C-240Q R4013E-C , 208HQFP 208PQFP 240PQFP 240HQFP Xilinx Equivalent XC4013E-PQ160C XC4013E-HQ208C XC4013E-PQ208C XC4013E-PQ240C XC4013E-HQ240C R4013E-I-160Q R4013E-I- 208H R4013E-I-208Q R4013E-I-240Q R4013E-I-240H Industrial Industrial Industrial Industrial Industrial 160PQFP 208HQFP 208PQFP 240PQFP 240HQFP


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    PDF 4000E/EX 4000XL/XLA 1-800-95CHIPX proteus XC4013E-PQ160C XC4013EPQ160 XC4013E-HQ208I "CHIP EXPRESS" pq208C xc4028exhq208c XC4013E-PQ208C XC4036EX-HQ240 XC4013E-PQ240

    kpe kingstate

    Abstract: KPE-208 KPE-207 KPE-217 Kingstate KPE-228 kingstate kpe KPE-238 KPE-208H A-31
    Text: www.kingstate.com.tw A-31 PIEZO INDICATOR (Pin Type) Shape Shape KPE-208 KPE- 208H A KPE-218 KPE-218H Model Number KPE-208 KPE- 208H 4,000 ± 500 3,500 ± 500 3 ~ 20 8 ~ 18 , 5.7 17.5 Tol : ±0.5 Unit : mm Tol : ±0.5 Unit : mm Characteristic Characteristic KPE- 208H


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    PDF KPE-238 KPE-228 12VDC UL-94 KPE-208H kpe kingstate KPE-208 KPE-207 KPE-217 Kingstate KPE-228 kingstate kpe KPE-238 KPE-208H A-31

    2003 - 12034074

    Abstract: No abstract text available
    Text: : 12015791 Connector Assembly 1F SIZE: 40.5L x 20.8H x 13.6W COLOR: Black MATERIAL: PA6 TERMINALS , : Connector Assembly 2F SIZE: 40.8L x 20.8H x 21.5W MATERIAL: PA6 TERMINALS: See Page 242 SEALS/PLUGS


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    PDF 1-800-PACKARD 12034074

    2002 - Not Available

    Abstract: No abstract text available
    Text: Range: ±10, ±5, ±2.5, ±1.25 volts for DAQP-208 and ±0.01 V, ±0.1 V, ±1 V, ±10 V for DAQP- 208H , , 100, 1000 (DAQP- 208H ) Data FIFO: 2 K Scan FIFO: 2048 entries Sampling Rate: 0.006 Hz to 100 kHz , DAQP-208 $695 DAQP- 208H 695 UIO-37 110 Description 12-bit Data Acquisition PCMCIA


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    PDF DAQP-208 12-bit 16-bit DAQP-208 DAQP-208H UIO-37 DAQP-208,

    Not Available

    Abstract: No abstract text available
    Text: and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes , ., 3 cycles ± 0.1% + 0.01 Solderability 2 MIL-PRF-55342, MIL-STD-202 Method 208H Min 95


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    PDF CF02M591-01 Sn100, 72C/W)

    2010 - Not Available

    Abstract: No abstract text available
    Text: in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability , MIL-PRF-55342, MIL-STD-202 Method 208H 4 Conditions of Test 25ºC, 2000h, rated power 3, 1.5h on, 0.5h


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    PDF CFA1206 Sn100,

    2011 - IPC4101

    Abstract: No abstract text available
    Text: -002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount , -202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H 4 Conditions of Test 25ºC, 2000h, rated power 3


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    PDF CF02M591-01 CFA1206 Sn100, IPC4101

    2013 - CF02M591-01

    Abstract: No abstract text available
    Text: test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. , 208H Min 95% coverPrecondition E: 150ºC dry bake for 16h, Method 1 “Dip and Look Test”, 245ºC


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    PDF CF02M591-01 CFA1206E50R0FS-T50 Sn100,

    2006 - Not Available

    Abstract: No abstract text available
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -202 Method 106G MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1


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    PDF Sn100, 25ppm BP2512S27R0J)

    2007 - 2525-size

    Abstract: EIA-638
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -202 Method 106G MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1


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    PDF Sn100, 25ppm CPB2512S27R0JS) 2525-size EIA-638

    2010 - IPC-4101

    Abstract: IPC4101 210F JESD22-B102D EIA-638 106G 208H CFA1206E50R0FS thermal imaging
    Text: MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability Test , MIL-PRF-55342, MIL-STD-202 Method 208H Precondition E: 150ºC dry bake for 16h, Min 95% coverage


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    PDF CF02M591-01 CFA1206 Sn100, IPC-4101 IPC4101 210F JESD22-B102D EIA-638 106G 208H CFA1206E50R0FS thermal imaging

    2013 - Not Available

    Abstract: No abstract text available
    Text: test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. , 208H Precondition E: 150°C dry bake for 16h, Method 1 “Dip and Look Test”, 245°C, 5 sec


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    PDF CP02M581-05 CPA1206 Sn100,

    Not Available

    Abstract: No abstract text available
    Text: Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure , -202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF


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    PDF CP02M581 CPA2512* Sn100, 25ppm/Â Sn60Pb40 CPA2512E27R0FS-T10)

    2008 - IPC-4101

    Abstract: ipc4101 B25-12 res chip 2w 2512 EIA-638 106G 208H 210F JESD22-B102D J-STD-002B
    Text: 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability Test". 3. Parts mounted , -202 Method 106G MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC


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    PDF Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A27R0 CPA2512E27R0FS-T10) IPC-4101 ipc4101 B25-12 res chip 2w 2512 EIA-638 106G 208H 210F JESD22-B102D J-STD-002B

    2008 - res chip 2w 2512

    Abstract: "100 6W"
    Text: in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability , MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test 70ºC


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    PDF Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A27R0 CPA2512E27R0FS-T10) res chip 2w 2512 "100 6W"

    2008 - JESD22-B102-D

    Abstract: No abstract text available
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -202 Method 208H Conditions of Test 25ºC, 2000h, rated power 3, 1.5h on, 0.5h off Condition F-3, -65ºC/0.25h


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    PDF CPA1206* Sn100, 25ppm/ Sn60Pb40 CR1206 MIL-STD-1285D) CPA1206E39R0FS-T10) JESD22-B102-D

    Not Available

    Abstract: No abstract text available
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, “Surface , 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test 70ºC, 2000h, rated power 3, 1.5h


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    PDF CFA2512E50R0JS Sn100, 25ppm/Â Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10)

    2008 - IPC-4101

    Abstract: No abstract text available
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -202 Method 208H Conditions of Test 25ºC, 2000h, rated power 3, 1.5h on, 0.5h off Condition F-3, -65ºC/0.25h


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    PDF CFA1206E50R0FS Sn100, 25ppm/ Sn60Pb40 CR1206 MIL-STD-1285D) CFA1206E50R0FS-T10) IPC-4101

    2010 - IPC-4101

    Abstract: 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101
    Text: aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA , -202 Method 106G MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H


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    PDF CPA1206* Sn100, 25ppm/ Sn60Pb40 effecti00 MIL-STD-1285D) CPA1206E39R0FS-T10) IPC-4101 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101

    12124580

    Abstract: 12010973 Delphi PA66 12020005 15408312 12124582 PA66 HS IM 12010293 12015792 pa66 6f
    Text: Length: 64.5mm A B PART NO: 12015791 Connector Assembly 1F SIZE: 40.5L x 20.8H x 13.6W , ) 12103784 (Gray) DESCRIPTION: Connector Assembly 2F SIZE: 40.8L x 20.8H x 21.5W MATERIAL: PA6


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    PDF 1-800-PACKARD 12124580 12010973 Delphi PA66 12020005 15408312 12124582 PA66 HS IM 12010293 12015792 pa66 6f

    2010 - IPC-4101

    Abstract: thermal camera 208H 210F CPA2512 JESD22-B102D J-STD-002B EIA-638 22-A101 IPC4101
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF


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    PDF CP02M581 CPA2512* Sn100, 25ppm/ Sn60Pb40 CPA2512E27R0FS-T10) IPC-4101 thermal camera 208H 210F CPA2512 JESD22-B102D J-STD-002B EIA-638 22-A101 IPC4101

    2008 - 2512E50R0JS

    Abstract: No abstract text available
    Text: 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability Test". 3. Parts mounted , -55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test 70ºC, 2000h, rated power


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    PDF 2512E50R0JS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10) 2512E50R0JS

    2010 - thermal camera

    Abstract: IPC-4101 Sn60Pb40 solder Sn60Pb40 JESD22-B102D J-STD-002B 106G 208H 210F Res 2512
    Text: J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface , -55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test 70ºC, 2000h


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    PDF CFA2512E50R0JS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10) thermal camera IPC-4101 Sn60Pb40 solder JESD22-B102D J-STD-002B 106G 208H 210F Res 2512

    2008 - IPC4101

    Abstract: No abstract text available
    Text: 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability Test". 3. Parts mounted , -55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test 70ºC, 2000h, rated power


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    PDF 2512E50R0FS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0FS-T10) IPC4101
    ...
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