TSOP 44 PACKAGE Search Results

TSOP 44 Package

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)

TSOP044-P-0400-3

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-44P-M09) 44-pin plastic TSOP (II)

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

Contextual Info: 16 M E G :x4,x8 MICRON I TECHNOLOGY, INC. Q FEATURES 44-Pin TSOP x4 NC DQ0 NC DQ1 - MARKING 4M 4 2M 8 - - • W RITE Recovery OWR/tDPL *WR = 1 CLK *WR = 2 CLK C on tact facto ry for availability.) Al A2 • Plastic Package - OCPL 44-pin TSOP (400 mil) Note:

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend

FPT-44P-M08

Abstract: MAX4435
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 300 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17)

TSOP 86 Package

Abstract: tsop 86
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)

TSOP044-P-0400-1

Abstract: MAX4435
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction

TSOP044-P-0400-3

Abstract: TSOP044-P0400
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction

Contextual Info: • Packages – 44-pin TSOP – 44-pin 400 mil SOJ Features ■ ■ ■ ■ ■ ■ ■ PRELIMINARY V61C51164096 256K X 16 HIGH SPEED STATIC RAM MOSEL VITELIC High-speed: 15, 20, 25 ns Fully static operation All inputs and outputs directly TTL compatible

JEP95

Abstract: MO-133
Contextual Info: ZMD-Standard September 2002 MDS 764 Package TSOP ll 44 (400 mil) Dimensions in millimetres Detail Z G c Based on JEDEC: JEP95 MO-133 1 Dimensions A1 bp D 0,1 M 0,1 e Z 1 LP HE E 44 A2 A Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,20 Amin

uPD444016LG5-A12-7JF

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD444016L 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The µPD444016L is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 3.3 V ± 0.3 V. The µPD444016L is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD444016 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The µPD444016 is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 5.0 V ± 0.5 V. The µPD444016 is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

M144

Abstract: PD444016-8
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT PD444016 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The μPD444016 is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 5.0 V ± 0.5 V. The μPD444016 is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

Contextual Info: Cypress Semiconductor Qualification Report QTP# 98109 VERSION 1.1 June, 2000 44 Ld TSOP Type II Package Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor Assembly: Cypress Philippines

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD434016A 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The µPD434016A is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 5.0 V ± 0.5 V. The µPD434016A is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

PD444016LG5-A8-7JF

Abstract: PD444016LG5-A12-7
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT PD444016L 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The μPD444016L is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 3.3 V ± 0.3 V. The μPD444016L is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT PD444016 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The μPD444016 is a high speed, low power, 4,194,304 bits 262,144 words by 16 bits CMOS static RAM. Operating supply voltage is 5.0 V ± 0.5 V. The μPD444016 is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II).

Contextual Info: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply

Contextual Info: M O SE L V I T E L I C • Packages - 44-pin TSOP - 44-pin 400 mil SOJ Features ■ ■ ■ ■ ■ ■ ■ P R E LIM IN A R Y V61C 51164096 2 5 6K X 16 H IG H SPEED STA TIC R A M High-speed: 15, 20, 25 ns Fully static operation All inputs and outputs directly TTL compatible

TSOP42

Abstract: MX23L1 MX23L1611MC-10 MX23L1611MC-10G MX23L1611MC-12 MX23L1611MC-12G MX23L1611MI-12 MX23L1611PC-10 MX23L1611TC-10 MX23L1611TC-10G
Contextual Info: MX23L1611 3.3 Volt 16-Mbit 2M x 8 / 1M x 16 Mask ROM with Page Mode FEATURES • Current - Operating:40mA - Standby:15uA • Supply voltage - 100ns @3.0V ~ 3.6V - 120ns @2.7V ~ 3.6V • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm) - 42 pin PDIP

MX23L3211

Abstract: MX23L3211MC-10 MX23L3211MC-10G MX23L3211MC-12 MX23L3211MC-12G MX23L3211MC-70 MX23L3211MC-90
Contextual Info: MX23L3211 32M-BIT MASK ROM 8/16-BIT OUTPUT • Current - Operating:40mA - Standby:5uA • Supply voltage - 3.0V ~ 3.6V for 90ns and 70ns speed grades - 2.7V ~ 3.6V for 100ns and 120ns speed grades • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm)