TP 0401 Search Results

R222 smd

Abstract: RA516-1 2007-000162 RA523-1 C627 SOT-23 smd R540 63MIL d516 gp SMD R618 SMD C548
Contextual Info: - This Document can not be used without Samsung's authorization - 10 Schematic Material List 10-1 Mainboard Parts List CODE LOCATION CATALOG DESCRIPTION 0401-000191 D16 DIODE-SWITCHING MMBD4148,75V,200MA,SOT-23,TP 0401-000191 D14 DIODE-SWITCHING MMBD4148,75V,200MA,SOT-23,TP

quanta computer

Abstract: quanta quanta zh7
Contextual Info: 5 4 3 2 1 Touch Pad Board TPD D D CONNECT TO MB +5V_TP +5V_TP CN1 5 6 1 2 3 4 C1 0.1u/10V_4 TPCLK_8 TPDATA_8 RIGHT SIDE BUTTON LEFT SIDE BUTTON SW1 TP-R 88513-0401 C SW2 2 1 3 4 5 6 TP-L 2 1 3 4 5 6 C TME-532-S-V-T/R(439) TME-532-S-V-T/R(439) CONNECT TO TP MODULE

samsung r540

Abstract: Samsung R590 R721-R725 C732 SMD 10000NF R616 R617 R714-R715 samsung r580 b16 r649 Smd q535
Contextual Info: - This Document can not be used without Samsung’s authorization - 10. Part List 1 System Board Main System LOCATION SEC CODE NAME SPECIFICATION QUANTITY 0401-000191 DIODE-SWITCHING MMBD4148,75V,200mA,SOT-23,TP 6 D512 0402-001024 DIODE-RECTIFIER MBR0540,40V,0.5A,SOD-123,TP

C3604BD-F

Abstract: EMI500 samsung r540 100nF 50V X7R samsung 1608 resistor r336 r331 r322 r330 r1 B536 c796 b527 B538 c337 pnp
Contextual Info: - This Document can not be used without Samsung's authorization - 10. Part List 1 Internal System 10/100) Internal System(10/100 Mbit) Location R231 SEC Code Name 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608, Specification Quantity 1 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005,

BC647

Abstract: bc657 C1093 smd diode c644 DIODE SMD c336 BC679 BC625 smd diode C645 smd diode c640 smd diode R645
Contextual Info: This Document can not be used without Samsung's authorization. 10. Main System Part List CODE 3920501 0401-000191 DESCRIPTION REFERENCE EA jack-usb-4p-mnt4, JACK-USB;-,-,-,-,- J505 J2501 J2502 3 diode, DIODE-SWITCHING;MMBD4148,75V,200MA,SOT-23,TP D4 D16 D22 D23

77C7

Abstract: 887c 1r12r
Contextual Info: This Document can not be used without Samsung's authorization. 10. Main System Part List CODE 3920501 0401-000191 DESCRIPTION REFERENCE EA jack-usb-4p-mnt4, JACK-USB;-,-,-,-,- J505 J2501 J2502 3 diode, DIODE-SWITCHING;MMBD4148,75V,200MA,SOT-23,TP D4 D16 D22 D23

DS493

Contextual Info: Thi s Docum entcan notbe used wi thoutSamsung' s aut hori zati on. 11. Mai n System PartLi st CODE DESCRI PTI ON REFERENCE EA 3920501 j ack-usb-4p-mnt4,JACK-USB;-,-,-,-,- J505 J2501 J2502 3 0401-000191 di ode,DI ODE-SWI TCHI NG;MMBD4148,75V,200MA,SOT-23,TP

IOY20

Abstract: 401036
Contextual Info: 4 0 0 2 CMOS 8-Stage Presettable Synchronous Down Counters High-Voltage Types (20-Volt Rating CD40102B - 2-Decade BCD Type CD40103B - 8-Bit Binary Type The R CA-CD40102B. and CD40103B consist o f an 8-stage synchronous dow n counter w ith a single o u tp u t w hich is active when the

tp181

Abstract: toshiba hdd schematic board cbf 493 TP223 mt2 tEac CBF 423 diode ba39 toshiba 1,8 hdd schematic board TP182 keyboard and touchpad schematic
Contextual Info: 4-148 KBC3_SUSPWR 1% R11 10K 1% R18 6.65K P1.5V_AUX VDC C20 10nF TP192 TP193 R7 TP? 2.5V AL C6 330uF 7 6 5 TP194 Q57 SI4816DY IHLP-2525CZ-01 L1 4.7uH 25V C14 4700nF 3 8 2 D1 4 G2 1 G1 TP217 TP216 R1 1K TP196 25V C15 220nF TP191 5% TP190 R17 6.8K 1% R15 330K

Contextual Info: ECL100K COMPATIBLE 4-BIT PROGRAMMABLE LOGIC DELAY LINE # E C L 1 0 0 K in p u t and o u tp u t levels # Delays stable and precise # 24-pin D IP package .3 7 5 high # A vailable in delays up to 77.8ns # A vailable in 18 delay steps w ith resolution The fro m 0.1 to 5.0ns

A4G1-1500-02

Abstract: 0402-0008-55 A4G1
Contextual Info: bei S ty le S IP S IP S iP SIP S iP S IP SIP SIP SIP SIP SIP SIP SIP S IP SIP S IP S IP S IP S iP SIP SIP S iP S IP S IP S tP S IP S iD S IP S IP StP SP SIP SIP S IP S IP S IP S IP S IP S IP S IP S IP S IP S iP S iP SiP S IP S IP S IP S iP SIP S IP S IP S IP

4435 m

Contextual Info: F U JITSU I PROGRAMMABLE BICMOS 6 5 5 3 6 -B IT READ ONLY MEMORY B i-C M O S 65536-B IT DEAP PROM 8192 W ORDS X 8 BITS The Fujitsu M B71C44 is high spee d B i-C M O S T T L e le c tric a lly flekJ pro g ra m m a b le read only m e m o ry organized as 16384 w o rds by 8 b its . W ith th re e s ta te o u tp u ts , m em o ry

jrm a55

Abstract: tip 0ff 0401 ANALOG irf 5630 ko 224 4K tantalum capacitors jrm a45 irf 7408 bt 4840 pinout diagram A9F7 29 INCH crt tv FBT pinout chassis 3111 253 3266 2e jrm A45
Contextual Info: PR E FA C E T he IBM P erson al C o m p u te r T ech n ical R eferen ce M anual is designed to pro v id e h ard w are design an d in terfa ce in fo rm atio n . T h is p u b licatio n also provides B asic In p u t O u tp u t S y stem B IO S in fo rm atio n as w ell as p ro g ram m ing su p p o rt m a tter.

HED55XXU12

Abstract: R643 ba731 68F smd code C753 BA43-00151A c649 kubnkm RC410ME BA68-01297A
Contextual Info: 10. Electrical Partlist SEC Code 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000132 0401-000191 0401-000191 0401-000191

Contextual Info: Agilent 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to

Contextual Info: TO SH IBA TH 50VSF0400/0401AAXB TENTATIVE T O S H IB A M U LT I C H IP IN TEG R A T ED C IRCUIT SILICON G A TE C M O S SRAM AND FLASH M EM ORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The T H 50V SF0400/0401A A X B is ft m ixed containing a package 1,048,576-b it SE A M

Contextual Info: HLMP-R100 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to

AN1027

Abstract: HLMP-0301 HLMP-0401 HLMP-0504 HLMP-R100 SN63
Contextual Info: HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet Description Features The HLMP-R100, -0301, -0401, ‑0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to

Aluminum Base LED PCB

Abstract: AN1027 HLMP-0301 HLMP-0401 HLMP-0504 HLMP-R100 SN63
Contextual Info: Agilent 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to

Contextual Info: et I mittm hP AeCwK Al eRtDt " 2.5 mm x 7.6 mm Rectangular LED Lamps Technical Data HLMP-R100 HLMP-0300/0301 HLMP-0400/0401 HLMP-0503/0504 Features • Rectangular Light Emitting Surface • Flat High Sterance Emitting Surface • Stackable on 2.54 mm 0.100

Contextual Info: LED LAMPS AND INDICATORS m g 1 H EW LETT wLkM P A C K A R D 2.5 mm x 7.6 mm Rectangular LED Lamps Technical Data HLMP-R100 HLMP-0300/0301 HLMP-0400/0401 HLMP-0503/0504 Features ’ Rectangular Light Emitting Surface • Flat High Sterance Emitting Surface

Contextual Info: TO SHIBA TH 50VSF0400/0401AAXB TENTATIVE TOSHIBA MULTI CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI CHIP PACKAGE DESCRIPTION The TH50VSF0400/0401AAXB is a package of mixed 1,048,576-bit SRAM and 16,777,216-bit FLASH memory. The SRAM and FLASH memory organized 131,072 words by 8 bits SRAM and 2,097,152

Contextual Info: W hp%H E W LE T T mL'HM PAC KAR D Rectangular Solid State Lamps STATE S0UD HLMP-R100 HLMP-0300/0301 HLMP-0400/0401 HLMP-0503/0504 LAMPS Technical Data Features • R ectan gu lar L ight E m ittin g S urface • F lat H igh S teran ce E m ittin g S urface • S tack ab le on 2.54 mm

3528 SMD Samsung LED

Abstract: c828* npn TC513 PIO500 NPN c823 10W 0.1OHM isl6247 2012 B 100NF samsung 7sz125 10nF 50V Y5V samsung
Contextual Info: This Document can not be used without Samsung’s authorization. 3 System Schematic Diagrams 3-1 Main Board 3-1-1 Schematic Diagrams Sens V 30 3-1 3 System Schematic Diagrams This Document can not be used without Samsung’s authorization. 3-1-1 a System Main Board Schematic Sheet 2 of 48(BLOCK DIAGRAM)