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    BGA754

    Abstract: Solder ball shear
    Contextual Info: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original
    13kgf1000gf1000m754pos+329x29bga754solder ball shear PDF

    bga solder ball shear

    Abstract: foxconn
    Contextual Info: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original
    13kgf1000gf1000m754pos+329x29bga solder ball shearfoxconn PDF

    BGA754

    Abstract: foxconn
    Contextual Info: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.


    Original
    13kgf1000gf1000m754pic+3754posbga754foxconn PDF

    foxconn

    Abstract: BGA754
    Contextual Info: SPECIFICATIONS BGA 754 DT BG A CPU Socket BG A SM T Type 1.27X1.27mm[.05X. 05”]Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original
    13kgf1000gf1000m754pos+329x29foxconnbga754 PDF

    BGA754

    Abstract: Solder ball shear bga solder ball shear foxconn
    Contextual Info: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original
    13kgf1000gf1000m754pov-0+6754pos29x29bga754solder ball shearbga solder ball shearfoxconn PDF

    BGA754

    Abstract: Solder ball shear
    Contextual Info: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original
    13kgf1000gf1000m754pos+329x29bga754solder ball shear PDF