VIA DIAMETER PITCH Search Results

tqfp 7x7

Abstract: epad "thermal via" 082203
Contextual Info: FAX# 408 944-0970 Recommended Land Pattern for 32 lead 7x7 ePad TQFP Red circle indicates Thermal Via. Size should be .300 mm in diameter and via hole pitch is 1.0 mm and it should be connected to GND plane for maximum thermal characteristic. Disclaimer: This is only a recommendation based on information available to Micrel

land pattern for

Abstract: stencil
Contextual Info: FAX# 408 944-0970 Recommended Land Pattern for MLF 3x3 12 Lead LP # MLF33D-12LD-LP-1 All units are in mm Tolerance ± 0.05 if not noted Red circle indicates Thermal Via. Size should be .300-.350 mm in diameter, 1.00 mm pitch and should be connected to GND

Photodiode Array linear

Abstract: inGaAs photodiode 1550 array PIN photodiode 850 nm PDCA12-70 pin Photodiode 1550 nm 1550 photodiode photodiode array photodiode array 1550 nm pin Photodiode 1300 nm photodiode linear array
Contextual Info: Rev. 03/99 ?`d_ðC`UUTðC1, Via Cantonale, CH-6805 Mezzovico + +41 91 946 33 43 / F ax +41 91 946 33 51 / w w w.optospeed.com ?`d_ðC`UUT 45#&KDQQHO#,Q*D$V S0L0Q#3KRWRGLRGH# 3'&$450:3 $785(6 1x12 p-i-n photodiode array Array pitch 250 µm Diameter of light sensitive area 70 µm

Routability

Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
Contextual Info: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.

Contextual Info: Aerodynamic DDR3 DIMM Sockets, Low Seating Plane LSP , Low Level Contact Resistance (LLCR), Lead-free, 1.00mm Pitch, 240 circuits The ultimate high-density memory interconnect for multi-processor server chipsets, Aerodynamic DDR3 DIMM sockets maximize air flow as well as space and

SPARTAN XC2S50

Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
Contextual Info: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher

0.65mm pitch BGA

Abstract: OMAP35x
Contextual Info: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual

marking code A45

Abstract: marking code B38 RC3740 TSSOP YAMAICHI SOCKET SCEA014 MARKING a47 marking b28 RC3041 RC3715 RC4650
Contextual Info: 32-Bit Logic Families in LFBGA Packages: 96 and 114 Ball Low-Profile Fine-Pitch BGA Packages SCEA014 October 1998 1 2  32-Bit Logic Families in LFBGA Packages: 96 and 114 Ball Low-Profile Fine-Pitch BGA Packages Application Note October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors

RC3041

Abstract: RC3715 RC3740 RC4650 IDT package marking LVCH OREGA
Contextual Info: 32-Bit Logic Families in LFBGA Packages: 96 and 114 Ball Low-Profile Fine-Pitch BGA Packages Application Note October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology

TSSOP YAMAICHI SOCKET

Abstract: TSSOP-56 footprint texas JEDEC Jc-11 mo-205 free IDT marking IDT package marking LVCH JEDEC Jc-11 free OREGA IC280-096-144 marking B44 RC3041
Contextual Info: 32 Bit Logic Families in LFBGA packages: 96 and 114 Balls Low Profile Fine Pitch BGA Packages. Application Note. October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology

Theta JB

Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480
Contextual Info: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)

inGaAs photodiode 1550 array

Abstract: pin Photodiode 1550 nm photodiode Photodiode Array linear photodiode array 1550 nm inGaAs photodiode 1550 pin photodiode 1550 pin Photodiode 1300 nm PIN photodiode ps p-i-n photodiode 10 Ghz
Contextual Info: PDCA12-68 12 Channel InGaAs p-i-n Photodiode REV 09/01 Features Specifications T=25°C 1x12 p-i-n- photodiode array Parameter Sym Min Typ Max Unit Array pitch 250 µm Diameter of light sensitive area 68 µm Responsivity λ = 830 nm R 0.45 Individual pads for each photodiode

LV 1084 73

Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Contextual Info: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA

AN2348

Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Contextual Info: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.

BG329

Abstract: BGA 27X27 pitch
Contextual Info: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines

EPF10K50E

Contextual Info: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

NPTB00004

Abstract: NPT25015 ofdm equations NPT1004 NPT35015 Nitron NPT25100 transistor study NPTB00025 AN-012
Contextual Info: APPLICATION NOTE AN-012 GaN Essentials AN-012: Thermal Considerations for GaN Technology NITRONEX CORPORATION 1 JUNE 2008 APPLICATION NOTE AN-012 GaN Essentials: Thermal Considerations for GaN Technology 1. Table of Contents 1. TABLE OF CONTENTS. 2

EPF10K50E

Abstract: BGA and QFP Package mounting
Contextual Info: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

Contextual Info: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues

micro fineline BGA

Abstract: Epoxy, glass laminate EPC16U88
Contextual Info: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues

fbga Substrate design guidelines

Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
Contextual Info: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB

BGA reflow guide

Abstract: SSYZ015A solder mask microstar micro-star IC pitch 0.3 land pattern
Contextual Info: Application Brief SSYA009A - February 2000 – Revised May 2000 MicroStar Junior  Made Easy Mixed Signal Products ABSTRACT This application brief provides a high level overview of the MicroStar Junior package and its installation and use for thermal dissipation.

cte table bga

Abstract: datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow
Contextual Info: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs