SOT133 Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X

DFN4020-14

Contextual Info: Package outline DFN4020-14: plastic extremely thin small outline package; no leads; 14 terminals; body 2 x 4 x 0.5 mm SOT1334-1 X D B A A E A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 C 3 b 6 C A B C v w 8 y1 C y L k 14 9 1 2 Dimensions mm are the original dimensions

Contextual Info: Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad SOT1331-1 E A D X c y exposed die pad side HE Z v A A3 A Dh 38 20 Eh A2 pin 1 index A1 θ Lp 1 L 19 detail X

Contextual Info: Package outline XQFN10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.3 x 1.6 x 0.5 mm B D SOT1337-1 A A terminal 1 index area A1 A3 E detail X e1 C v w b 3 5 C A B C y1 C y L 2 6 1 7 e k terminal 1 index area 10 8 X L1 L2 1

sot133bh3

Contextual Info: Philips Semiconductors Package outlines SOT133BH3 18-pin ceramic dual in-line F package

Contextual Info: Package outline LFBGA217: plastic low profile fine-pitch ball grid array package; 217 balls A B D SOT1339-1 ball A1 index area A A2 E A1 detail X e1 C b e U T R P N M L K J H G F E D C B A ball A1 index area C A B C Øv Øw e e2 1 2 3 4 5 6 7 8 9 11 13 15 17

Contextual Info: Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D SOT1330-1 A E A4 X c HE y v A D2 Z D1 8 14 E1 E2 A2 A A3 pin 1 index θ A1 7 1 Lp L e detail X w bp 14x (12x) 5 mm scale Dimensions (mm are the original mm dimensions)

hx 002

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1337-1 Hx Gx Fx P P 0.05 K 0.02 J D 10x 0.05 0.02 C (6×) Hy Gy Fy P J C1 By Ey Bx1 Bx C2 (3×) Ax Ex occupied area solder resist solder lands solder paste DIMENSIONS in mm

Contextual Info: Package outline LFBGA267: plastic low profile fine-pitch ball grid array package; 267 balls A B D SOT1332-1 ball A1 index area A A2 A1 detail X E C e1 e Y W V U T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 13 15 17 19

Contextual Info: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm D B SOT1335-1 A A Terminal 1 index area E A1 detail X e1 e3 C A B C C b1 e L k v w b A6 y1 C y A9 A5 e3 A10 e e2 Eh A1 A13 A16 Terminal 1

SOT133

Abstract: CDIP-18 philips 23
Contextual Info: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP18: ceramic dual in-line package; 18 leads; glass seal SOT133-1 8.25 max seating plane 23.6 max book, full pagewidth 5.08 max 3.4 2.9 0.51 min 1.27 max 2.54 16x 0.51 0.38 0.254 M 0.32 0.23 0 to 15 o

DFN4020-14

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN4020-14 package SOT1334-1 D1 14x C (12x) Ay solder land occupied area DIMENSIONS in mm P1 P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21

Contextual Info: Package outline SOT1336-1 TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls A B D ball A1 index area A A2 E A1 detail X e1 C 1/2 e e Øv Øw b C A B C y1 C y H G e F E e2 D C 1/2 e B A 1 ball A1 index area 2 3 4 5 6 7 8 X 5 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline HXSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm SOT1338-1 X B D A A E terminal 1 index area A1 c detail X e1 e terminal 1 index area C b 1 C A B C v w 3 y y1 C L Eh k 6 4 Dh 1 2 mm scale

edge-detection* circuit diagram

Abstract: HE4000B HEF4753B HEF4753BD HEF4753BP
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4753B LSI Universal timer module Product specification

HE4000B

Abstract: HEF4737B HEF4737BD HEF4737BP HEF4737V HEF4737VD HEF4737VP co2sa The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4737B HEF4737V LSI Quadruple static decade counters

NX3008NBKMB

Abstract: IP4303CX4 PCMF2DFN1
Contextual Info: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL

Contextual Info: PN512 Full NFC Forum Compliant Solution Rev. 4.4 — 30 July 2013 111344 Product data sheet COMPANY PUBLIC 1. Introduction This document describes the functionality and electrical specifications of the transceiver IC PN512. The PN512 is a highly integrated transceiver IC for contactless communication at

circuit diagram wireless spy camera

Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
Contextual Info: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint

pcd3326cp

Abstract: 3x4 keyboard PCD3321C NT 407 F TRANSISTOR pcd3320cp PCD3327CP pabx systems PCD3321CP keyboard matrix 8 x 18 PCD3320C
Contextual Info: Product specification Philips Semiconductors Pulse dialler circuits with redial PCD332XG family G E N E R A L DESCRIPTIO N The PCD332XC fa m ily comprises seven CMOS pulse d ia lle r circuits w ith redial. Each c irc u it converts 3 x 4 m a trix keyboard entries in to correctly-tim ed line cu rre n t in te rru p tion s. For redial, the last-dialled

TDE8715D

Contextual Info: Preliminary specification Philips Semiconductors Video Producís 8-bit high-speed analog-to-digital converter Mil. temp. TDE8715D FEATURES APPLICATIONS DESCRIPTION • 8 -b it resolution • Sampling rate up to 50 MHz • High signal-to-noise ratio over a

1990- 2335 optocoupler

Abstract: philips 3139 147 tv tuner TDA6101Q equivalent TDA3827 tda6100 ofw g 3201 ica v94 display OFW G 3352 BB515 pj 2309 smd diode
Contextual Info: Philips S em iconductors S em ico n d u cto rs fo r Television and V id eo S ystem s Contents PART A page SELECTION GUIDE Functional index 5 Numerical index 17 Maintainance list 27 GENERAL Quality 31 Pro Electron type numbering system for Discrete Semiconductors

la 4440 amplifier circuit diagram 300 watt

Abstract: la 4440 amplifier circuit diagram 300 watt diode LT 7229 2sd323 YM 7137 3D DA 3807 pdf transistor inverter welder 4 schematic 2N5630 THYRISTOR br 403 1N3492
Contextual Info: Alphanumeric Index Power Transistor Selector Guide Power Transistor Cross Reference Power Transistor Data Sheets Thyristor Selector Guide Thyristor Cross Reference Thyristor Data Sheets Leadforms, Hardware, and Mounting Techniques R ectifier and Zener Diode