TSOP-48 FOOTPRINT Search Results

PA48TS20-OT

Abstract: 48TS20-1
Contextual Info: PA48TS20- 1 OT Data Sheet 48 pin TSOP socket/48 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect the pins of a 48 pin TSOP device to a 48 pin DIP equivalent. They accept a TSOP device and plug into a DIP socket. The adapter is made up of 2 sub-assemblies. They assemble via

29f800 29f400

Contextual Info: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP

Contextual Info: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.

29F800 equivalent

Contextual Info: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP

Contextual Info: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via

A6 TSOP-6 MARKING

Contextual Info: S29AL016D 16 Megabit 2 M x 8-Bit/1 M x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Datasheet ADVANCE INFORMATION Distinctive Characteristics Architectural Advantages Package Options „ Single power supply operation „ 48-ball FBGA „ 48-pin TSOP — Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications

5189

Abstract: AS7C1
Contextual Info: $GYDQFH#LQIRUPDWLRQ $6:&5873<;// 5189#589.[49#,QWHOOLZDW#ORZ#SRZHU#&026#65$0 HDWXUHV • • • • • Smallest footprint packages - 48 ball FBGA - 400 mil TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA

Zn107

Contextual Info: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA

Contextual Info: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64359// 6169#97.ð49#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA

AS7C31024LL-55BC

Abstract: AS7C31024LL-55TC AS7C31024LL-55TI
Contextual Info: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64357// 6169#45;.ð;#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • TTL/LVTTL-compatible, three-state I/O • JEDEC registered packaging - 32-pin TSOP packag - 48-ball 8mm x 6mm CSP BGA

AS7C1

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA

Contextual Info: $GYDQFHLQIRUPDWLRQ &// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA

CQM1-ID212

Contextual Info: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA • Center power and ground pins for low noise • ESD protection ≥ 2000 volts

Contextual Info: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • JEDEC registered packaging - 32-pin TSOP package - 48-ball 8mm x 6mm CSP BGA • ESD protection ≥ 2000 volts

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA

K4S280432

Abstract: tsop sensor 8291 tsop sensors samsung NAND FLASH BGA micron BGA SDRAM 48 tsop flash pinout
Contextual Info: Data Sheet Part No. ISSD32M8STB Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 32M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a

8291

Abstract: tsop sensor tsop sensors K4S560832
Contextual Info: Data Sheet Part No. ISSD32M16STC Irvine Sensors Corporation Microelectronics Products Division 512 Mbit 32M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a

tsop sensor

Abstract: tsop sensors K4S640832 BGA 48 "8 x 8" memory micron
Contextual Info: Data Sheet Part No. ISSD8M16STC Irvine Sensors Corporation Microelectronics Products Division 128 Mbit 8M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a

tsop sensor

Abstract: TSOP 54 PIN footprint K4S280832 ISSD16M16STC tsop sensors 256 pin bga pinout Irvine Sensors
Contextual Info: Data Sheet Part No. ISSD16M16STC Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 16M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a

tsop sensor

Abstract: tsop sensors Mitsubishi part numbering micron nor Flash
Contextual Info: Data Sheet Part No. ISSD16M8STB Irvine Sensors Corporation Microelectronics Products Division 128 Mbit 16M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a

Irvine Sensors Corporation

Contextual Info: Data Sheet Part No. ISDD64M8STC Irvine Sensors Corporation Microelectronics Products Division 512Mbit 64M x 8 DDR DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a

TSOP 54 PIN footprint

Abstract: 256MBIT NOR FLASH tsop sensors Micron NAND DQS ddr 3 tsop k4h280838 stc 3001 256-MBIT
Contextual Info: Data Sheet Part No. ISDD32M8STC Irvine Sensors Corporation Microelectronics Products Division 256Mbit 32M x 8 DDR DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a