SOLDERABILITY TESTS Search Results

CuCrSiTi

Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Contextual Info: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds

Solderability Tests

Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Contextual Info: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free

alcohol isopropylic

Contextual Info: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient

Contextual Info: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process

WIRE JUMPER

Contextual Info: 2306 101 90. Vishay BCcomponents Wire Jumper FEATURES ∑ Available in two diameters. ∑ Excellent solderability characteristics. ∑ Different types of packaging and taping configurations available. APPLICATIONS ∑ General industrial applications. ∑ General equipments.

Contextual Info: Testing and termination types Tests conducted during batch manufacture Technical Summary Syfer reliability SM product group Standard SM capacitors IECQ-CECC / MIL grade AEC-Q200 S space grade High Rel S05 S02A Solderability l l l l l Resistance to soldering heat

Trichloroethane

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.

41450

Contextual Info: TESTS Carbon Potentiometer Specifications TESTS Resistance to soldering heat Solderability Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) < ±1% < ± 2% TEST METHOD (DIN STD 41450) a) Subject component to a temperature of 55º C and 20% RH for

WIRE0580000000A500

Abstract: 12NC ordering code vishay RESISTOR AMMO PACKING
Contextual Info: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.

STATEK

Contextual Info: TECHNICAL NOTE 27 Soldering Considerations for Statek Leaded Crystals Statek’s CX-1 and CX-2 leaded miniature crystals pass most standard solderability tests, such as those described in MIL-STD-883 and MILSTD-202 i.e., 240ºC to 260ºC Solder Dip Pot without adverse electrical

WIRE JUMPER

Contextual Info: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes

Contextual Info: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes

Contextual Info: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes

TMK105CH

Abstract: 104Z capacitor M05 SMD 131-GW CODE PJ 62-00 m1-0620 821GQ smd m0.5
Contextual Info: Pd ELECTRODE MULTILAYER CERAMIC CAPACITORS CLASS1 : TEMPERATURE COMPENSATING DIELECTRIC TYPE OPERATING TEMP. K55VJ125C FEATURES YNickel barrier end terminations to improve solderability. YMultilayer block structure provides higher reliability YA wide range of capacitance values available in standard case sizes.

JRC-23FHS

Abstract: JRC-23F E158859 IEC255 relay 24VDC JRC 7200 IEC255-5 IEC255-7 relay 24VDC, IEC255 JRC23FHS IEC255-19-1
Contextual Info: JRC-23F JRC-23F Operation condition Insulation Resistance Dielectric Strength Between contacts Between contact and coil 1000M 50Hz 400V 50Hz 1000V Item 6 of IEC255-5 Item 6 of IEC255-5 Shock resistance Vibration resistance Terminals strength Solderability

F0402FA0500V024T

Abstract: E232 F0402FA0750V024T F0402FA1000V024T F0402FA1500V024T F0402FA2000V024T V024 0603FA 4532 fuse EIAJ1005
Contextual Info: Rev. Jun. 09 SolidMatrix 0402 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability

alcohol isopropylic

Abstract: piher 10 k 41450
Contextual Info: Carbon Potentiometer Specifications TESTS Resistance to soldering heat Solderability Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) < ±1% < ± 2% 95% of treated surface covered with solder TEST METHOD (DIN STD 41450) a) Subject component to a temperature of 55º C and 20% RH for

Microspire transformer

Contextual Info: CCM Technology • • • • • • • Applied standards : MIL-STD202, ECSS-Q-70, D0-160D, Pick and place compatible Materials meet UL94-V0 rating Temperature range : -55°C – + 125°C ROHS by default, non ROHS upon request Meets solderability tests per MIL-STD 202-Method 208

F0603FA

Abstract: F0603FA3000V032T F0603FA1500V032T F0603FA1000V032T F0603FA2000V032T F0603FA2500V032T F0603FA0750V032T F0603FA4000V032T F0603FA1000 F0603FA0500V032T
Contextual Info: Rev. Jun. 09 SolidMatrix 0603 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability

EIA-96

Abstract: ACR0603 CR0603 CR0805 CR1206
Contextual Info: Products number on the back cover. Features • ■ ■ ■ Very high quality and stability Power rating at 70°C: CR0603 - 0.10W, CR0805 - 0.125W, CR1206 - 0.25W Three layer contacting process with nickel barrier prevents leaching and provides excellent solderability

sn-pb-ag solder paste

Abstract: 62Sn36Pb2Ag IPC-A-610C
Contextual Info: Application Report SZZA035 - October 2002 Board-Mount Evaluation of Tin-Plated Component Leads Douglas W. Romm, Donald C. Abbott, Bernhard Lange, and Muhammad Khan Standard Linear & Logic ABSTRACT The solderability performance of tin Sn -plated integrated circuit (IC) component leads is

MIL-R-55342D

Abstract: MIL-R-55342-D RS-396 E-48 Multiplier Code RS 396 CR0603 CR0805 CR1206 CR1206 array 103M 500v
Contextual Info: Features • ■ ■ ■ Very high quality and stability Power rating at 70°C: CR0603 - 0.10W, CR0805 - 0.125W, CR1206 - 0.25W Three layer contacting process with nickel barrier prevents leaching and provides excellent solderability ■ ■ Tight tolerances of bottom electrode

Contextual Info: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Different types of packaging and taping configurations available • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free