TSSOP56 PACKAGE Search Results

land pattern for TSSOP56

Abstract: TSSOP56 package TSSOP56
Contextual Info: 56-Pin Thin Shrink Small Outline Package TSSOP56 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max A 0.1 ±0.05 1.0 ±0.05

TSSOP56 package

Abstract: TSSOP56
Contextual Info: 56-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP56 Package Tape Dimensions 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 Unit: mm Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1

TSSOP56

Abstract: RE933-10
Contextual Info: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm

Contextual Info: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A

Contextual Info: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 28 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT

TSSOP56

Abstract: TSSOP-56
Contextual Info: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max

sot364

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP56

Contextual Info: PDF: 2003 Mar 26 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

SOT364-1

Abstract: TSSOP56
Contextual Info: PDF: 2003 Apr 11 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP56

Abstract: TSSOP56 package TSSOP-56
Contextual Info: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0

MO-194

Abstract: sot481
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5

MO-194

Abstract: TSSOP56 sot481
Contextual Info: PDF: 2001 Nov 23 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L detail X 1 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

JEDEC MO-153

Abstract: TSSOP56
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP56 footprint

Abstract: TSSOP56 package TSSOP56 bo 139
Contextual Info: DIMENSIONS REF. mm inch MIN. TYP. MAX. MIN. A TYP. 1.2 A1 0.05 A2 0.047 0.15 0.002 0.9 0.006 64-LEAD THIN SHRINK SMALL OUTLINE 0.035 b 0.17 0.27 0.0067 0.011 c 0.09 0.20 0.0035 0.0079 D 13.9 14.1 0.547 0.555 E 7.95 8.25 0.313 0.325 E1 6.0 6.2 0.236 0.244 e

Contextual Info: PC F8 536 PC A8 536 NXP LCD driver PCA8536 and PCF8536 I2C/SPI LCD and PWM LED controller for industrial and automotive applications This advanced, highly integrated LCD controller drives up to eight backplanes, up to 44 segments, and up to 320 elements, and provides an on-chip, 6-channel PWM controller for LED illumination.

DDR2 SSTL class

Abstract: SSTL_18 DDR1-400 DDR2 SDRAM with SSTL_18 interface TVSOP-48 SSTL-18 PCK2059 SSTV16857 DDR200 hp SSTU32866
Contextual Info: Memory interfaces Support logic for memory modules and other memory subsystems Portfolio overview PC100 to PC133 • AVC, ALVC, AVCM, and ALVCH series registered drivers • PCK2509 and PCK2510 series PLL clock buffers DDR200 to DDR266 • SSTV and SSTL series registered drivers

Contextual Info: NXP display demo with LCD driver PCF8576 & capacitive sensor PCA8885 Touch-sensitive segmented 4 x 40 display Developed through a partnership with Truly, this advanced display showcases the LCD driver PCF8576 and the capacitive sensor PCA8885. It can be used to drive a segmented

74CBTLV16211

Abstract: 74CBTLV16211DGG JESD22-A114E TSSOP56
Contextual Info: 74CBTLV16211 24-bit bus switch Rev. 02 — 26 August 2009 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to

74CBTLV16211

Abstract: 74CBTLV16211DGG TSSOP56
Contextual Info: 74CBTLV16211 24-bit bus switch Rev. 03 — 12 January 2010 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to

74CBTLV16211

Abstract: 74CBTLV16211DGG TSSOP56
Contextual Info: 74CBTLV16211 24-bit bus switch Rev. 4 — 16 August 2010 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to

SC28L198

Abstract: SCC2691AC1A28 LCD 09151 CSOT109 PCA9552 PCK2002 PCF8591 APPLICATION pecl clock so8 PCA9550 PCA9553
Contextual Info: Interface Products Interface Products 67 I2C Logic Family Overview • Analog/Digital Converters It is frequency required to record analog information, such as temperature, pressure, battery level, signal strength, etc. The analog voltage information from the diode, pressure sensor,

ULx2003

Abstract: ULN2066 ST232B L604 STOTG04E ULN 232 RS-423 ST202EB ST202EC ST207EB
Contextual Info: Interface ICs Selection guide October 2009 www.st.com/interface Interface standards Interface ICs are a collection of standard functional blocks that provide a means to connect logic level signals to the various voltages and current requirements of transmission lines and buses. With this in mind a variety of Recommended

74CBTLV16211

Abstract: 74CBTLV16211DGG JESD22-A114E TSSOP56
Contextual Info: 74CBTLV16211 24-bit low-voltage bus switch Rev. 01 — 20 June 2008 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to

TSSOP-56

Abstract: resin compound bond wire gold
Contextual Info: Fairchild Semiconductor Product Package Material Disclosure Package Type Weight of Package grams Component TSSOP-56 Lead Frame Copper alloy Maximum Minimum Material 2.21E-01 2.08E-01 Weight in grams Substance in material 7.37E-02 Copper Nickel Silicon Magnesium