63MIL Search Results

JEP140

Abstract: JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7
Contextual Info: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device

JESD51-9

Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
Contextual Info: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device

Contextual Info: User's Guide SBAU121 – January 2006 DAC8554EVM User's Guide This user’s guide describes the characteristics, operation and use of the DAC8554 Evaluation Module EVM . It covers all matters related to proper use and configuration of this EVM along with the devices that it supports. The physical printed circuit board

LTN150XG-L05

Abstract: ZD600 c828* npn W316 bag c836 BA59-01664A 1608 F 100nF cpu fan sepa LTN150XG R756
Contextual Info: Main System Option SESC code Location 0902-001841 1105-001609 3903-000055 BA31-00025A BA31-00026A BA39-00527A BA39-00528A BA39-00533A BA39-00540A BA41-00568A BA41-00569A BA42-00161A BA42-00162A BA43-00155A BA44-00132A BA44-00162A BA44-00205A BA44-00209A BA44-00211A

smd diode c539

Abstract: samsung sens r20 smd diode marking C535 toshiba dvd hdd schematic diagram RA57 1400l toshiba hdd schematic board st smd diode marking code C701 SMD RA57 logitech 3 button
Contextual Info: 5 Schematic Diagrams and PCB Silkscreen 5-1-5 Parts List SEC Code Location Description and Specification J504 J503 J502 PCMCIA SOCKET J514 J521 J506 J500 3701-001026 3701-001035 3701-001036 3709-001119 3710-000253 3711-003392 3711-003987 3722-000218 15P,2R,FEMALE,SMD-S,AUF

DIODE 22B4

Abstract: BA4602 ba41-00316a AR5212 MAP17-232 Q506 nvidia 7100 AR5211 27b1 diode geforce4
Contextual Info: X10 DRAW Model Name PBA Name PCB Code Dev. Step Revision APPROVAL AQUILA MAIN BA92-01774A BA41-#####A SR 1.0 CHECK : : : : : CPU :P4-BANIAS Chip Set :MCH-M ODEM Remarks :TEMP AQUILA 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams

LEXAN 121r - 21051

Abstract: lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A
Contextual Info: 10. Electrical Partlist Option SEC Code Location Name Spec. Unit , PC -,-,0to+95C,560mA,-, HYS64T64020HDL,PC , DT,KR,CP3,IEC320 C5,250/250V,7/3A,BLK,1830mm,-,H05VV-F

TP192

Abstract: SMD Code 12W SOT23 SRS40P TP394 TP343 BA751 SMD Code 12W SOT-23 TP337 300KO 1608 F 100nF
Contextual Info: This Document can not be used without Samsung’s authorization. 8 SENS Q10 Docking 8-1 Specifications Item Description I/O Ports & Connector 1 IEEE1394, 1 Parallel, 1 Serial, 1 VGA, 1 PS/2, 1 DC-In,1 RJ-45, 2 USB, SPDIF Dimensions 274 x 238 x 21mm System Weight

AR5212

Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516
Contextual Info: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)

sot23 w32

Abstract: SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g
Contextual Info: Main System Design location Level Parts Code Parts Description Spec.

tp181

Abstract: toshiba hdd schematic board cbf 493 TP223 mt2 tEac CBF 423 diode ba39 toshiba 1,8 hdd schematic board TP182 keyboard and touchpad schematic
Contextual Info: 4-148 KBC3_SUSPWR 1% R11 10K 1% R18 6.65K P1.5V_AUX VDC C20 10nF TP192 TP193 R7 TP? 2.5V AL C6 330uF 7 6 5 TP194 Q57 SI4816DY IHLP-2525CZ-01 L1 4.7uH 25V C14 4700nF 3 8 2 D1 4 G2 1 G1 TP217 TP216 R1 1K TP196 25V C15 220nF TP191 5% TP190 R17 6.8K 1% R15 330K

MP8000C

Abstract: SN20 MIC2563A-0YSM MIC2563A-1YSM PCB BOARD DIMENSION
Contextual Info: RELIABILITY REPORT DATE: 1/16/04 QUALITY ENG : PURPOSE: Dinh Pham Lead Free Package Qualification. PART # : PACKAGE TYPE : ASSEMBLY LOC M.COMPD LOT # FAB D/C # PROCESS MIC2563A-1YSM 28L SSOP UNISEM MP8000C 2A28088M01 SJ 0309 BCD3 MIC2563A-0YSM 28L SSOP UNISEM

ECG diodes

Abstract: CYRF6936-40LFXC L3 SOT23 UAR72-4N5J10 LNA RSSI cyrf6936 40ltxc cyrf6936 CY7C63803-SXC cyrf6936 programming IND0402
Contextual Info: CYRF6936 WirelessUSB LP 2.4 GHz Radio SoC Features • 2.4 GHz Direct Sequence Spread Spectrum DSSS radio transceiver ■ Battery Voltage Monitoring Circuitry ■ Supports coin-cell operated applications ■ Operating voltage from 1.8 V to 3.6 V ■ Operating temperature from 0 to 70°C

lm6642

Abstract: NATIONAL SEMICONDUCTOR MARKING CODE 277 marking code 604 SOT23-6 sumitomo epoxy Nitto UV MARKING 5501 SOT23-5 sot23-6 marking code 593 nitto UV tape NS Package Number MF05A operational amplifier discrete schematic
Contextual Info: LMH Products Qualification Package LMH6642, LMH6643, LMH6645, LMH6646, LMH6647, LMH6654, LMH6655 and LMH6672 National's LMH66xx family of operational amplifiers is a new series of high-speed products based on the VIP10 process. The first members of the

30b1 diode

Abstract: ntc 10d-7 DIODE G7.9 27B2 diode 45x1 diode M30 c300 811324 q515 11F4 smd diode f4 4d
Contextual Info: This Document can not be used without Samsung’s authorization. 5 Schematic Diagrams and PCB Silkscreen 5-1 MAIN BOARD 5-1-1 Schematic Diagrams M30 5-1 5 Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung’s authorization.

75S01

Abstract: KBC3_SUSPWR tantal 100UF 16V D1FS44063 smd D9 sot-23 7sz125 smd diode Mbr0540 TANTAL 16V 10uF M C80 sot-23 SOT-23 r33
Contextual Info: 3 Schematic Diagrams and PCB Silkscreen 3-1-4 PCB Silkscrren Top 3-70 SENS V20 Series 3 Schematic Diagrams and PCB Silkscreen 3-1-5 PCB Silkscrren(Bottom) SENS V20 Series 3-71 3-72 KBC3_PWRON PWR5_INTVCC KBC3_SUSPWR PWR5_INTVCC PWR5_SUSPWR VDC 3.3V_OUT PWR5_INTVCC

LM317 SOT223

Abstract: SIC350S BA92-03528A BA81 BA41-00416A BA41-004 49fl004 119MIL smd L272 BA920
Contextual Info: This Document can not be used without Samsung’s authorization. 5 Exploded View and Mechanical Part List 5-1 Exploded View 5-1-1 system Exploded ALL SENS P29G 5-1 This Document can not be used without Samsung’s authorization. 5 Exploded View and Mechanical Part List

Contextual Info: - Thi s Documentcan notbe used wi thoutSamsung' s authori zati on - 10. PartList 1 Main Board Main Board Location SEC Code Name Specification Quantity B504 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- 1 B510 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,-

C1093

Abstract: SLD9630TT C1079 2007-000162 BA68-40012N C1061 npn 470nF 50V X7R ics954 C347 C558 npn
Contextual Info: 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다. This Document can not be used without Samsung's authorization. 10.자재 리스트 10-1. Main Board X25 / X20(EXT Item No Design LOC Parts name Spec 0201-001002

ar7161

Abstract: schematic diagram inverter 2000w 216P9NZCGA12H AR7141 ar716 samsung dvd Schematic circuit diagram schematic diagram trace 2425 inverter 2000w r305 finger print module K4D26328 ASTM D710
Contextual Info: SENS P20 Owner : Kevin, Lee Signature : HS, Kim Robin, Cho APPROVAL TAURUS II MAIN BOARD BA41-00346A PBA:BA92-xxxxxx, SMT:BA92-xxxxxx MP 0130-1.1 Jan.30.2003 CHECK : : : : : : DRAW Model Name PBA Name PCB Code Dev. Step Revision T.R. Date CPU : P-IV Northwood

LM317 SOT223

Abstract: w33 SMD sot 23 PC-GF10 49fl004 BA75-01620A SIC350S TM61PUH8G214 MP0402H BA59-01375A BA75-01732A
Contextual Info: This Document can not be used without Samsung’s authorization. 5 Exploded View and Mechanical Part List 5-1 Exploded View 5-1-1 system Exploded ALL SENS P27G 5-1 This Document can not be used without Samsung’s authorization. 5 Exploded View and Mechanical Part List

160-1436-2-ND

Abstract: 5075BMR-05-SM-CR 93LC56-SO8 FB0603 Yageo CC0402 0805 25V X5R 4u7 neltron, 5075BMR powr1014a 5075BMR-05-SM NCP1117ST33
Contextual Info:  POWR1014A Breakout Board Evaluation Kit User’s Guide February 2012 Revision: EB64_01.1  POWR1014A Breakout Board Evaluation Kit User’s Guide Introduction Thank you for choosing the Lattice Semiconductor POWR1014A Breakout Board Evaluation Kit! Lattice Semiconductor’s Power Manager II ispPAC -POWR1014A device simplifies power supply design by integrating the analog and digital functions of power supply management sequencing, monitoring, measuring, and

samsung R540 service

Abstract: AR2413 10029a 2402-001144 LTM170EX R40PLUS BA99-10026A HP100-C30N-N15 M170EU01 C547 smd
Contextual Info: 10. Electrical Part List Main System Parts Code Location XP_HOME,W/O_BA G 6801-001239 WARRANTY 6801-001535 E-BOOK COUPON BA46-05935A S/W Media BA46-05530A OS CD BA68-03737A OS Manual BA81-00991A MOUSE PAD Part Name BA44-00215A Lishin-90W ASSY ACCESSORYXP_HOME

SMD Code 12W SOT23

Abstract: tp151 TP218 TP112-TP113 TP394 SRS40P tp334
Contextual Info: This Document can not be used without Samsung’s authorization. 8 SENS Q10 Docking 8-1 Specifications Item Description I/O Ports & Connector 1 IEEE1394, 1 Parallel, 1 Serial, 1 VGA, 1 PS/2, 1 DC-In,1 RJ-45, 2 USB, SPDIF Dimensions 274 x 238 x 21mm System Weight