400MIL22 Search Results

TSOP 86 Package

Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL22 70 pin TSOP (II) (400 mil) 70 36 detail of lead end E S L P 1 1 R 35 A G F D M M C B N K I J H ITEM MILLIMETERS INCHES 1) Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.

TSOP 86 Package

Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Contextual Info: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 70 pin TSOP (II) (400 mil) 70 36 F E 3° +7° –3° detail of lead end 1 35 A M M L B K N G D C I J H S70G5-65-7KG NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at

TSOP 54 tray

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL22 70 pin TSOP (II) (400 mil) 70 36 detail of lead end F G 1 R 1 35 P L A S E H I J H C D K N B M M ITEM MILLIMETERS INCHES 1) Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL22 70 pin TSOP (II) (400 mil) 70 36 E 3°+7° –3° F detail of lead end 1 35 A H J K G I N C D B L M M S70G5-65-7JG NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case