TO220 SEMICONDUCTOR PACKAGING Search Results

Nitto MP8000

Abstract: Nitto ON SEMICONDUCTOR TRACEABILITY MP180S mp8000 MP-8000 TO220 Semiconductor Packaging DS1821 package to220 PHILIP
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: January 18, 1999 Subject: PRODUCT CHANGE NOTICE – A001801 Description: Qualification of MP8000 for TO220

Contextual Info: FCI Semiconductor Advanced Data Sheet TTB SERIES 100 to 230 Volt "TransTector" Bi-Directional Surge Protector _ ». Description Mechanical Dimensions TTB SERIES For Package Designation Use suffix as described below TO220 Suffix = T D 015 Suffix = D SMB Suffix = S

SF8A300

Abstract: SDB20D45
Contextual Info: SF8A300H Semiconductor Ultrafast Recovery Rectifier ULTRAFAST RECOVERY POWER RECTIFIER Description The SF8A300H is a silicon rectifier in a 2-Lead TO220 full-pack type package designed, and is specially suited for switching mode base drive and transistor circuit. This device is intended for use in low voltage,

"ultra low forward voltage" TO220

Contextual Info: SF8A200H Semiconductor Ultrafast Recovery Rectifier ULTRAFAST RECOVERY POWER RECTIFIER Description The SF8A200H is a silicon rectifier in a 2-Lead TO220 full-pack type package designed, and is specially suited for switching mode base drive and transistor circuit. This device is intended for use in low voltage,

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

corrugated box spec

Abstract: TO220 Semiconductor Packaging FDP7060 NDP4060L CBVK741B019 EO70 corrugated packaging F9852
Contextual Info: TO-220 Tube Packing Data TO-220 Tube Packing Configuration: Figure 1.0 Packaging Description: TO-220 parts are shipped normally in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in standard option are placed inside a dissipative

TO220 Semiconductor Packaging

Abstract: CBVK741B019 EO70 FDP7060 NDP4060L D9842 corrugated box spec bubble sheet 9852
Contextual Info: TO-220 Tube Packing Data TO-220 Tube Packing Configuration: Figur e 1.0 Packaging Description: TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative

TO220 Semiconductor Packaging

Contextual Info: Continental Device India Limited An ISO/TS16949 and ISO 9001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5 Continental Device India Limited

TO-220 3 lead bend

Abstract: TO220 Semiconductor Packaging 324 14pin 5-lead sot 326 326 SOT 326 sot223
Contextual Info: Micrel Semiconductor Designing With LDO Regulators Section 6. Package Information Packaging for Automatic Handling . 322 Tape & Reel . 322

6n60

Abstract: 6n60 data 6n60 equivalent imsys TO220 Semiconductor Packaging 6N60 datasheet 7103 transistor 6n60 6N-60
Contextual Info: TO-220-3L Tube Packing Data TO-220 Tube Packing Configuration: Figure 1.0 Packaging Description: 50 units per Tube TO-220 parts are shipped normally in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in standard option are placed inside a dissipative

ts 4141 TRANSISTOR

Abstract: transistor AMm TO-220 packing methods
Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5

lm2576 current mode

Abstract: lm2576hvt adj p LM2576 LM2576HVS-ADJ SIMPLE SWITCHER negative Voltage Regulator LM2576HVT-ADJ LM2576hvs-adj p LM2576 APPLICATION LM2576HVSX-12 Alternate Part or Supplier
Contextual Info: LM2576HV - SIMPLE SWITCHER 3A Step-Down Voltage Regulator Page 1 of 2 Sign-On HOME My National Private Sites English LM2576HV - SIMPLE SWITCHER® 3A Step-Down Voltage Regulator Datasheet Packaging Samples & Pricing Reliability Features Knowledge Base WEBENCH Live Simulation!

4 PIN TO 220 IC

Abstract: dp 502 t
Contextual Info: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip m anufacturing process and the m ethods available for Flip Chip assembly.

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220AC 2 Lead Leaded Plastic Package Package Outline, Packing Tube, Packaging and Handling Information TO220AC_Pkg_Drawing Rev271005 Continental Device India Limited

ST L1117

Abstract: ST MICROELECTRONICS L1117 33 LM7905 TO-92 ENE CP2211 CP2211 TL496 equivalent cp2206 MC34153 L7805 SOT 89 transistor L7905
Contextual Info: Technology for Innovators TM Standard Linear Products Cross-Reference Including Amplifiers, Comparators, Timers, Peripheral Drivers, Power Management Controllers, References, Regulators, Supervisors, Shunts, Transmitters and Receivers INTERFACE COMPARATORS