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SOT370-1
|
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NXP Semiconductors
|
Footprint for reflow soldering |
Original |
PDF
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16.86KB |
2 |
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SOT370-1_118
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NXP Semiconductors
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Standard product orientation 12NC ending 118 |
Original |
PDF
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86.12KB |
4 |
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SOT371-1
|
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NXP Semiconductors
|
Footprint for reflow soldering |
Original |
PDF
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16.86KB |
2 |
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SOT375-1
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NXP Semiconductors
|
TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm |
Original |
PDF
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244.11KB |
1 |
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SOT376-1
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NXP Semiconductors
|
Footprint for reflow soldering SOT376-1 |
Original |
PDF
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11.48KB |
1 |
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SOT376-1
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NXP Semiconductors
|
Plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm |
Original |
PDF
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239.44KB |
1 |
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SOT379-1
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NXP Semiconductors
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Plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
Original |
PDF
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239.88KB |
1 |
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SOT379-2
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NXP Semiconductors
|
Footprint information for reflow soldering of QFP52 package |
Original |
PDF
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11.49KB |
1 |
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SOT379-2
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NXP Semiconductors
|
Plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
Original |
PDF
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239.59KB |
1 |