SOT375 Search Results

MS-026

Abstract: TQFP80
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B

TQFP80 package

Abstract: MS-026 TQFP80
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B

sot375

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 wM θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A wM D B HD v M B

Contextual Info: Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 1 detail X 20 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

TQFP100 footprint

Abstract: SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

2SB5950

Abstract: B0540C to-53 2SB595-0 B0242c 2N3186 2N3198
Contextual Info: POWER SILICON PNP Item Number Part Number I C} 5 -10 20 2SB1270 2SB9200 2SA1293 2N5005 2N5153 2N5153S 2N5609 2N5617 See Index NthAmerSemi Semelab SGS-Ates NthAmerSemi NEC Corp JA See Index Matsushita Matsushita Matsushita ~emel~ ToshibaCorp Sanyo Elect Sanyo Elect

TQFP80 footprint dimensions

Abstract: QFP44 footprint STK403-040
Contextual Info: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

2SB616 NEC

Abstract: B0952 SOT3323 6u60 2N3185 B0952F
Contextual Info: POWER SILICON PNP Item Number Part Number I C 5 10 20 25 30 35 40 50 60 70 80 200 200 140 140 200 200 400 400 200 200 2SA1469S 2SA1259 B0223 SML3705 SML3728 SML3777 SML3323 SML3327 2N3177 2N3181 2N3185 2N3189 2N3193 2N3197 SOT3723 SOT3723 SOT3723 SOT3731

TQFP80 footprint

Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

philips sq8

Abstract: QPP80
Contextual Info: Philips Semiconductors Package information Soldering SURFACE MOUNTED PACKAGES INTRODUCTION There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

TQFP100 footprint

Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

LQFP32

Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

sx3704

Abstract: AP239 Transistor 80139 8C547 6C131C IN2222A 2N50B 2N2064 radio AC176 AC126 sft353
Contextual Info: INTERNATIONAL TRANSISTOR EQUIVALENTS GUIDE A LSO BY THE S A M E AUTHOR BP108 International Diode Equivalents Guide BP140 Digital IC Equivalents and Pin Connections BP141 Linear IC Equivalents and Pin Connections ALSO OF INTEREST BP234 Transistor Selector Guide

PHILIPS OQ 0501

Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Contextual Info: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

LQFP64. footprint

Abstract: T317 HDIP
Contextual Info: Philips Semiconductors Soldering Package information INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

b0944

Abstract: b0946 SM2177 RCA1C13 rca1c04 to-53 2n3191 2SA1120 Motorola 2N6297 2N3183
Contextual Info: POWER SILICON PNP Item Part Number Number I C 5 10 - >= 20 2S81095M MJE253 2S8860 RCA1C04 2S81095L 2S81168 2S81216 2S81095K ~~~~~ 25 30 RCA1C13 SK3626 2N6468 2N6476 SM2177 NA62U NA62W 80S18 BDS19 I(C) 35 40 50 2SA1357Y 80944 B0944 B0944F MJD210 MJD21 0-1

2sc3052ef

Abstract: 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 TRANSISTOR S1A 64 smd 1N4148 SOD323 semiconductor cross reference toshiba smd marking code transistor
Contextual Info: Small Signal Discretes Selection Guide [ www.infineon.com/smallsignaldiscretes ] 2 Contents Selection Guide 4 RF Bipolar Transistors & Active Bias Controller 4 RF Switches 6 RF MMICs 7 RF Diodes 8 RF MOSFET 16 Schottky Diodes 18 ESD and EMI Protection Devices and Filters

TQFP100 footprint

Abstract: TQFP80 footprint diode databook package outline SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

TQFP100 footprint

Abstract: LQFP32 footprint
Contextual Info: Philips Semiconductors Package information Table 3 Soldering Suitability of surface mounted packages for various soldering methods: rating from ‘a’ to ‘d’: ‘a’ indicates most suitable soldering is not difficult ; ‘d’ indicates least suitable (soldering is achievable with difficulty).

HDIP

Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors