SOLDERABILITY TEST Search Results

CuCrSiTi

Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Contextual Info: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds

Solderability Tests

Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Contextual Info: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free

Solderability

Abstract: EIA-198-2-E EIA-198 EIA-198-2E
Contextual Info: 6/3/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com COMPONENT SOLDERABILITY PRODUCTS: SMT CERAMIC CHIP CAPACITORS & ARRAYS SERIES: NMC / NMC-E / NMC-L / NMC-H / NCA SOLDERABILITY SPECIFICATION >95% Coverage of terminal finish by new solder coat

Sn63Pb

Abstract: flux
Contextual Info: Point of note about solderability of lead free products attach “G” to package name Test Test condition Note Use of Sn-63Pb solder Bath Pass: Solder bath temperature = 230°C, Dipping time = 5 seconds solderability rate until forming The number of times = one, Use of R-type flux

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

Kester 182

Contextual Info: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

208H

Abstract: VE1000
Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0

Contextual Info: 1. M echanical D im ensions: 1.28 Max A 2. Sch em atic: 3. E lectrical Specification s: 25°C OCL: 47uH ±20% I.O K H z 1.0V, OAdc OCL: 23.7uH±20% ®1KHz 1.0V, 11.8Adc DCR: 0.012 Ohms Max Notes: 1. Solderability: Leads shall meet M IL-STD -202, Method 208D for solderability.

208H

Contextual Info: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%

MSQ1040

Abstract: 330UH SMD 330uH
Contextual Info: MINIATURE SQUARE SHIELDED SMD POWER INDUCTORS SERIES MSQ1040 FEATURES - 100% ferrite shielded. Very high current handling capacity. - Excellent solderability. High heat resistance. Low price ELECTRICAL SPECIFICATIONS - Inductance range - Test conditions 1.5uH -7uH

CviLux CONNECTOR

Abstract: 21/CviLux CONNECTOR
Contextual Info: FFC/FPC CONNECTORS CviLux CF SYSTEM CF Technical Specifications Testing Methods of Electronic Connectors Follow Below Military Standards: Dielectric Withstanding Voltage Contact Resistance Insulation Resistance Solderability - Per MIL-STD-1344A method 3001.1

RJ11 jack dimension

Abstract: RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45
Contextual Info: Series Z Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability

Contextual Info: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal

Contextual Info: Z Series Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability

W-S-6536

Abstract: WS6536 MIL-M38510 lead finish WS-6536
Contextual Info: Signetics SOW-2000 Solderability Acceptance Testing Statement of Work Military Products Reference Guide FEATURES • Complies with MIL-STD-2000 solderabllity requirements • Complies with WS6536E/I solderabllity requirements • Maximizes component “Shelf

P1B14

Contextual Info: 2 1. M echanical Dim ensions: . Schem atic: XFMRS ► P YYWW O D 0 .1 2 5 Min Hi— pot: 0O.O2D±D.OO5 G » 0 .1 0 0 o o o o o o - 1 8 16 9 O D O O O D O o O - N o te s: 1. Solderability: Leads shall meet MIL— STD-Z0Z, Method 2 OSD fo r solderability.

Trichloroethane

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.

UMB01P050

Contextual Info: Industrial Microphotonics Company Unmounted 50W Pulsed Laser Diode Bar Part Number: UMB01P050 2.00 50.00 Optical Power W Electrical to Optical Efficiency (%) 40.00 Excellent Solderability Lot Tested Also Available from 915nm-980nm 1.50 30.00 1.00 20.00 0.50

alcohol isopropylic

Contextual Info: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient

Contextual Info: IMC-0402-01 Vishay Dale Wirewound, Surface Mount Inductors FEATURES • Excellent solderability soldering heat and resistance to • Suitable for reflow soldering STANDARD ELECTRICAL SPECIFICATIONS • High reliability and easy surface mount assembly TEST

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.

posistor

Abstract: H60A
Contextual Info: Item Continuous Operating Temperature Resistance R25 Withstanding Voltage Tensil Strength of Lead Wire Terminal Bending Strength of Lead Wire Terminal Solderability Terminal Durability of Soldering Humidity Test Load Cycle Test at High Temperature Method of examination

Contextual Info: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process