TBGA Search Results

K1S3216B1C-FI70

Abstract: K1S3216B1C K1S3216B1C-I
Contextual Info: Preliminary K1S3216B1C UtRAM Document Title 2Mx16 bit Uni-Transistor Random Access Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 16, 2003 Advanced 0.1 Revised - Changed Package Type from 48 TBGA into 48 FBGA 6.0 x 8.0

I-CUBE

Abstract: OCX256
Contextual Info: Technical Note OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The

K6F8016R6A-EF70

Contextual Info: K6F8016R6A Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft August 21, 2000 Preliminary 0.1 Revise - Change package type from FBGA to TBGA

Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 5, 09/2011 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a

Motorola multimeter

Abstract: multimeter probes MPC8260 digital multimeter diagram digital multimeter circuit
Contextual Info: Application Note AN2271/D Rev. 0, 3/2002 MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the MPC8260 is a 480 ball, 37.5x37.5mm TBGA (tape ball grid array) that provides excellent

M28335

Abstract: OC48 TBR24 ch9i
Contextual Info: M28335 Twelve Port T3/E3/STS-1 Line Interface Unit Data Sheet 500020D December 2001 Ordering Information Model Number Package Description Operating Temperature M28335-11p 580-pin 35 mm TBGA Twelve Port T3/E3/STS-1 LIU –40 °C to +85 °C Revision History

K6F1008V2C-LF55

Abstract: K6F1008V2C-LF70 K6F1008V2C K6F1008V2C-F K6F1008V2C-YF55 K6F1008V2C-YF70 32-STSOP1
Contextual Info: K6F1008V2C Family CMOS SRAM Document Title 128Kx8 bit Super Low Power and Low Voltage CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial Draft November 27, 2001 Preliminary 0.1 Revise - Changed Package Type : 48 36 -TBGA-6.00x7.00 to 32-TSOP1-0813.4F

K9K1208D0C

Abstract: K9K1208Q0C K9K1208U0C K9K1208U0C-HCB0 K9K1216D0C K9K1216Q0C K9K1216U0C
Contextual Info: K9K1208Q0C K9K1208D0C K9K1208U0C K9K1216Q0C K9K1216D0C K9K1216U0C FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Advance 0.0 Initial issue. Sep. 12th 2002 1.0 1.Pin assignment of TBGA dummy ball is changed.

K9F1208D0A

Abstract: K9F1208Q0A K9F1208Q0A-HCB0 K9F1208U0A K9F1208U0A-FCB0 K9F1216D0A K9F1216U0A K9F1216U0A-HCB0 K9F1216U0A-PCB0 Maker
Contextual Info: K9F1208Q0A K9F1208D0A K9F1216D0A K9F1208U0A K9F1216U0A FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial issue. Apr. 25th 2002 0.1 TBGA K9F12XXX0A-DCB0/DIB0 size information is changed.

6152

Abstract: PLX Technology
Contextual Info: . Version 1.1 2004 PCI 6152 Connectivity PCI 6152 PCI 6152-xx33BC ƒ 32-bit, 33MHz Synchronous operation ƒ 5V signal tolerance ƒ 15mm x 15mm TBGA ƒ Transparent Bridge Function ƒ PCI Bus Types ƒ Support for 4 Bus Masters PCI 6152 (PCI 6152-xx66BC) ƒ AGP 2X Port Compatible

BGA 8 x 8 tray

Abstract: tray datasheet bga S576N7
Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of

FCS-32

Abstract: CX28560 fcs32
Contextual Info: 500335A April 22, 2002 CX28560 Product Bulletin Product Affected: CX28560-11P, 680-pin TBGA package 40 mm This document describes conditions that may cause the operation of the above device to deviate from published specifications. TSLP Channel Status Register Always Reads Zero

hsp35

Abstract: C0016
Contextual Info: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008

tray datasheet bga

Contextual Info: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.

IPC-9702

Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
Contextual Info: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale

Contextual Info: K1S321615M UtRAM Document Title 2Mx16 bit Uni-Transistor Random Access Memory Revision History Revision No. History Draft Date 0.0 Initial Draft - Design target 0.1 Revised - Change package type from FBGA to TBGA. - Improve operating current from 30mA to 25mA.

K6F1016U4C

Contextual Info: K6F1016U4C Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft May 17, 2001 1.0 Finalize - Changed 48-TBGA vertical dimension

K6F1616U6M

Abstract: K6F1616U6M-F
Contextual Info: Preliminary K6F1616U6M Family CMOS SRAM Document Title 1M x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft August 22, 2000 Preliminary 0.1 Revise - Change package type : from FBGA to TBGA

"network interface cards"

Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 2, 12/2007 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC™ II Pro processor revision 2.x TBGA

Samsung NAND

Abstract: K9K1216U0C
Contextual Info: K9K1208Q0C K9K1208D0C K9K1208U0C K9K1216Q0C K9K1216D0C K9K1216U0C FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Advance 0.0 Initial issue. Sep. 12th 2002 1.0 1.Pin assignment of TBGA dummy ball is changed.

Contextual Info: K6F2016R4E Family CMOS SRAM Document Title 128K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft February 22, 2001 1.0 Finalize - Change 48-TBGA vertical dimension

K9F5608U0C-PCB0

Contextual Info: K9F5608Q0C K9F5608D0C K9F5608U0C K9F5616Q0C K9F5616D0C K9F5616U0C FLASH MEMORY Document Title 32M x 8 Bit , 16M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial issue. Apr. 25th 2002 Advance 1.0 1.Pin assignment of TBGA dummy ball is changed.

nec 2565

Abstract: tray bga 576 tray datasheet bga
Contextual Info: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40

M33 thermal

Abstract: QUICC Engine for mpc8360 8 port Gigabit ethernet switch at25 dc cbc no "network interface cards" AL667
Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 5, 09/2011 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a