S576N7 Search Results

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

BGA 8 x 8 tray

Abstract: tray datasheet bga S576N7
Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of

lg crt monitor circuit diagram

Abstract: micro servo 9g samsung lcd tv power supply diagrams MP 1008 es uPa2003 8049 microcontroller APPLICATION LG lcd tv tuner pioneer car dvd service manual lg washing machine circuit diagram 8ch pnp DARLINGTON TRANSISTOR ARRAY
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 October 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

HTA06

Abstract: hta08 CBA07 HTD12 HTA12 ic 351 HTA09 CBD16 12-PHY HTA01
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

C10943X

Contextual Info: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13

NEC VR4300

Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
Contextual Info: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6

g30 nec 222

Abstract: AK03 CBD46 HTA09 AG09 CBD21
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD98412 1.5G ATM SWITCH LSI DESCRIPTION The µPD98412 NEASCOT-X15 is an LSI integrating ATM switch functions on a single chip. It has UTOPIA Level2 interfaces and can switch 30 x 30 circuits by connecting multiple PHY devices. This LSI employs a shared

Contextual Info: 576 PIN TAPE BGA HEAT SPREADER TYPE (40x40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.

ag-07

Abstract: hta08 HTA06 HTD12 HTD13 nec ac03 l05 cg ag02 AK07 AG07
Contextual Info: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT µPD98412 ADVANCED ATM SWITCH LSI DESCRIPTION The µPD98412 NEASCOT-X15 is an LSI integrating ATM switch functions on a single chip. It has UTOPIA Level2 interfaces and can switch 30 x 30 circuits by connecting multiple PHY devices. This LSI employs a shared

uPD3599

Abstract: transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Seimi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 April 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

hta08

Abstract: HTA06 HTD12 HTD24 IC 501 CBA07 CBD70 CBD50 HTA09 HTD08
Contextual Info: データ・シート MOS 集積回路 MOS Integrated Circuit PD98412 1.5G ATM Switch LSI μPD98412（NEASCOT-X15 ）は，ATM スイッチ機能を 1 チップに搭載した LSI で，UTOPIA Level 2 インタフェー スを持ち，マルチ PHY 接続を利用して 30x30 回線をスイッチングできます。また，共有バッファ方式ノンブロッキ

ag08

Abstract: ic 437 CBD22 CBD50 hta13
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD98412 1.5G ATM SWITCH LSI DESCRIPTION The µPD98412 NEASCOT-X15 is an LSI integrating ATM switch functions on a single chip. It has UTOPIA Level2 interfaces and can switch 30 x 30 circuits by connecting multiple PHY devices. This LSI employs a shared

HTA06

Abstract: hta08 HTD12 ic 351 HTA01 ag08 HTA09
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

AB244A

Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
Contextual Info: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002

M9627

Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Contextual Info: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case

marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

f6 diode

Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Contextual Info: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27

nec 44 pin LQFP

Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)

hta08

Abstract: HTA06 HTD12 HTD24 AC03 nec CBD46 l05 cg CBA04 HTA07 AK07
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD98412 1.5G ATM SWITCH LSI DESCRIPTION The µPD98412 NEASCOT-X15 is an LSI integrating ATM switch functions on a single chip. It has UTOPIA Level2 interfaces and can switch 30 x 30 circuits by connecting multiple PHY devices. This LSI employs a shared