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    IC-7316-001

    Abstract: TFBGA316 sot876 MO-195
    Contextual Info: Package outline Philips Semiconductors TFBGA316: plastic thin fine-pitch ball grid array package; 316 balls; body 11 x 11 x 0.8 mm SOT876-1 B D A ball A1 index area A E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J


    Original
    TFBGA316: OT876-1 MO-195 IC-7316-001 IC-7316-001 TFBGA316 sot876 MO-195 PDF