HTQFP48 Search Results

HTQFP48

Abstract: PTQP0048KB-A
Contextual Info: JEITA Package Code P-HTQFP48-7x7-0.50 RENESAS Code PTQP0048KB-A Previous Code 48PFW-A MASS[Typ.] 0.1g NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 3. *4 THERE ARE SOME VARIATIONS FOR D2/E1. HD

Contextual Info: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-1 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh HE E A A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 L detail X 12 v ZD w bp A e B D

Contextual Info: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 ZD w M bp

HTQFP48

Abstract: sot545
Contextual Info: PDF: 1999 Aug 05 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1 mm SOT545-2 c y heatsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 ZD

HTQFP48

Abstract: MS-026
Contextual Info: PDF: 2002 May 22 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-1 c y exposed die pad X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index

SOT1181-2

Contextual Info: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-2 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh A HE E A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 12 e v ZD w bp A B D HD v B 5 max

HTQFP48

Abstract: MS-026 HTQFP-48
Contextual Info: PDF: 2004 Feb 19 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index

Contextual Info: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 e ZD w M bp

Contextual Info: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 e ZD w M bp

HTQFP48

Abstract: sot545
Contextual Info: PDF: 2000 Apr 10 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1.0 mm SOT545-1 c y heathsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 13 48 detail X 1 12

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP48 package SOT545-2 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

HTQFP48

Abstract: MS-026 sot545
Contextual Info: PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index

HTQFP48

Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1.0 mm SOT545-2 c y heatsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12

Contextual Info: ADS5413 www.ti.com SLWS153 − DECEMBER 2003 SINGLE 12-BIT, 65-MSPS IF SAMPLING ANALOG-TO-DIGITAL CONVERTER FEATURES D 48-Pin TQFP Package With PowerPad D D D D D D D D D D 64.5-dBFS SNR and 72-dBc SFDR at 65 MSPS 7 mm x 7 mm body size 12-Bit Resolution

Contextual Info: THS7327 SLOS502C – SEPTEMBER 2006 – REVISED OCTOBER 2011 www.ti.com 2 3-Channel RGBHV Video Buffer with I C Control, Selectable Filters, Monitor Pass-Thru, 2:1 Input MUX, and Selectable Input Bias Modes Check for Samples: THS7327 FEATURES • 1 • 3-Video Amplifiers for CVBS, S-Video,

tas5717l

Contextual Info: User's Guide SLOU331 – December 2011 TAS5731EVM Evaluation Module This manual describes the operation of the TAS5731EVM to evaluate the performance of the TAS5731 integrated digital audio power amplifier. The main contents of this document are: • Details on how to properly connect a TAS5731 Evaluation Module EVM and the details of the EVM.

ADS5413

Abstract: ADS5413IPHP OPA690
Contextual Info: ADS5413 www.ti.com SLWS153 − DECEMBER 2003 SINGLE 12-BIT, 65-MSPS IF SAMPLING ANALOG-TO-DIGITAL CONVERTER FEATURES D 48-Pin TQFP Package With PowerPad D D D D D D D D D D 64.5-dBFS SNR and 72-dBc SFDR at 65 MSPS 7 mm x 7 mm body size 12-Bit Resolution

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

VSP6244

Abstract: hp laptop ac adapter schematics diagram 3 phase dc converter afe circuit diagram igbt omap3530 GPMC NORFLASH klixon 8-S msp430F5438 usart examples ir remote control transmitter ABC T2 vsp6822 STB 2300 HD Streaming IP Set Top Box UCC28070
Contextual Info: 2 Introduction and Table of Contents TI’s Solutions Cover the Entire Video Chain TI has been involved in the video market for more than 25 years. The steps in the video chain span everything from the creation of the original content to the final viewing

NXP Solutions for In-Vehicle Networking

Abstract: 75017381 TJA1044TK AH1014 TJA1085
Contextual Info: NXP Solutions for In-Vehicle Networking High-Speed CAN Status Physical-Layer Compliance Bit Rate bps Operating Modes Package Lead Free PCA82C250T PCA82C251T TJA1050T TJA1051T TJA1051T/3 TJA1051T/E TJA1051TK/3 Production Production Production TJA1042T TJA1042T/3

TTL transformer to RF

Abstract: PCB1337-1 F6905 HTQFP48 TDA9910 AN1035
Contextual Info: AN10352 -TDA9910HW- 12-bit High Speed A/D Converter Demonstration board Rev. 01 — 01 July 2005 Application note Document information Info Content Keywords AN10352, TDA9910HW/6, TDA9910HW/8, Demoboard, 12-bit ADC, High speed, Application Note Abstract This document describes the design and the main features of the

philips capacitor 1000uf 25V

Abstract: HF70ACB HTQFP48 LM317MDT TDA9910 TL431CPK HD 4480
Contextual Info: TDA9910 12-bit, up to 80 Msample/s, Analog-to-Digital Converter ADC direct/ultra high IF sampling Rev. 02 — 9 December 2004 Objective data sheet 1. General description The TDA9910 is a 12-bit Analog-to-Digital Converter (ADC) optimized for direct IF sampling, and supporting the most demanding use conditions in ultra high IF radio

MC57XXPSIA

Abstract: coaxial input to rca 5.1 audio output circuit optical input to rca 5.1 output circuit SUBWOOFER BOARD coaxial to analog 5.1 rca converter circuit TAS570x GDE PCE3878CT gde 41 C1680X5R0J475M TAS5713EVM
Contextual Info: User's Guide SLOU281 – January 2010 25W Digital Input Amplifier With EQ and 2-Band DRC This manual describes the operation of the TAS5713EVM to evaluate the performance of the TAS5713 integrated digital audio power amplifier. The main contents of this document are:

Contextual Info: ADS5413-11 www.ti.com SLWS156 − MARCH 2004 SINGLE 11ĆBIT, 65ĆMSPS HIGH IF SAMPLING ANALOGĆTOĆDIGITAL CONVERTER D Single-Ended or Differential Clock D 1-GHz −3-dB Input Bandwidth D 48-Pin TQFP Package With PowerPad FEATURES D 11-Bit Resolution D 65-MSPS Maximum Sample Rate