TSOP PACKAGE TRAY Search Results

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

Contextual Info: LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Rev. 0.6 Rev. 1.0 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package

intel standard marking

Contextual Info: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED DATA I/O ProMaster 970 • ■ ■ ■ Programs, sorts, and marks up to 110 devices per hour Supports memory, microcontroller, and logic devices Package support: µBGA*, SOP, SSOP, TSOP and others Media supported: tube, tray, and

tsop Shipping Trays

Contextual Info: Section 4 Thin Sm all O utline P a c k a g e T H IN SMALL O U TLIN E PACKAGE TSO P DES C R IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry’s leading edge plastic, surface mountable memory package today. System requirements for higher den­

Unmanned Solutions

Contextual Info: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED UNMANNED SOLUTIONS AH 500 • ■ ■ ■ ■ No more bent leads Program Intel Flash memory and other programmable devices in 3256 TSOP and other package standards User-friendly interface Programmer options: System

Contextual Info: TRAY CONTAINER UNIT : mm 335±1.0 15.5±0.5 304±0.5 21.25±0.5 137.5±0.5 180±1.0 27.5±0.1 16±0.1 20.6 A' NEC LA–3286A 8.2 HEAT PROOF A SECTION A–A' 20.6 0.4 0.3 2.3 6.2 4.9 8.0 1.5 18.0 Applied package 32 pin • plastic TSOP I (8 x 20) Quantity (pcs)

LY61L5128

Contextual Info:  LY61L5128 512K X 8 BIT HIGH SPEED CMOS SRAM Rev. 2.3 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised ICC and ISB1 Revised Test Condition of ISB1/IDR

Contextual Info:  LY62L12816 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.3 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Description Initial Issue Revised Package Outline Dimension TSOP-II Added ISB1/IDR values when TA = 25℃ and TA = 40℃ Added SL grade

MR4A16BC

Abstract: MR4A16BCMA35 tsop-ii tray 11.76 54-TSOP 54TSOP TSOP 54 tray MR4A16B MR4A MR4A16BM MR4A16BMYS3
Contextual Info: MR4A16B FEATURES 1M x 16 MRAM • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP package

LY62L25616

Contextual Info:  LY62L25616 256K X 16 BIT LOW POWER CMOS SRAM Rev. 2.5 REVISION HISTORY Revision Rev. 1.0 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Rev. 2.4 Rev. 2.5 Description Initial Issue Revised ISB max : 0.5mA => 1.25mA Revised Package Outline Dimension(TSOP-II) Deleted L Spec.

Contextual Info: LY6125616 5V 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.4 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Rev. 2.4 Description Initial Issue Revised VIL = 0.6V => 0.8V Revised Package Outline Dimension TSOP-II Added LL Spec.

LY615128

Contextual Info: LY615128 5V 512K X 8 BIT HIGH SPEED CMOS SRAM Rev. 1.2 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised VTERM to VT1 and VT2 Revised Test Condition of ICC/ISB1/IDR Revised FEATURES & ORDERING INFORMATION

Contextual Info:  LY62L6416 64K X 16 BIT LOW POWER CMOS SRAM Rev. 1.3 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Description Initial Issue Revised Package Outline Dimension TSOP-II Added ISB1/IDR values when TA = 25℃ and TA = 40℃ Added SL grade Deleted L grade

Contextual Info: LY615128 5V 512K X 8 BIT HIGH SPEED CMOS SRAM Rev. 1.5 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised VTERM to VT1 and VT2 Revised Test Condition of ICC/ISB1/IDR

Contextual Info:  LY6125616 5V 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.2 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev. 2.1 Rev. 2.2 Description Initial Issue Revised VIL = 0.6V => 0.8V Revised Package Outline Dimension TSOP-II Added LL Spec. Revised Test Condition of ISB1/IDR

JEDEC TRAY DIMENSIONS

Abstract: TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 shipping tray jedec tray scale TSOP package tray
Contextual Info: _L _L _L 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 208. 3. TRAY VACUUM PICKUP METHOD REQUIRES A 28m m SQUARE MINIMUM WALLED PICKUP AREA , LOCATED AS CLOSE TO

NEC 321

Contextual Info: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 137.5±0.5 12.1 A' NEC LA - 3A63A HEAT PROOF 18.5 A 12.1 <SECTION A - A'> 9 8.8 5.8 180±1.0 21.25±0.5 32±0.1 6.8 Tray LA-3A63A Carbon PPE Material Heat Proof Temp. Surface resistance 135° C

ATMEL 234

Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

28 TSSOP JEDEC Thin Matrix Tray outlines

Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions