SOT1350-1 |
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NXP Semiconductors
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Plastic ultra thin fine-pitch land grid array package; 49 lands |
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SOT1352-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1352-1 |
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SOT1352-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 12 terminals |
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SOT1353-1 |
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NXP Semiconductors
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Plastic surface-mounted package (TSOP6); 6 leads |
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SOT1354-1 |
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NXP Semiconductors
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Plastic, extremely thin fine-pitch ball grid array package; 16 balls |
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SOT1355-1 |
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NXP Semiconductors
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UQFN12: plastic, ultra thin quad flat package; no leads; 12 terminals; body 1.6 x 1.6 x 0.5 mm |
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SOT1356-1 |
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NXP Semiconductors
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Plastic, extremely thin fine-pitch ball grid array package; 28 balls |
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SOT1358-1 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 7 terminals; body 1.1 x 2.1 x 0.5 mm |
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