TH170 Search Results

heat sink to220

Abstract: TH17023
Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder

MO-048

Contextual Info:  Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder

MO-048

Abstract: MULTIWATT die TH17023
Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

MO-048

Abstract: MULTIWATT die CMC 15 EPOXY RESIN
Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

SK100 transistor

Abstract: C125T-A rb342a stc 1740 k0389 l9150 St4540 st l9150 transistor nec 8772 MNT S100
Contextual Info: Cooper Crouse-Hinds Cross Reference Competitor: Adalet Competitor Catalog Number XFC-210 ECGJH110 XFC-212 ECGJH112 XFC-215 ECGJH115 XFC-218 ECGJH118 XFC-221 ECGJH121 XFC-224 ECGJH124 XFC-227 ECGJH127 XFC-230 ECGJH130 XFC-233 ECGJH133 XFC-236 ECGJH136 XFC-24 ECGJH14