TSOP 20 Search Results

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP

Contextual Info: CIC-40TS-40D-F6-YAM-S 40-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F004B3 E28F008B3 E28F016B3 SOCKET: BASE 40-Pin DIP PIN NAMES SOCKET 40-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

tsop6 marking 443

Contextual Info: NTGS3443T1 Power MOSFET 4.4 Amps, 20 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available 4.4 AMPERES 20 VOLTS

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

k4h510438b

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM Pb-Free DDR SDRAM DDR SDRAM Registered Module 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC 66 TSOP II with Pb-Free (RoHS compliant) Revision 1.2 Oct. 2004 Revison 1.2 Oct. 2004

PC133 registered reference design

Contextual Info: Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM Revision History Revision 0.0 July 29. 1999, Preliminary - First generation of datasheet. REV. 0.0 July. 1999 Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM KMM390S6520BN SDRAM DIMM

sf 118 d

Contextual Info: NTGS3441B Power MOSFET -20 V, -3.5 A, Single P-Channel, TSOP-6 Features •ăLow RDS on in TSOP-6 Package •ă2.5 V Gate Rating •ăThis is a Pb-Free Device http://onsemi.com Applications •ăBattery Switch and Load Management Applications in Portable

Contextual Info: NTGS3441T1 Power MOSFET 1 Amp, 20 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available 1 AMPERE 20 VOLTS RDS(on) = 90 mW

Contextual Info: NVGS3130N Product Preview Power MOSFET 20 V, 5.9 A, Single N−Channel, TSOP−6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package AEC−Q101 Qualified and PPAP Capable

Contextual Info: White Electronic Designs W3E64M72S-XSBX 64Mx72 DDR SDRAM BENEFITS FEATURES „ Data rate = 200, 250, 266 and 333Mbs* „ 66% Space Savings vs. TSOP „ Package: „ Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm „ 55% I/O reduction vs TSOP

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

Contextual Info: Shrink-TSOP KMM377S6520BN Preliminary 512MB Registered DIMM 512MB Registered DIMM based on 128Mb SDRAM sTSOP2 Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 Shrink-TSOP KMM377S6520BN

CS18HS02565

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. History Issue Date 1.3 Add green code in part no. Jul. 22, 2005 1.4 Add in 28L TSOP 1-8x13.4mm Mar. 10,2006 1.5 Remove 28L TSOP 1-8x13.4mm Jun. 12,2006 1.6 Revise speed option and DC/AC Characteristics.

W3E64M72S-XBX

Contextual Info: White Electronic Designs W3E64M72S-XBX ADVANCED* 64Mx72 DDR SDRAM BENEFITS FEATURES Data rate = 200, 250, 266 and 333Mbs 66% Space Savings vs. TSOP Package: Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm 55% I/O reduction vs TSOP 2.5V ±0.2V core power supply

Contextual Info: NTGS3130N, NVGS3130N Power MOSFET 20 V, 5.6 A Single N-Channel, TSOP-6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package NV Prefix for Automotive and Other Applications Requiring Unique

CIC-56TS-48D-B6-YAM-S

Abstract: cic56ts48d-b6-yam
Contextual Info: CIC-56TS-48D-B6-YAM-S REV 2 56-Lead TSOP to a 48-Pin DIP 6/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: E28F016XS SOCKET: Yamaichi IC191-0562-003N QTY PRICE EACH 1-4 5-9 10-24 25-49 $200.00 $180.00 $170.00 $150.00 PRICING: TYPICAL DIMENSIONS: (Drawings not to scale)

MBM29F800

Abstract: MBM29F400 MBM29F800BA-90PFTR-SFK MBM29LV800 MBM29LV650 mbm29f MBM29F033 MBM29LV650UE90TR-LE1 MBM29PL160TD MBM29F040C
Contextual Info: SPANSION LLC 915 DeGuigne Drive, P.O. Box 3453 Sunnyvale, California 94088-3453, USA December 15, 2005 Advanced Change Notification No: Subject: 2548 Obsolescence of reverse-TSOP packages and specific speed grade of a product listed below Spansion LLC is announcing the retirement of reverse-TSOP packages in efforts to consolidate and