vqfp100 package
Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
Contextual Info: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.
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copyqfp80vhtqfp64vuqfp64uqfp80+15uqfp100tqfp64utqfp80utqfp100uuqfp120tqfp128uvqfp100 packageto220cp-3sop8 package trayvsof5tqfp176utssop-b8jtssop-b14tl 32 icpvqfp100
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BQFP100
Abstract: vqfp100 package PQFP80 VQFP100
Contextual Info: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 459 Suitable for development and experiments with different package types. All adapters could be connected with the pin-headers to a number of different prototyping boards with 2.54mm Hole spacing. The connection between the prototyping board and the SMD
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bqfp10020x2018x18vqfp100+4pqfp100r16x22vqfp100 packagepqfp80
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str 450 a
Abstract: BQFP100 VQFP100 vqfp100 package
Contextual Info: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 450 Suitable for development and experiments with different package types. All adapters could be connected with the pin-headers to a number of different prototyping boards with 2.54mm Hole spacing. The connection between the prototyping board and the SMD Adapter
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bqfp10020x2018x18vqfp100+4pqfp100r16x22str 450 avqfp100 package
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68fl
Contextual Info: Introduction Standard IC packages SIP/HSIP Power typey/ZIP/SZIP TO-220FP TO-92 10-0 ? 4>3 .2 ± 0 .1 I I 2 .8 _ TÏ— ? 1.3 0.8 3 2 .s * ± 0 . s \ [ ¡, 2 . 5 4 * 0.5 SIP5 FTR r H .B ± 0 .2 UÎ-jJiÜ 1 I q 2 .4 ± 0 .2 Î 0.6 0.8 Uj a SIP8 SIP7 I6 .8 ± 0 .2
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vqfp100 package
Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
Contextual Info: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request
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descrqfp80vhtqfp64vuqfp64uqfp80+10uqfp100tqfp64utqfp80utqfp100uuqfp120tqfp128uvqfp100 packagessop-a20contact image sensorvqfp100
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vqfp100 package
Contextual Info: ravim •BU12200 series Parameter Integrated counts BU12206 BU12207 DU12208 BU12209 BU12210 Total No. of gates 5760 10476 13888 20100 25200 43560 Usable gates 3168 5762 7638 11055 13B60 23958 Total No. of PADs 88 108 128 152 168 216 No. of l/Os 78 98 118 142
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array/bu12200bu12200bu12206bu12207+7du12208bu12209bu1221013b60bu12211sqfp160vqfp100 package
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XC2018 PC84
Abstract: xc4300 XC4020 HQFP208 HQFP34 XC1765D XC3342 XC4305 XC4005E PHYSICAL XC500 356E-09
Contextual Info: The Reliability Data Program Expanded Version April 1, 1998 Cover TABLE OF CONTENTS Introduction .3 The Reliability Program. .3
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plcc-20xc2018 pc84xc4300xc4020 hqfp208+7hqfp34xc1765dxc3342xc4305xc4005e physicalxc500356e-09
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vqfp100 package
Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Contextual Info: Dimensions I l l II I I I I Dimensions •DIP/SDIP/SK-DIP Unit : mm DIP 14 DIP8 o o 0. 5+ 0. I O’ - |[o's±o. 15" 1 O' ~ I 5 ' DIP 18 DIP 16 o 19 . 4 ± 0. 3 l?6_ ' o 9 -t-i I l;.5±o, I ’o" DIP22 DIP20 22 O 12 () ) o O H J v °.5 .± 0 . I 0.5± 0. I
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dip20dip22dip24dip28+14sqfp56vqfp80fp-a64fp-t80sqfp-t80sqfp100vqfp100 packagevqfp-100tray sop24065jschp30p04mba4558f-t1sqfp-144
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A9701
Abstract: MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4
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plcc-20a9701mil-prf38535xc1700d+7xc7000xc9500xc4310xc3390avqfp100 packagexc95xxxcs40 failure
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SIP10
Contextual Info: Introduction Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP □ w O .S I O .I 0 .« ± 0 .l FTR SIP5 I l.8 ± 0 .2 n tv - I i ] I 0.5 5 ± 0 ,1 2.54 r 2 .4 ± 0 .2 1 n □ i H 0 .6 0.8 1 o .3 ± 0 . > I ¿J SIP7 SIP8 uwii) wii; w Jtr v ll lil U
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ZM 1182
Abstract: 03IJH
Contextual Info: Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP FTR SIP5 11.8±0.2 3 — b B 2.4±0.2 i ¥ 0.6 0.8 SIP7 SIP8 SIP9 SIP10 Audio Integrated Circuits MHrn n |0 .3 ± 0 . I 21 HSIP10 SIP-M12 3.6±02 HSIP-B12 ZIP9 J t t e ZIP12 ZIP16 I 0.5±0. I
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Cqfp256
Abstract: RQFP240 SI-EX-TCA Act2 FPGA CQFP 172 A1280A SDO RQFP208 06M7374 ACTEL A42MX09 PQFP208 RT1280A
Contextual Info: Silicon Explorer II User's Guide Actel Corporation, Mountain View, CA 94043-4655 2003 Actel Corporation. All rights reserved. Printed in the United States of America Part Number: 5029134-1 No part of this document may be copied or reproduced in any form or by any means without
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act1/40mxcqfp256rqfp240si-ex-tca+7act2 fpga cqfp 172a1280a sdorqfp20806m7374actel a42mx09pqfp208rt1280a
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BU12101
Abstract: BU12108 BU12102 BU12104 BU12110 vqfp100 package BU12107 SQFP144 VQFP64 BU12105
Contextual Info: CMOS Gate array BU12102 BU12103 BU12104 BU12105 BU12106 BU12107 BU12108 BU12109 BU12110 BU12111 1224 2496 3240 4352 5616 9200 14616 21280 31280 39140 66960 673 1372 1782 2393 3088 5060 8038 11704 17204 21527 36828 32 44 48 56 72 88 108 128 152 168 216 Integrated counts Usable gates 55%
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03mn
Contextual Info: Introduction Standard IC packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-220FP 3.7i 0 7 U iO ? r ' □ _ 0 S ID I I 21 f 1 128 üi p 0 45 tO. I _ Q [?.3 10.8 3 1.27 2 .5 4 1 0 .5 FTR JI [? .5 4 ± 0 .5 SIP5 2. 0 . 0.2 I I . B i d .2 2M 2.bä^ SIP7 SIP8 16 .8 10 .2
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BU12307
Abstract: vqfp100 package BU12310
Contextual Info: CMOS Gate array CMOS gate array/BU12300 series ultra multiple pin type •BU12300 seríes BU12307 Parameter Integrated counts BU12308 BU1230Q BU12310 BU123Î1 Total No. of gates 4650 6660 10282 12744 22152 Usable gates 2502 3764 5655 7009 12183 Total No. of PADs
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array/bu12300bu12300bu12307bu12308+7bu1230qbu12310bu1233vsqfp16028x2820x20vqfp100 package
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BU12101
Abstract: BU12300 vqfp100 package
Contextual Info: CMOS Gate array CMOS gate array/BU12100 series high integration •BU12100 series BU12101 BU12102 BU12103 BUI2104 BU12105 BU12155 BU12106 BLM2107 BUI2108 BUI2109 BU12ÎIO BU12ÎI1 BU12113 Param eter T otal No. o f gates 1224 2496 3240 4352 5616 7216 9200
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BU12108
Abstract: BU12101 BU12100 vqfp100 package
Contextual Info: CMOS Gate array CM OS gate array/BU12100 series high integration # BUI2100 series BU12101 BUI2102 BUI2103 BUI2104 BU12105 BU12155 BU12106 BUI2107 BU12108 BUI2109 BU12H0 BU12YH BU12«3 Parameter Integrated counts Total No. of gates 1224 2496 3240 4352 5616
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array/bu12100bui2100bu12101bui2102+9bui2103bui2104bu12105bu12155bu12106bui2107bu12108bu12100vqfp100 package
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BU9716K
Abstract: darlington buffer array vqfp100 package VQFP48 1 wire 7 segment lcd controller display driver dip16
Contextual Info: Monolithic ICs Transistor Array Part No. BA612 input active Output current Circuit Input resistance Input/output relation level relation construction kfl Number Maximum output Output current CmA) of circuits voltage (V) 24 450 25 BA6256 11 450 25 BA664 27
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16sx4g15sx11g-16sqfp44bu2872ak+10bu2879akssop-b16bu2082fvbu2087fvbu9716kdarlington buffer arrayvqfp100 packagevqfp481 wire 7 segment lcd controllerdisplay driver dip16
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BU12101
Abstract: BU12110 BU16503 BU12300 BU12104 vqfp100 package BU16515 8038 function generator application 16x4 ram vhdl BU242
Contextual Info: Introduction Microcontrollers and CMOS gate arrays Following is a summary of the microcontrollers and CMOS gate arrays offered by ROHM. For further details and data sheets for these devices, please contact your local representative. 4-bit single chip microcontrollers
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vqfp100 package
Abstract: S2P24 BA4558F-T1
Contextual Info: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP
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PLCC18
Contextual Info: Package Information Package Information Package Drawings Page Plastic Dual–In–Line Package PDIP 8–2 Plastic J–Lead Chip Carrier (PLCC) 8–2 Plastic Small Outline Package (SOIC) 8–3 Plastic Quad Flatpack 8–4 Plastic Very–Thin Quad Flatpack*1.0mm (VQFP)
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tqfp44vqfp64vqfp44vqfp80+3vqfp100330mm/13plcc18
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121C-2
Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4
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xc4005xlpqfp-160plcc-84hqfp-304+13vqfp-100xc4044xlxc4013xla121c-2xc1765dxc95108 xlmp8000ch4p103 pot datasheetreliability reportpqfp240xc95xxx17256dd1 pga 478
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Atmel CPLD In-System Program
Abstract: atmel isp atmel 0924a jtag pinout 10 pin female box header PLCC84 package F1508PLCC84 10 way pin header strip 6 pin JTAG header serial isp atmel
Contextual Info: CPLDs Designing for In-System Programmability with Atmel CPLDs Introduction This application note describes design methods and requirements for implementing In-System Programmability ISP with Atmel CPLD devices. ISP is implemented in Atmel devices through
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atf1508as68-pin84-pin100-pin+14160-pin25-pin10-pinatf1500asatmel cpld in-system programatmel ispatmel 0924ajtag pinout10 pin female box headerplcc84 packagef1508plcc8410 way pin header strip6 pin jtag headerserial isp atmel
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PQFP240
Abstract: PQFP208 lattice AMI 602 ZyMOS BGA432 CHIP EXPRESS United Technologies Mostek PQFP160 XILINX Actel PQFP208 l324
Contextual Info: NETRANS PS.QXD A 5/30/00 10:22 AM M E R I Page 1 C A N M I C R O S Y S T E M S , I N C . NETRANS PS.QXD 5/30/00 10:22 AM Page 2 SERIOUS ABOUT CONVERSIONS When We Say We’re The Leader In FPGA-to-ASIC Conversions, We Mean It No one has more experience with FPGA-to-ASIC conversions than
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ga00011cx3/00pqfp240pqfp208 lattice+8ami 602zymosbga432chip expressunited technologies mostekpqfp160 xilinxactel pqfp208l324
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