SOT513 Search Results

Contextual Info: Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1 20 w M bp e ZD v M A D B

HTQFP80

Abstract: sot513
Contextual Info: PDF: 1999 Nov 23 Philips Semiconductors Package outline HTQFP80: plastic, heatsink thin quad flat package; 80 leads; body 14 x 14 x 1.0 mm SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1

HTQFP80

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

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JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors