SOT87 Search Results
SOT87 Datasheets (8)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT870-1 |
|
Plastic thin small outline package; no leads; 4 terminals; body 1.6 x 2 x 1.1 mm | Original | 224.02KB | 1 | ||
| SOT871-1 |
|
Plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm | Original | 235.33KB | 1 | ||
| SOT873-1 |
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals | Original | 325.81KB | 1 | ||
| SOT873-1 |
|
Footprint for reflow soldering SOT873-1 | Original | 323.92KB | 1 | ||
| SOT873-1_115 |
|
HVSON8; reel pack; standard product orientation; 12NC ending 115 | Original | 312KB | 4 | ||
| SOT878-1 |
|
Footprint for reflow soldering SOT878-1 | Original | 8.13KB | 1 | ||
| SOT878-2 |
|
Plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm) | Original | 344.85KB | 1 | ||
| SOT879-1 |
|
Plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm | Original | 261.97KB | 1 |