SOT113 Search Results

sot1138

Contextual Info: Package outline HSOP4F: plastic, heatsink small outline package; 4 leads flat SOT1138-1 B D A E X c y v HE A D1 D2 e 4 3 E2 E1 A A2 A1 pin 1 index Q1 detail X 1 2 w b B 10 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A A1 3.9 0.2

hxqfn60u

Abstract: SOT1134-1 sot1134
Contextual Info: Package outline HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm B D SOT1134-1 A terminal 1 index area E A A1 detail X e2 e1 1/2 e e C A B C v w L1 D2 D6 A11 B8 B10 A16 D7 A10 L eR

Contextual Info: Package outline HSOP4F: OMP 4 leads flat SOT1138 B D A E C X y E1 HE w A D1 D2 H1 w B e1 E3 A2 E2 Q1 detail X w b B e 5 Dimensions Unit(1) 10 mm scale A2 b c D D1 D2 e e1 E E1 E2 E3 HE H1 Q1 w v 10.01 9.83 8.18 5.89 19.68 12.77 1.6 max 3.86 5.92 0.27 20.62 19.00 16.05

Contextual Info: Package outline BGA420: plastic ball grid array package; 420 balls SOT1136-1 B D D1 A ball A1 index area E1 A E A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape

Contextual Info: Package outline Earless flanged ceramic package; 2 leads SOT1135B D A F 3 D1 D U1 c 1 H U2 E1 2 b w2 D Q 5 10 mm scale Dimensions Unit 1 A max 4.65 nom min 3.76 b c D D1 E E1 F H Q U1 U2 5.26 0.18 9.65 9.65 9.65 9.65 1.14 19.94 1.70 9.91 9.91 5.00 0.10 9.40 9.40 9.40 9.40 0.89

Contextual Info: Package outline BGA582: plastic ball grid array package; 582 balls SOT1139-1 B D J1 A ball A1 index area J2 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y1 C y e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 23 25

tsop44 footprint

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TSOP44 package SOT1131-1 Hx Gx 0.125 P2 Hy Gy By Ay C X D2 (4x) P1 D1 solder paste deposit solder land plus solder paste occupied area detail X DIMENSIONS in mm P1 P2 Ay By C D1 D2

Contextual Info: SOT1133-1 HXQFN60 U ; Reel dry pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,515 or Z Ordering code (12NC) ending 515 Rev. 1 — 3 May 2013 Packing information 1. Packing method 0DQXIDFWXUHUEDJLQIR 7DSH %DJ 'U\DJHQW SUHSULQWHG

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder land solder paste deposit 125 mm stencil solder land plus solder paste occupied area solder resist

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXQFN60U package SOT1134-1 4.1 2.5 1 0.5 0.585 4x 0.25 0.56 (4×) 0.525 (4×) 4.5 3.6 0.25 3 6.1 0.33 (24×) 0.0375 0.0375 1.6 0.775 (4×) 0.33 (24×) 0.45 (36×) 0.275 (36×) solder land

HXQFN60

Contextual Info: <Package outline> HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals; body 4 x 6 x 0.5 mm A B D SOT1134-2 terminal 1 index area A E A2 A1 detail X e2 b e1 e C A B C v w L1 D2 D6 L B8 eT C eT B10 y y1 C D3

Contextual Info: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT1135A D A F D1 U1 B q C c 1 H p U2 E1 w1 3 E B A A 2 b w2 C 5 mm 10 mm scale Dimensions Unit 1 Q A max 4.65 nom min 3.76 b 5.26 c D D1 E E1 F 0.18 9.65 9.65 9.65 9.65 1.14 H p Q 19.94 3.30

Contextual Info: SOT1134-1 Standard product orientation 12NC ending 518 Rev. 01 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1134-1 518

Contextual Info: Package outline Flanged ceramic package; 2 mounting holes; 4 leads SOT1130A D A F D1 L U1 B q C c 1 H U2 E1 p E 3 w1 A 4 2 b b1 C Q 5 10 mm scale Dimensions mm B 5 w2 Unit 1 A A max 4.65 nom min 3.76 b b1 1.14 5.26 c D D1 E E1 F H L 0.18 9.65 9.65 9.65 9.65 1.14 17.12 3.00

rf power transistors

Abstract: SOT539A SOT113 SOT1130A SOT1121A SOT922-1 SOT1135A sot1244c SOT1110B
Contextual Info: Ceramic packages for RF Power Transistors 1 SOT467B SOT467C SOT1135B SOT1135C SOT1130A SOT1130B SOT1135A SOT1135D SOT1120A SOT1120B SOT1121A SOT1121B SOT1121C SOT1121D SOT1112A SOT1112B Ceramic packages for RF Power Transistors (2) SOT1110A SOT1110B SOT1117A

Contextual Info: UNISONIC TECHNOLOGIES CO., LTD MMBT1815 NPN EPITAXIAL SILICON TRANSISTOR AUDIO FREQUENCY AMPLIFIER HIGH FREQUENCY OSC NPN TRANSISTOR „ FEATURES *Collector-Emitter Voltage: BVCEO=-50V *Collector current up to 150mA *High hFE linearity *Complement to MMBT1015

MARKING A4 transistor

Abstract: A4Y SOT23 sot-23 marking 113 sot323 transistor marking MMBT1015G UTC MMBT1015 MMBT1015 MMBT1815 free transistor transistor a4y
Contextual Info: UNISONIC TECHNOLOGIES CO., LTD MMBT1015 PNP SILICON TRANSISTOR LOW FREQUENCY PNP AMPLIFIER TRANSISTOR „ * * * * FEATURES Collector-Emitter Voltage: BVCEO=-50V Collector current up to 150mA High hFE linearity Complement to MMBT1815 Lead-free: MMBT1015L Halogen-free: MMBT1015G

Contextual Info: 74AVC16T245 16-bit dual supply translating transceiver with configurable voltage translation; 3-state Rev. 02 — 30 March 2010 Product data sheet 1. General description The 74AVC16T245 is a 16-bit transceiver with bidirectional level voltage translation and

transistor j449

Abstract: SOT113 JESD625-A 001aam267
Contextual Info: BLL6H0514L-130; BLL6H0514LS-130 LDMOS driver transistor Rev. 2 — 13 September 2010 Product data sheet 1. Product profile 1.1 General description 130 W LDMOS transistor intended for pulsed applications in the 0.5 GHz to 1.4 GHz range. Table 1. Application information

Contextual Info: 74AVCH16T245 16-bit dual supply translating transceiver with configurable voltage translation; 3-state Rev. 02 — 29 March 2010 Product data sheet 1. General description The 74AVCH16T245 is a 16-bit transceiver with bidirectional level voltage translation and

diode marking j35

Contextual Info: UNISONIC TECHNOLOGIES CO., LTD K1109 N-CHANNEL JFET N-CHANNEL JFET FOR ELECTRET CONDENSER MICROPHONE „ DESCRIPTION The UTC K1109 is N-channel JFET for electrets condenser microphone. „ FEATURES * High GM Implies Low Transfer loss * Built-In Gate-Source Diode and Resistor Implies Fast Power on

Contextual Info: 74LVC16244A; 74LVCH16244A 16-bit buffer/line driver; 5 V input/output tolerant; 3-state Rev. 10 — 21 June 2011 Product data sheet 1. General description The 74LVC16244A; 74LVCH16244A are 16-bit non-inverting buffer/line drivers with 3-state bus compatible outputs. The device can be used as four 4-bit buffers, two 8-bit

TSSOP56

Contextual Info: 74AVC20T245 20-bit dual supply translating transceiver with configurable voltage translation; 3-state Rev. 4 — 24 November 2010 Product data sheet 1. General description The 74AVC20T245 is a 20-bit, dual supply transceiver that enables bi-directional voltage

Contextual Info: Enabling the Mobile Experience High Performance RF for wireless infrastructure Unleash the performance of your RF and microwave designs www.nxp.com/unleash-rf Enabling the Mobile Experience The future is mobile. And mobility means the freedom to innovate, communicate, connect and win.