SOT108 Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: SOT1081-1 Product orientation 12NC ending 115 Rev. 02 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1081-1 115 180 x 8

Contextual Info: Package outline HUQFN24U: plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm A B D SOT1080-1 terminal 1 index area E A A1 detail X e1 v w C A B C M M v w b M M C A B C C D2 y y1 C e L1 A6 D3 A10

Contextual Info: 4 SO 1 SOT108-1 SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 8 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

855E

Abstract: MS-012-AB
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

076E06

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON8 package 0.15 8x SOT1089 0.25 (8×) 0.5 (8×) 0.7 1.4 0.6 (8×) Dimensions in mm solder paste = solder land 0.35 (3×) 1.4 solder resist occupied area www.nxp.com 2009 NXP B.V.

Contextual Info: Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT108-2 A X c y HE v M A Z 8 14 A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads 14 terminals; body 3 x 4.5 x 0.85 mm SOT1086-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 7 M M C C A B C y y1 C L Eh 14 8 Dh

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON14 package SOT1086-2 Gx D P C nSPx Hy Gy SPx SPy tot SPy nSPy 1.05 SLy By Ay SPx tot X 3.65 SLx solder land 0.6 solder paste deposit 0.3 solder land plus solder paste detail X occupied area

HEF4052B-Q100

Abstract: 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100
Contextual Info: Automotive Innovative package options Suffix BQ PW D PW BQ PW GW GM SOT763-1 SOT403-1 SOT108-1 SOT402-1 SOT764-1 SOT360-1 SOT363 SOT886 16-pin 16-pin 14-pin 14-pin 20-pin 20-pin 6-pin 6-pin Width mm 2.50 6.40 6.00 6.40 2.50 6.40 2.10 1.00 Length (mm) 3.50

SO14 data sheet

Contextual Info: PDF: 2001 May 30 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT108-2 A X c y HE v M A Z 8 14 A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline LFBGA273: plastic low profile fine-pitch ball grid array package; 273 balls A B D SOT1085-1 ball A1 index area E A A2 A1 detail X e1 C ∅v ∅w b e W V U T R P N M L K J H G F E D C B A ball A1 index area M M C A B C y y1 C e e2 1 2 3 4 5

Contextual Info: Package outline VSON6U: plastic very thin small outline package; no leads; 6 terminals; UTLP based; body 2.3 x 3.5 x 0.90 mm SOT1082-1 A B D E A A1 terminal 1 index area detail X e1 1/2 e e L1 v w b 1 2 3 C C A B C y y1 C L e2 6 5 metal area must not be soldered

SOT108-1

Abstract: NXP 12NC ending
Contextual Info: SOT108-1 Standard product orientation 12NC ending 118 Rev. 01 — 30 June 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT108-1 118 330 x 16.40

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: +9 62 1  SOT1086-2 HVSON14; Reel pack; SMD, 13"; standard product orientation Orderable part number ending, 118 or J Ordering code 12NC ending 118 Rev. 2 — 21 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

SO14 SOT108-1

Abstract: MS-012 Package MS012
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON14 package SOT1086-3 Gx D 0.105 P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HBGA520 package SOT1088-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x

Contextual Info: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm A B D SOT1081-1 E A A1 terminal 1 index area detail X e1 C e L1 v w b 1 5 C A B C M M y1 C y L2 e2 L 10 6 0.5 1 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Philips Semiconductors Product specification Hex inverter TYPE 74ALS04B TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT TOTAL 3.5ns 2.0mA 74ALS04B PIN CONFIGURATION DRAWING NUMBER 14-pin plastic DIP 74ALS04BN SOT27-1 14-pin plastic SO 74ALS04BD SOT108-1