TSOP 54 II Search Results

54-pin

Abstract: TSOP 54 Package TSOP 54 II
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)

TSOP 54 Package

Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)

54-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)

TSOP 54 tray

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

MT48LC16M8A2BB

Contextual Info: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free

MT48LC16M8A2BB

Contextual Info: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free

TSOP 54 Package

Abstract: TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II 54-PIN
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01)

TSOP II 54

Abstract: TSOP II 54 Package 54PIN 54P3G-C
Contextual Info: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2

TSOP 54 Package

Abstract: TSOP 54 Package used in where 54-PIN TSOP 54 PIN
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02)

TSOP 86 Package

Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)

TSOP 86 Package

Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Contextual Info: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)

54-PIN

Abstract: 082I
Contextual Info: 54-PIN PLASTIC TSOP II (12.70 mm (500) 54 28 detail of lead end E P F 1 27 A D M C M N K S B L S I G J H NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 22.66 MAX. B 0.96 MAX.

tsop 66

Contextual Info: Mounting Pad 54 pin TSOP II (500 mil) 54 28 F E 3° +7° –3° detail of lead end 1 27 A D M M L B N G K C I J H S54G7-80-7KF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. NEC CODE

Contextual Info: 54 PIN PLASTIC TSOP II (500 mil) 54 28 3° E +7° –3° F detail of lead end 1 27 A H I K G J N C D B L M M S54G7-80-7JF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS

Contextual Info: 54 PIN PLASTIC TSOP II (500 mil) 54 28 F E 3° +7° –3° detail of lead end 1 27 A L B N G C M M K D I J H S54G7-80-7KF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS

TSOP 54 PIN

Abstract: 54-PIN 082I
Contextual Info: 54-PIN PLASTIC TSOP II (12.70 mm (500) 54 detail of lead end 28 F P E 1 27 A H G I J S C D N N M S L B NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. K ITEM MILLIMETERS A 22.66 MAX. B 0.96 MAX.

tsop 54 weight

Abstract: 70-PIN
Contextual Info: 70P3S-L Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 52 54 36 E Recommended Mount Pad Symbol 17 1 19 35 A c L D L1 HE ME 70 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1

Contextual Info: GMM27317230ATG LG Semicon Co.,Ltd. Description 16,777,216 WORDS x72BIT SYNCHRONOUS DYNAMIC RAM MODULE Features The GMM27317230ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II

70-pin

Contextual Info: 70P3S-M Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 1 17 35 Recommended Mount Pad E Symbol 54 70 52 36 A c L D L1 HE ME 19 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1

K4S561632J

Abstract: K4S56163 K4S561632J-UI/P60 K4S561632J-UI samsung cmos dram 4m x 4 k4s5616
Contextual Info: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

samsung capacitance year code

Contextual Info: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

54-PIN

Abstract: U27A
Contextual Info: 54-PIN PLASTIC TSOP II (10.16 mm (400) 54 28 detail of lead end S T R L Q 1 U 27 A*2 H I S G N C S J B K D M M NOTES 1. Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 22.42 mm MAX.)

54-PIN

Contextual Info: 54-PIN PLASTIC TSOP II (10.16 mm (400) 54 28 detail of lead end F P E 1 27 A H I G J S L N C D M S B K M NOTES 1. Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. 2. Dimension "A" does not include mold fiash, protrusions or gate

TSOP II 54

Abstract: TSOP 54 Package tsop-54 54P3G-C 54PIN TSOP 54PIN
Contextual Info: E HE 1 54 e EIAJ Package Code TSOP II 54-P-400-0.80 D JEDEC Code – y Weight g b 27 28 F Lead Material Alloy 42 L1 Detail F A2 A c A1 b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2 0.125 0.2 0.05