TSOP 54 SOCKET Search Results

100-pin dimm

Abstract: DIMM 100-pin SL32L8E32M4G-A10V BDQ28 a1385 A-1385
Contextual Info: SL32L8E32M4G-A10V 32M X 32 Bits SDRAM 100-Pin DIMM FEATURES GENERAL DESCRIPTION • • • The SiliconTech SL32L8E32M4G-A10V is a 32M x 32 bits Dynamic RAM DRAM Dual-Inline Memory Module (DIMM). The module consists of eight CMOS 4M x 8 bits x 4 banks SDRAMs in 54-pin 400-mil TSOP-II packages mounted on a

100-pin dimm

Abstract: A1385
Contextual Info: SL32L8E16M4G-A10V 16M X 32 Bits SDRAM 100-Pin DIMM FEATURES GENERAL DESCRIPTION • • • The SiliconTech SL32L8E16M4G-A10V is a 16M x 32 bits Dynamic RAM DRAM Dual-Inline Memory Module (DIMM). The module consists of four CMOS 4M x 8 bits x 4 banks SDRAMs in 54-pin 400-mil TSOP-II packages mounted on a

OTS-48-0.5-01

Abstract: OTS-44 TSOP 173 g OTS-24 ic 1496 specifications OTS-56 OTS-32-0 OTS-54-08-04 OTS-54-0 OTS-48-0
Contextual Info: TSOP THIN SMALL OUTLINE PACKAGE ORDERING PROCEDURE OTS □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ・50mΩ・100mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

CIC-56TS-48D-B6-YAM-S

Abstract: cic56ts48d-b6-yam
Contextual Info: CIC-56TS-48D-B6-YAM-S REV 2 56-Lead TSOP to a 48-Pin DIP 6/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: E28F016XS SOCKET: Yamaichi IC191-0562-003N QTY PRICE EACH 1-4 5-9 10-24 25-49 $200.00 $180.00 $170.00 $150.00 PRICING: TYPICAL DIMENSIONS: (Drawings not to scale)

TSOP 54 socket

Abstract: IC189 TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230
Contextual Info: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 042 2 - 025 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65

Contextual Info: CIC-56TS-40D-D6-YAM-S REV 2 56-Lead TSOP to a 40-Pin DIP 7/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: A BASE 40-Pin DIP E28F016XS TE28F160S3 / S5 B (TE extended temp range) SOCKET: Yamaichi IC191-0562-003N PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49

tsop 338

Abstract: TSOP 54 socket IC189-0562-078 IC189-0562-067 IC189 TSOP 56 socket IC189-0702-074 tsop 138 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0642
Contextual Info: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 064 2 - 007 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

IC 4407

Abstract: IC235 TSOP 54 socket IC235-0442-207 4407 pin details 4407 TSOP 50 socket IC235-0542-218-2 IC235-0242-202 IC235-0082-236
Contextual Info: IC235 Series Open Top Thin and Small Outline Package (TSOP -Type II / SOP) Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. –40°C to +150°C 10,000 insertions min. 30g min. per pin at minimum

Contextual Info: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

IC 2272

Abstract: IC 2272 ac TSOP 54 socket IC363-0502-001 IC363-0662-003 TSOP 56 socket IC363-0542-002 2272 ic 234-0005
Contextual Info: IC363 Series Open Top Thin Small Outline Package (TSOP - t y p e II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: Operating Force:

TSOP 48 Pattern

Abstract: 980020 TSOP 54 SOCKETS TSOP 54 SOCKETS smt mount ALPTEX 32TSOP 56TSOP SOCKET p PINOUT 980020-XX-XX TSOP 48 socket
Contextual Info: C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com Copyright ALPTEX, Inc. 1998 TSOP FlexProbes 0,50mm (.0197") Pitch

IC51-0162-150

Abstract: IC51-0082-763 IC51-0242-1341 IC51-0562-1514 IC53-0642-911 IC51-0202-779 IC51-0322-667 IC51-0382-2036 IC51-0482-2018 IC51-0562-2144
Contextual Info: Series Overview *SOP Small Outline Packages, Gullwing Leads SMT Devices *SOP variations e.g. TSSOP. Series IC51 (Clamshell) SOP, TSOP Type I & II 0.4 to 1.27mm Pitch Part Number (Details) Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute

Contextual Info: HB56T132D Series 1,048,576-word x 32-bit High Density Dynamic RAM Module ADE-203Rev. 0.0 Dec. 1, 1995 Description The HB56T132D is a 1 M × 32 dynamic RAM Small Outline DIMM S. O. DIMM , mounted 8 pieces of 4-Mbit DRAM (HM514400CTT/CLTT) sealed in TSOP package. An outline of the HB56T132D is 72pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56T132D makes high

Contextual Info: HB56T132D Series 1,048,576-word x 32-bit High Density Dynamic RAM Module HITACHI ADE-203Rev. 0.0 Dec. 1, 1995 Description The HB56T132D is a 1 M x 32 dynamic RAM Small Outline DIMM S. O. DIMM , mounted 8 pieces of 4-Mbit DRAM (HM514 4 00 C T T /C LT T ) sealed in TSOP package. An outline of the HB56T132D is 72pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56T132D makes high

Contextual Info: HB56TW132D Series 1,048,576-word x 32-bit High Density Dynamic RAM Module HITACHI ADE-203Rev. 0.0 Dec. 1, 1995 Description The HB56TW132D is a 1 M x 32 dynamic RAM Small Outline DIMM S. O. DIMM , mounted 8 pieces of 4-Mbit DRAM (HM51W4400BTT/ BLTT) sealed in TSOP package. An outline o f the HB56TW132D is 72pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56TW132D makes high

Contextual Info: HB56TW132D Series 1,048,576-word x 32-bit High Density Dynamic RAM Module HITACHI ADE-203Rev. 0.0 Dec. 1, 1995 Description The HB56TW132D is a 1 M x 32 dynamic RAM Small Outline DIMM S. O. DIMM , mounted 8 pieces of 4-Mbit DRAM (HM51W4400BTT/ BLTT) sealed in TSOP package. An outline of the HB56TW132D is 72pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56TW132D makes high

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

CDC2509

Abstract: ra5b pc133 sdram PC133R-333-542-b2 PC133 registered reference design AVC BA0 pc133 SDRAM DIMM PC133R-333-542 PC133R-333-542 VOLTAGE pc100 gerber
Contextual Info: PC133 SDRAM Registered DIMM Design Specification Revision 1.0 May 1999 Prepared By IBM and Reliance Computer Corporation PC133 SDRAM Registered DIMM Design Specification Table of Contents 1. Product Description . 4

5- pin smd IC 358

Abstract: P-MQFP-80-1 yamaichi IC Test Socket DK55 TSOP 54 SOCKETS smt mount C176CR C513 HR 7058 IC51-0804-956-2 P-MQFP-44
Contextual Info: YAMAICHI - Product Information page 1 of 6 Karl-Schmid-Straße 9 D-81829 München Telefon 0 89 / 45 10 21-0 Telefax 0 89 / 45 10 21-10 E-mail: sales@yamaichi.de Internet: http://www.yamaichi.de IC149 Production Use Socket for following Siemens IC`s: • C511 / C513

ae29F2008

Abstract: ATMEL eeprom 2816A rom AE29f2008 HN462732G D27C64 AT27C64 ASD AE29F2008 d27C128 Toshiba tmm24128 HN2764
Contextual Info: SALES/INFORMATION HOTLINE: +44 0 1226 767404 GLV32 DEVICE SUPPORT LIST ICE Technology Ltd August 30 2001 DIP devices of 32 pins or less are supported without the need of ANY adapter. Adapter number (see adapter list). Required for PLCC, SOIC or greater than 48 pins.

28F032SA

Abstract: 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 AP-644 Intel 56 TSOP 29220* intel
Contextual Info: E AP-644 APPLICATION NOTE Intel StrataFlash Memory Migration Guide December 1997 Order Number: 292202-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of

IC369

Abstract: socket Yamaichi IC 2267
Contextual Info: IC369 Series Open Top Thin Small Outline Package (TSOP - Type II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: 1,000M Ω min. at 500V DC

IC369

Abstract: IC 2267
Contextual Info: IC369 Series Open Top Thin Small Outline Package (TSOP) - Type II Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA / 20mV max. –40°C to +150°C 10,000 insertions min. 45g ±15g per pin Insulation Resistance: