SOT135 Search Results
SOT135 Datasheets (8)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT1350-1 |
|
Plastic ultra thin fine-pitch land grid array package; 49 lands | Original | 331.38KB | 1 | ||
| SOT1352-1 |
|
Footprint for reflow soldering SOT1352-1 | Original | 311.24KB | 1 | ||
| SOT1352-1 |
|
Plastic thermal enhanced very thin small outline package; no leads; 12 terminals | Original | 341.99KB | 1 | ||
| SOT1353-1 |
|
Plastic surface-mounted package (TSOP6); 6 leads | Original | 330.7KB | 1 | ||
| SOT1354-1 |
|
Plastic, extremely thin fine-pitch ball grid array package; 16 balls | Original | 334.17KB | 1 | ||
| SOT1355-1 |
|
UQFN12: plastic, ultra thin quad flat package; no leads; 12 terminals; body 1.6 x 1.6 x 0.5 mm | Original | 338.5KB | 1 | ||
| SOT1356-1 |
|
Plastic, extremely thin fine-pitch ball grid array package; 28 balls | Original | 340.07KB | 1 | ||
| SOT1358-1 |
|
Plastic extremely thin small outline package; no leads; 7 terminals; body 1.1 x 2.1 x 0.5 mm | Original | 337.01KB | 1 |