STACKUP Search Results

SY 356

Abstract: MIL-C-26074
Contextual Info: Pomona Model 2944 Miniature Solderless Stackup Banana Plug FEATURES: • Wire firmly held in place with internal set screw. MATERIALS: Upper Conn.: Miniature Banana Jack Material: Brass per QQ-B-626, Alloy 360, ½ Hard. Finish: Gold plate per MIL-G-45204, Type II, Class 00 over electroless nickel per MIL-C-26074,

2945

Abstract: MIL-C-26074
Contextual Info: Pomona Model 2945 Miniature Solderless Stackup Banana Plug With Safety Collar FEATURES: • Wire firmly held in place with internal set screw. • The integral collar insulates leads and acts as a strain relief by preventing the flexing of lead at set screw.

Contextual Info: TECHNICAL DATA SHEET Mini-Coax 4 CHANNEL BLOCK STRAIGHT MF2C117-40ML5-NM *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by customers. These parameters have a strong impact on the high frequency performance of the mounted connector.

Contextual Info: TECHNICAL DATA SHEET Mini-Coax 8 CHANNEL BLOCK STRAIGHT MF2C118-40ML5-NM *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by customers. These parameters have a strong impact on the high frequency performance of the mounted connector.

B0050B

Abstract: b0050
Contextual Info: TECHNICAL DATA SHEET Mini-Coax 8 CHANNEL BLOCK RIGHT ANGLE 23C21D-40ML5 *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by customers. These parameters have a strong impact on the high frequency performance of the mounted connector.

sl8z4

Abstract: diagram HANNSTAR k mv VDD256 hannstar j mv 1 g792 WISTRON diode c649 ST 1D05V M54-p PCI7412
Contextual Info: A B C D LWG2-D Block Diagram Discrete Mobile CPU CLK GEN. 4 IDT CV125PA Project code: 91.4Q801.001 PCB P/N : 55.4Q801.XXX REVISION : 06210-2 (Hannstar, ACCL) G792 Yonah 478 1.83G/2G/2.16G 4, 5 3 19 PCB STACKUP TOP TVO HOST BUS 400/533/667MHz LVDS DDR2 533/667MHz

U665B

Abstract: SCD1U10V2KX-5GP aol14 H5PS5162 0R2J-2-GP ICS9LPRS365YGLFT-GP TPS51125 WPC775L RTM875T-606 si7686
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 667/800/1066MHz@1.05V 800/667MHz Cantiga AGTL+ CPU I/F 12,13 LVDS DDR Memory I/F PCI-EG INPUTS 71.CNTIG.00U 12,13 X4 DMI 400MHz 4 36 OUTPUTS DCBATOUT 1D8V_S3 10A RT9026 35 DDR_VREF_S0 (1.5A) S 1D8V_S3 GND DDR_VREF_S3

BCM5784

Abstract: JV50-TR RT8205A RS880 SCD1U16V2KX-3GP SB710 AMD SB710 tps51125 RS880M ICS9LPRS480BKL
Contextual Info: 5 4 3 2 Project code: 91.4FN01.001 PCB P/N : 48.4FN01.001 REVISION : 09230- -1 JV50-TR Block Diagram DDR2 PCB STACKUP 667/800MHz AMD Caspian CPU S1G3 35W 667/800 MHz 16,17 D 1 DDR2 667/800 MHz 16,17 G792 35 IN OUT INPUTS HDMI LAN DY Codec A-Link 4X4 AZALIA

TPS51125

Abstract: D0214 ENE3310 SRN10KJ-6-GP 88e8071 51125 KB3310 ich9 WINBOND W25X80 sp5 gfx
Contextual Info: 5 4 3 2 1 Cathedral Peak Block Diagram CLK GEN. D SYSTEM DC/DC Mobile CPU ICS 9LPRS365BKLFT 71.09365.A03 RTM 875N-606-LFT (71.00875.003) 3 PCB STACKUP THERMAL EMC2102 Penryn 479 21 DDR2 DIMM1 667/800 MHz TOP 667/800/1067MHz@1.05V DCBATOUT 3D3V_S5 CRT S LCD

88SE6121

Abstract: wpc8763ldg G5281RC1U-GP 88se6 AN-22 1D05V Wistron Corporation SC10U10V5KX-2GP H2434 wistron
Contextual Info: PCB STACKUP Project code: 91.4U601.001 PCB P/N : 07204-SC Revision : MAKI Block Diagram L1: L2: L3: L4: L5: L6: L7: L8: Mobile CPU CLK GEN. Merom 479 2G/2.33G ICS 9LPRS365 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U 71.09502.00W HOST BUS G792 42 DOCK CRT & TV-OUT

SM 630 finger print module

Abstract: ADP3208J RTS5158E SE330U2VDM-L-GP USB232 WPCE776 BQ24740 CT3528 ADP3208 EMC2102-DZK-GP
Contextual Info: A B C D SYSTEM DC/DC LZ2 Block Diagram 4 E Project code: PCB P/N Revision : : INPUTS Penryn SV 35W 3 5V_S5 3D3V_S5 EMC2102 DDR2 socket PCB 8-LAYER STACKUP INPUTS 15 DCBATOUT 1D8V_S3 667/800/1066MHz@1.05V GND R.G.B DDR2 socket 3 TPS51100 APL5912 1D8V_S3 APL5912

WPCE773LA0DG

Abstract: G5285T11U-GP ICS9LPRS365B g31 crb WPCE773LA intel g41 crb Realtek ALC269Q High Definition Audio g41 crb WPCE773LA0DG, ALC269 diode af52
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.011 REVISION : 08266-1 SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

C2P1

Abstract: foxconn VT1617A VT1617 VIA vt8237 DY-SE220U2VDM-6 WISTRON power sequence HP connectors Wistron Corporation Wistron Corporation Egret
Contextual Info: A B C D E EGRET Block Diagram 200-PIN DDR SODIMM CLK GEN ICS ICS950405 4 AMD CPU DDR 3 33/400 DDR x2 Claw Hammer K8 PCB Layer Stackup 8,9,10 3 L1: Signal 1 L2: GND L3: Signal 2 L4: Signal 3 L5: VCC L6: Signal 4 4,5,6,7 TV Encoder VIA VT1623M HyperTransport

WPCE773LA0DG

Abstract: WISTRON power sequence intel g41 crb winbond wpce773la0dg Realtek ALC269Q High Definition Audio transistor BC33 g31 crb diode AH44 transistor bc47 TRANSISTOR BL41
Contextual Info: 5 4 3 2 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.021 REVISION : 08266-2 JM41/JM51 UMA Block Diagram SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP D D 3D3V_AUX_S5 Thermal Sensor Intel CPU CLK GEN. L1 S L2

9lprs480bkl

Abstract: TPS5117 MX25L1605DM2I 9lprs4 P4SSMJ24PT-GP 71094 WISTRON RS780M SC10U25V6KX-1GP C3782
Contextual Info: 5 4 3 2 PCB Layer Stackup Ferrari 7 GT Block Diagram DIMM1 D DDR2 SODIMM DIMM2 AMD DDR II 667/800 OUT Power Switch G577BR91U New card Mini Card Port Replicator Giffin S1g2 Socket DDR II 667/800 16x16 L1: Component L2: GND L3: Signal L4: VCC L5: GND L6: Signal

WPCE773LA0DG

Abstract: TPS51125 Atheros AR8131 WISTRON power sequence RT8202 Realtek ALC269Q High Definition Audio NDS0610-NL-GP X-14D31818M-35GP Wistron Corporation winbond wpce773la0dg
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA REVISION : 08266-SA 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

maxim max8770

Abstract: wpc8763ldg varistor k11 k17 SM 630 finger print module PCI7412 040 U3D 78L12 WPC8763L BCM5787MKMLG 1D05V
Contextual Info: A B C D Biwa Block Diagram Project code: 91.4H001.001 PCB P/N : 55.4H001.XXX REVISION : 06237-3 GCE, Hannstar Mobile CPU CLK GEN. 4 Merom 479 2G/2.33G ICS 9LPR502 (RTM875T-605) 3 2.0G : B0, QLYV 2.2G : B0, QLFS E 4 -3-0313 G792 20 PCB STACKUP 4, 5 TOP CPU DC/DC

PCI7412

Abstract: RTM875T-605 SB3030 CP2211F foxconn Wistron Corporation U41S 1D05V APL5915KAI Socket AM2
Contextual Info: A B C D Columbia/Tangiz Block Diagram Project code: 91.4T301.001 PCB P/N : 48.4T301.0SA REVISION : 06236-SA Mobile CPU CLK GEN. 4 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U 71.09502.00W 533/667MHz 533/667 MHz PCB STACKUP TV Out 4, 5 TOP 14 CRT DVI 44 APL5915

Contextual Info: Technical Data Sheet RF_35/05.10/6.0 Dieses Dokument ist urheberrechtlich geschützt ● This document is protected by copyright ● Rosenberger Hochfrequenztechnik GmbH & Co. KG Mini coax 8 CHANNEL BLOCK MF2C116-40ML5-NM right angle *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by

STF-01-FS

Contextual Info: SEAF TO SEAM CUSTOM RELEASED FOR LIMITED PRODUCTION. SCF-155382-02-MA LAYER STACKUP UPDATE DESIGN FOR LOW PIN COUNT CONNECTIONS AND STACK-UP TOP LAYER 5.00 4.40 C3 A1 SEAF 2.30 J1 SIGNAL J2 SEE VITA 57 CHART FOR LOW PIN COUNT SEAM A1 PINOUT TABLE UPDATE C4 TO 0.38 AND C5 TO 0.40

Contextual Info: TECHNICAL DATA SHEET Mini-Coax 6 CHANNEL BLOCK STRAIGHT 23C12G-40ML5 *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by customers. These parameters have a strong impact on the high frequency performance of the mounted connector.

Contextual Info: TECHNICAL DATA SHEET Mini-Coax 4 CHANNEL BLOCK STRAIGHT 23C11E-40ML5 *A wide variety of transmissionline topologies and pcb-parameters like permittivity, substrate thickness, and board-stackup are applied by customers. These parameters have a strong impact on the high frequency performance of the mounted connector.

4044

Abstract: phone jack
Contextual Info: Pomona Model 4044 Adapter – Phone Jack To Double Banana Plug FEATURES: • Permits a standard 2 conductor 6.4 .250 dia. phone plug to be used with equipment having Banana Jacks or Binding Posts. • Cross holes 4.2 (.166) in body provide side stackup connections.

Contextual Info: Model 2BC-BNC BNC Male to Multi-Stacking Double Banana Plug Pomona LENGTH ± . 5 0 12,70 1.07 (27,70) 2x 0.1 6 6 ( 4 , 2 2 ) I N - LI N E STACKUP 0 .57 (14,48) £ .7 5 ( 2 8 ,7 0 ) (19,05) T 2x .21 (5,33) • • • • • • • 2x 0.166 (4,22) GROUND MARKER