SOT471 Search Results

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

D 2395

Abstract: BGA256 17 X 17 BGA256 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

BGA256

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot471

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

PZ3320C10BE

Abstract: PZ3320C10EB PZ3320C7BE PZ3320C7EB PZ3320N8BE PZ3320N8EB
Contextual Info: INTEGRATED CIRCUITS PZ3320C/PZ3320N 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22 IC27 Data Handbook Philips Semiconductors 1999 Apr 16 Philips Semiconductors Product specification 320 macrocell SRAM CPLD PZ3320C/PZ3320N FEATURES

ph 4148 zener diode

Abstract: philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148
Contextual Info: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-40 DATED DECEMBER 31, 1998 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODE S COMMENTS DISCONTINUED INTEGRATED CIRCUIT PRODUCTS

Contextual Info: Philips Semiconductors Product specification 320 macrocell SRAM CPLD PZ3320C/PZ3320N FEATURES DESCRIPTION • 320 macrocell SRAM based CPLD The PZ3320 device is a m em ber of the CoolRunner fam ily of high-density SRAM -based CPLDs Com plex Program mable Logic

PZ3320C10BE

Abstract: PZ3320C10EB PZ3320C7BE PZ3320C7EB PZ3320N8BE PZ3320N8EB XCR3320
Contextual Info: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3320 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22 IC27 Data Handbook

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

Contextual Info: INTEGRATED CIRCUITS [M m s ^ e eI It Xiiinx has acquired the entire Philips CoolRunner Low Power CPLO Product Family« For more technical or sales Information; piease see: www.xilinx.com XCR3320 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22