TSOP 28 PACKAGE Search Results

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M04 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend 28-pin plastic TSOP I (FPT-28P-M04) 28-pin plastic TSOP (I) (FPT-28P-M04) 22 21 Details of "A" part

051C

Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP - 24/28-pins Package Code: T Type II N N/2+1 E 1 N/2 D SEATING PLANE H A e B L A1 α C Plastic TSOP (T—Type II) Millimeters Inches Min Max Min Max Symbol Ref. Std. No. Leads 24/28 A 1.00 1.20 A1 0.05 0.20 B 0.36

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

FPT-28P-M03

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M03 28-pin plastic TSOP I Lead pitch 0.55 mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Normal bend

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M04 28-pin plastic TSOP I Lead pitch 0.55 mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M08 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

m14 transistor

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16)

FPT-28P-M06

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M06 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

V62C518256

Contextual Info: MOSEL V I T E L I C PRELIMINARY V62C518256 3 2 K X 8 STATIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin 600 mil PDIP - 28-pin 330 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 5mA (max.) ■ Low Power Dissipation:

TSOP028-P-0400-3

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M07 EIAJ code : TSOP028-P-0400-3 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction

F28027

Abstract: TSOP028-P-0400-1
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M05 EIAJ code : TSOP028-P-0400-1 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction

Contextual Info: fax id: 3020 ¿¡¡P: CYPRESS CY27H512 PRELIMINARY 64K x 8 High-Speed CMOS EPROM Features 28-pin, 600-mil DIP, 32-pin LCC and PLCC, and 28-pin TSOP-I packages. These devices offer high-density storage combined with 40-MHz performance. The CY27H512 is avail­

"pin to pin"

Abstract: V62C318256 Mosel Vitelic sram 32k
Contextual Info: MOSEL VITELIC PRELIMINARY V62C318256 2.7 VOLT 32K X 8 STATIC RAM • Packages – 28-pin TSOP Standard – 28-pin 300 mil SOP (450 mil pin-to-pin) Features ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 2mA (max.) ■ Low Power Dissipation:

TAA 436

Abstract: V62C218256 VITELIC
Contextual Info: MOSEL VITELIC PRELIMINARY V62C218256 2.3 VOLT 32K X 8 STATIC RAM • Packages – 28-pin TSOP Standard – 28-pin 330 mil SOP (450 mil pin-to-pin) Features ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 2mA (max.) ■ Low Power Dissipation:

Contextual Info: fax id: 3026 CY27C256A w CYPRESS 32K x 8 CMOS EPROM Features 28-pin, 600-mil DIP, 32-pin LCC and PLCC, and 28-pin TSOP-I packages. The CY27C256A is available in windowed and opaque packages. Windowed packages allow the device to be erased with UV light for 100% reprogrammability.

AT27C256R

Abstract: AT27C256R-15JC 28P6
Contextual Info: Features • Fast Read Access Time - 45 ns • Low-Power CMOS Operation - 100 [iA max. Standby - 20 mA max. Active at 5 MHz • JEDEC Standard Packages - 28-Lead 600-mil PDIP - 32-Lead PLCC - 28-Lead TSOP and SOIC • 5V + 10% Supply • High Reliability CMOS Technology

TSOP028-P-0400-3

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M07 EIAJ code : TSOP028-P-0400-3 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-28P-M07) * : Resin protrusion. (Each side : 0.15 (.006) Max)

F28027

Abstract: TSOP028-P-0400-1
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M05 EIAJ code : TSOP028-P-0400-1 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-28P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max)

Contextual Info: Features • Fast Read Access Tim e - 45 ns • Low-Power CMOS Operation - 100 jiA max. Standby - 20 mA max. Active at 5 MHz • JEDEC Standard Packages - 28-Lead 600-mii PDIP - 32-Lead PLCC - 28-Lead TSOP and SOIC • 5 V ± 10% Supply • High-Reliability CMOS Technology

Contextual Info: MOSEL VITELIC PRELIMINARY V62C31864 2 .7 V 0 L T 8 K X 8 STA TIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin 300 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 2mA (Max.) ■ Low Power Dissipation:

Contextual Info: Features • Fast Read Access Tim e - 45 ns • Low-Power CMOS Operation - 100 jiA max. Standby - 20 mA max. Active at 5 MHz • JEDEC Standard Packages - 28-Lead 600-mii PDIP - 32-Lead PLCC - 28-Lead TSOP and SOIC • 5 V ± 10% Supply • High Reliability CMOS Technology