SOT890 Search Results

Contextual Info: Package outline VFBGA353S: plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm D e4 ball/land A1 index area 1 2 3 4 6 5 7 8 B D1 e3 9 10 11 SOT890-1 ∅v ∅w b1 12 13 14 15 16 18 20 17 19 C A B

sot890

Abstract: 14X14
Contextual Info: Package outline Philips Semiconductors VFBGA353S: plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm B D e4 D1 2 4 1 3 6 8 5 ∅v ∅w b e3 ball/land A1 index area 7 10 9 12 11 SOT890-1 14 13 16

SOT890-1

Contextual Info: WILLAS FM120-M+ THRU 2SA1201 FM1200-M+ SOT-89 Plastic-Encapsulate Transistors 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers better reverse

KX8530

Abstract: 1N5822 SMD sot-153 1N5822 smd diode ic 6 pin smd for power supply 1N5822 SMD PACKAGE 1N5819/1N5822 SMD smd package 1N5819 1N5822 SMD data sheet download 1n5819 smd
Contextual Info: IC SMD Type PFM Step-up DC/DC Converter With High Efficiency And Low Noise KX8530 Outline Features The KX8530 series are CMOS-based PFM step-up Deliver 200mA at 3.3V Output voltage with 1.8V DC-DC Converter. The converter can start up by input Voltage supply voltage as low as 0.8V, and capable of