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    SOT108 Price and Stock

    Nexperia 74HC14D,653

    Inverters SOT108-1 INVERTERS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC14D,653 Reel 2,327,500 2,500
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    • 10000 $0.077
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    Nexperia HEF4013BT,653

    Flip Flops SOT108-1 DUAL D-TYPE FLIPFLOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI HEF4013BT,653 Reel 20,000 2,500
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    • 10000 $0.102
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    Nexperia 74HC00D,653

    Logic Gates SOT108-1 QUAD 2-INPUT NAND
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC00D,653 Reel 110,000 2,500
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    • 10000 $0.072
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    Nexperia 74HC08D,653

    Logic Gates SOT108-1 QUAD 2-INPUT AND GT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC08D,653 Reel 35,000 2,500
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    • 10000 $0.082
    		Buy Now

    Nexperia 74HC125D,653

    Buffers & Line Drivers SOT108-1 BUFFERS & LINE DVRS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC125D,653 Reel 82,500 2,500
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    • 10000 $0.071
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    SOT108 Datasheets (21)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1080-1 NXP Semiconductors Plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm Original PDF
    SOT108-1 Philips Semiconductors Original PDF
    SOT1081-1 NXP Semiconductors Footprint for reflow soldering SOT1081-1 Original PDF
    SOT1081-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm Original PDF
    SOT1081-1_115 NXP Semiconductors Product orientation 12NC ending 115 Original PDF
    SOT108-1_118 NXP Semiconductors SO14; Reel pack; SMD, 13"Q1/T1 Standard product orientation Orderable part number ending ,1 Original PDF
    SOT1081-2 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT108-2 NXP Semiconductors Plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm Original PDF
    SOT1082-1 NXP Semiconductors Plastic very thin small outline package; no leads; 6 terminals; UTLP based Original PDF
    SOT1085-1 NXP Semiconductors Footprint for reflow soldering SOT1085-1 Original PDF
    SOT1085-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 273 balls Original PDF
    SOT1086-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm Original PDF
    SOT1086-2 NXP Semiconductors Plastic, thermal enhanced very thin small outline package; no leads; 14 terminals Original PDF
    SOT1086-2 NXP Semiconductors Footprint for reflow soldering SOT1086-2 Original PDF
    SOT1086-2_118 NXP Semiconductors HVSON14; reel pack; SMD; 13"; Standard product orientation; Orderable part number ending, 118 or J; Orderable code (12NC) ending 118 Original PDF
    SOT1086-3 NXP Semiconductors Footprint for reflow soldering SOT1086-3 Original PDF
    SOT1087-1 NXP Semiconductors Footprint for reflow soldering SOT1087-1 Original PDF
    SOT1088-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 520 balls; heatsink Original PDF
    SOT1088-1 NXP Semiconductors Footprint for reflow soldering SOT1088-1 Original PDF
    SOT1089 NXP Semiconductors Footprint for reflow soldering SOT1089 Original PDF