SOT532 Search Results

Contextual Info: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G

MS-034

Abstract: SOT532-1 BGA388
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y

388 transistor

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K

Contextual Info: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AF AD AB Y V T P M K H F D B AE e AC AA W U R e2 N L 1/2 e J G

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA388 package SOT532-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot532

Abstract: BGA388
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

pnx7100

Abstract: PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PNX7100 MPEG AVG CODEC Objective specification File under Integrated Circuits, IC02 2002 Feb 28 Philips Semiconductors Objective specification MPEG AVG CODEC PNX7100 FEATURES Interfaces • 32-bit 133 MHz SDRAM interface supports up to two

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors