SOLDERABILITY TEST Search Results

Solderability

Abstract: EIA-198-2-E EIA-198 EIA-198-2E
Contextual Info: 6/3/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com COMPONENT SOLDERABILITY PRODUCTS: SMT CERAMIC CHIP CAPACITORS & ARRAYS SERIES: NMC / NMC-E / NMC-L / NMC-H / NCA SOLDERABILITY SPECIFICATION >95% Coverage of terminal finish by new solder coat

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

Kester 182

Contextual Info: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

208H

Abstract: VE1000
Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0

Contextual Info: 1. M echanical D im ensions: 1.28 Max A 2. Sch em atic: 3. E lectrical Specification s: 25°C OCL: 47uH ±20% I.O K H z 1.0V, OAdc OCL: 23.7uH±20% ®1KHz 1.0V, 11.8Adc DCR: 0.012 Ohms Max Notes: 1. Solderability: Leads shall meet M IL-STD -202, Method 208D for solderability.

208H

Contextual Info: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%

RJ11 jack dimension

Abstract: RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45
Contextual Info: Series Z Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability

Contextual Info: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal

P1B14

Contextual Info: 2 1. M echanical Dim ensions: . Schem atic: XFMRS ► P YYWW O D 0 .1 2 5 Min Hi— pot: 0O.O2D±D.OO5 G » 0 .1 0 0 o o o o o o - 1 8 16 9 O D O O O D O o O - N o te s: 1. Solderability: Leads shall meet MIL— STD-Z0Z, Method 2 OSD fo r solderability.

Trichloroethane

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.

UMB01P050

Contextual Info: Industrial Microphotonics Company Unmounted 50W Pulsed Laser Diode Bar Part Number: UMB01P050 2.00 50.00 Optical Power W Electrical to Optical Efficiency (%) 40.00 Excellent Solderability Lot Tested Also Available from 915nm-980nm 1.50 30.00 1.00 20.00 0.50

Contextual Info: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.

Contextual Info: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process

IC 358 smd

Abstract: MC14069UB MC74HC04
Contextual Info: MHz Band Ceramic Resonators SMD PBRC-H Series FEATURES • • • • Excellent frequency stability Low profile Reflow solderable Excellent solderability (Nickel barrier + Au flash termination) APPLICATIONS • • • • • TEST CIRCUIT Vdd = 5.0V 14

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS FAIL PERCENTAGE Pressure Pot 200 19 200 121°, 15 PSIG 0.00 Solderability 45 135 883 M2003 0.00

mc14069ub

Abstract: mc14069ub motorola
Contextual Info: MHz Band Ceramic Resonators SMD PBRC-G Series FEATURES • • • • Excellent frequency stability Low profile Reflow solderable Excellent solderability (Nickel barrier + Au flash termination) APPLICATIONS • • • • • TEST CIRCUIT Vdd =5.0V Car Accessories

Panasonic ecu series capacitor

Abstract: 2A683K i02j ECU-S1J104KBB ECU-S1J105MEB ECU panasonic ECU-S2A473KBB ecu-s1j103kba ECUS2A224KBB ECUS1J102JCB
Contextual Info: Ceramic Multilayer Radial Leaded Capacitor ECU Series Leaded Features High Volumetric Efficiency Packaged for Automatic Insertion Excellent Stability Excellent Solderability Excellent Moisture Resistance Specifications Item X7R NPO/COG Operating Temperature Range

UMB01C020

Abstract: australia heat sink 915nm-980nm
Contextual Info: Industrial Microphotonics Company Unmounted 20W CW Laser Diode Bar Part Number: UMB01C020 45.00 CW UNMOUNTED BARS 2.50 Excellent Solderability Lot Tested Also Available from 915nm-980nm 2.00 35.00 30.00 1.50 25.00 20.00 1.00 15.00 10.00 Voltage V Optical Power (W)

Contextual Info: Test and Reliability Data Environmental Data MECHANICAL Test Number Test Methods Requirement 1 Solderability After steam aging, immerse in the solder H63A of 230 ±5° for 3 ±0.5 seconds. Approximately 95% of the terminal should be covered with new solder.

KXPA4

Abstract: KXPA4-1050 KXPA4-2050
Contextual Info: KXPA4 Series Accelerometers and Inclinometers FEATURES MARKETS APPLICATIONS Small Package - 5x5x1.2mm DFN Hard Disk Drives/Laptops Lead-free Solderability Free-fall Detection Multiplexed Analog Output Cell Phones and Handheld PDAs High Shock Survivability

Contextual Info: Chip Inductor; CIL Series General Type Feature •Magnetic shielding eliminates crosstalk, thus permitting higher mounting density. •Excellent solderability and high heat resistance for either flow or reflow soldering. •Monolithic structure for high reliability.

Contextual Info: MIL PROCESSING GROUP B TEST PLAN FOR DLZ SERIES – H2 VERSIONS Unidirectional TEST CONDITION MIL-STD-750 TEST METHOD SUBGROUP1 Solderability 2026 Resistance to Solvents 1022 SUBGROUP 2 Temp Cycle 10 cylces, 15 minutes @ min/max rated temperatures 1051 Fine Leak

Contextual Info: 【MC Series】 Multilayer Ceramic Chip Capacitor •Features －Wide capacitance range, extremely compost size －Low inductance of capacitor for high frequency application －Excellent solderability and resistance to soldering heat, suitable for flow and