TRAY BGA 17 Search Results

ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The

nec 575

Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
Contextual Info: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)

JEDEC TRAY DIMENSIONS

Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.

1152 BGA tray

Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.

WY transistor

Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
Contextual Info: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of

tray datasheet bga

Abstract: 0n 33 25
Contextual Info: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L φM φN S F M S A B M

tray datasheet bga

Abstract: 256-pin BGA BGA L WY transistor
Contextual Info: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of

TRAY 15X15

Abstract: bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515
Contextual Info: I AMSUN ELECTRONICS KS8664B_ CDMA/AMPS Dual Mode Modem Processor DATA SHEET Ordering July, Information Dev ice Package KS8664B 196PBGA KS8664BQ 176TQFP 1999 CDMA Team System LSI/Semiconductor SAMSUNG Electronics Co., LTD. [\D r\D ^ Uí KÍ I— o

mask rom

Contextual Info: DDR Code Information 1/2 Last Updated : November 2008 K7DXXXXXXX - XXXXXXX 1 2 3 4 5 1. Memory (K) 6 7 8 9 10 11 12 13 14 15 16 17 18 13. Temp, Power - COMMON (Temp, Power) 2. Sync(DDR) SRAM : 7 C : Commercial, Normal I : Industrial, Normal 3. Small Classification

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

mask rom

Contextual Info: Late Write Code Information 1/2 Last Updated : November 2008 K7PXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) 2. Sync(Late Write) SRAM : 7 C : Commercial, Normal I : Industrial, Normal

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

fBGA package tray 12 x 19

Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
Contextual Info: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)

secucalm

Abstract: SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 HT80C51 I18N 1Z89
Contextual Info: Flash Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 1. System LSI (S) 2. Large Classification : Microcontroller(3) 3. Small Classification C : MASK ROM F : FLASH 3 : MCP 4. Core 1 : 51 4-bit 3 : 17 16-bit

secucalm

Abstract: HT80C51 ARM10 H285 I18N SecuCalm16
Contextual Info: Smart Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)

CCGA

Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
Contextual Info: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:

bga solder ball shear

Abstract: foxconn
Contextual Info: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.

S146

Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Contextual Info: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

tray bga 17

Contextual Info: Async Fast Code Information 1/2 Last Updated : November 2008 K6RXXXXXXX - XXXXXXX 1 2 3 5 4 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) C : Commercial, Normal I : Industrial, Normal 2. Async Fast SRAM : 6 3. Small Classification

Contextual Info: IDT - Integrated Device Technology - PowerSpan II > CA91L8260B > CA91L8260B-. Page 1 of 2 Integrated Device Technology Products | Applications Processor Products | Search | EHB Embedded Host Bridges Support The Analog and Digital Company ™ | PowerSpan II™

BGA PACKAGE TOP MARK intel

Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Contextual Info: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any